DE69937355D1 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
DE69937355D1
DE69937355D1 DE69937355T DE69937355T DE69937355D1 DE 69937355 D1 DE69937355 D1 DE 69937355D1 DE 69937355 T DE69937355 T DE 69937355T DE 69937355 T DE69937355 T DE 69937355T DE 69937355 D1 DE69937355 D1 DE 69937355D1
Authority
DE
Germany
Prior art keywords
readily occur
present
polishing
polishing pad
polishing rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937355T
Other languages
English (en)
Other versions
DE69937355T2 (de
Inventor
Kuniyasu Shiro
Kazuhiko Hashisaka
Tetsuo Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of DE69937355D1 publication Critical patent/DE69937355D1/de
Application granted granted Critical
Publication of DE69937355T2 publication Critical patent/DE69937355T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE69937355T 1998-08-28 1999-08-25 Polierkissen Expired - Lifetime DE69937355T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24289998 1998-08-28
JP24289998 1998-08-28
PCT/JP1999/004584 WO2000012262A1 (fr) 1998-08-28 1999-08-25 Tampon polisseur

Publications (2)

Publication Number Publication Date
DE69937355D1 true DE69937355D1 (de) 2007-11-29
DE69937355T2 DE69937355T2 (de) 2008-07-24

Family

ID=17095882

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937355T Expired - Lifetime DE69937355T2 (de) 1998-08-28 1999-08-25 Polierkissen

Country Status (9)

Country Link
US (1) US6705934B1 (de)
EP (1) EP1108500B1 (de)
JP (1) JP3685064B2 (de)
KR (1) KR100574311B1 (de)
CN (1) CN1158165C (de)
AT (1) ATE375847T1 (de)
DE (1) DE69937355T2 (de)
TW (1) TW543110B (de)
WO (1) WO2000012262A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG131737A1 (en) 2001-03-28 2007-05-28 Disco Corp Polishing tool and polishing method and apparatus using same
KR100877389B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
JP2004337992A (ja) * 2003-05-13 2004-12-02 Disco Abrasive Syst Ltd 固定砥粒研磨パッド，及び固定砥粒研磨パッドを使用したシリコンウェハの研磨方法
JP2004043797A (ja) * 2003-05-27 2004-02-12 Toyobo Co Ltd 研磨パッド用空洞含有ウレタン成形物、研磨シート及び研磨パッド
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050153634A1 (en) * 2004-01-09 2005-07-14 Cabot Microelectronics Corporation Negative poisson's ratio material-containing CMP polishing pad
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275856B2 (en) * 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060154579A1 (en) * 2005-01-12 2006-07-13 Psiloquest Thermoplastic chemical mechanical polishing pad and method of manufacture
KR100709392B1 (ko) * 2005-07-20 2007-04-20 에스케이씨 주식회사 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드
CN102672630B (zh) * 2006-04-19 2015-03-18 东洋橡胶工业株式会社 抛光垫的制造方法
US8314192B2 (en) * 2006-07-28 2012-11-20 Toray Industries, Inc. Interpenetrating polymer network structure and polishing pad, and process for producing the same
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US20090094900A1 (en) * 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP4897082B2 (ja) 2008-04-25 2012-03-14 トーヨーポリマー株式会社 ポリウレタン発泡体及び研磨パッド
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
US9056382B2 (en) * 2009-05-27 2015-06-16 Rogers Corporation Polishing pad, composition for the manufacture thereof, and method of making and using
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
TWI565735B (zh) * 2015-08-17 2017-01-11 Nanya Plastics Corp A polishing pad for surface planarization processing and a process for making the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176275A (ja) 1984-09-21 1986-04-18 Dainippon Ink & Chem Inc 研磨材用ポリウレタンエラストマ−
JPH0288229A (ja) 1988-09-26 1990-03-28 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
EP0521102B1 (de) 1990-03-22 1995-06-14 Westech Systems, Inc. Vorrichtung zum zwischenschichtplanieren von halbleitern
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
JPH06220151A (ja) 1993-01-22 1994-08-09 Sanyo Chem Ind Ltd 研磨材用ポリウレタン樹脂
JP2900777B2 (ja) 1993-12-14 1999-06-02 信越半導体株式会社 研磨部材およびウエーハ研磨装置
JPH07297195A (ja) 1994-04-27 1995-11-10 Speedfam Co Ltd 半導体装置の平坦化方法及び平坦化装置
WO1995030711A1 (fr) * 1994-05-10 1995-11-16 Asahi Kasei Kogyo Kabushiki Kaisha Mousse de fluororesine et procede de production de ladite mousse
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
WO1996015887A1 (en) * 1994-11-23 1996-05-30 Rodel, Inc. Polishing pads and methods for their manufacture
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto

Also Published As

Publication number Publication date
WO2000012262A1 (fr) 2000-03-09
EP1108500A1 (de) 2001-06-20
ATE375847T1 (de) 2007-11-15
CN1315898A (zh) 2001-10-03
JP3685064B2 (ja) 2005-08-17
KR20010073039A (ko) 2001-07-31
DE69937355T2 (de) 2008-07-24
EP1108500B1 (de) 2007-10-17
US6705934B1 (en) 2004-03-16
TW543110B (en) 2003-07-21
KR100574311B1 (ko) 2006-04-27
CN1158165C (zh) 2004-07-21
EP1108500A4 (de) 2002-08-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition