TW200736373A - Polishing pad - Google Patents

Polishing pad

Info

Publication number
TW200736373A
TW200736373A TW096100913A TW96100913A TW200736373A TW 200736373 A TW200736373 A TW 200736373A TW 096100913 A TW096100913 A TW 096100913A TW 96100913 A TW96100913 A TW 96100913A TW 200736373 A TW200736373 A TW 200736373A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
polyurethane resin
resin foam
isocyanate
Prior art date
Application number
TW096100913A
Other languages
English (en)
Chinese (zh)
Other versions
TWI352735B (enExample
Inventor
Takeshi Fukuda
Junji Hirose
Masato Doura
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of TW200736373A publication Critical patent/TW200736373A/zh
Application granted granted Critical
Publication of TWI352735B publication Critical patent/TWI352735B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/61—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2101/00—Manufacture of cellular products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0025—Foam properties rigid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW096100913A 2006-01-10 2007-01-10 Polishing pad TW200736373A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006002608 2006-01-10
JP2006006210A JP5031236B2 (ja) 2006-01-10 2006-01-13 研磨パッド

Publications (2)

Publication Number Publication Date
TW200736373A true TW200736373A (en) 2007-10-01
TWI352735B TWI352735B (enExample) 2011-11-21

Family

ID=38256254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096100913A TW200736373A (en) 2006-01-10 2007-01-10 Polishing pad

Country Status (5)

Country Link
US (1) US8094456B2 (enExample)
JP (1) JP5031236B2 (enExample)
MY (1) MY149939A (enExample)
TW (1) TW200736373A (enExample)
WO (1) WO2007080848A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100909605B1 (ko) * 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
KR101134058B1 (ko) * 2005-05-17 2012-04-16 도요 고무 고교 가부시키가이샤 연마 패드
SG162794A1 (en) * 2005-07-15 2010-07-29 Toyo Tire & Rubber Co Layered sheets and processes for producing the same
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
WO2008026451A1 (fr) 2006-08-28 2008-03-06 Toyo Tire & Rubber Co., Ltd. Tampon de polissage
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5230227B2 (ja) * 2008-03-10 2013-07-10 東洋ゴム工業株式会社 研磨パッド
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
JP5306677B2 (ja) * 2008-03-13 2013-10-02 東洋ゴム工業株式会社 研磨パッド
JP5945874B2 (ja) * 2011-10-18 2016-07-05 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US20140342641A1 (en) * 2011-12-16 2014-11-20 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP6222930B2 (ja) * 2013-01-15 2017-11-01 東洋ゴム工業株式会社 センサ
JP2016058724A (ja) * 2014-09-11 2016-04-21 株式会社荏原製作所 処理モジュール、処理装置、及び、処理方法

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JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
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Also Published As

Publication number Publication date
MY149939A (en) 2013-11-15
US8094456B2 (en) 2012-01-10
US20090047872A1 (en) 2009-02-19
JP5031236B2 (ja) 2012-09-19
JP2007214151A (ja) 2007-08-23
WO2007080848A1 (ja) 2007-07-19
TWI352735B (enExample) 2011-11-21

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