KR970064825A - 연마용 마운팅재 - Google Patents
연마용 마운팅재 Download PDFInfo
- Publication number
- KR970064825A KR970064825A KR1019970007184A KR19970007184A KR970064825A KR 970064825 A KR970064825 A KR 970064825A KR 1019970007184 A KR1019970007184 A KR 1019970007184A KR 19970007184 A KR19970007184 A KR 19970007184A KR 970064825 A KR970064825 A KR 970064825A
- Authority
- KR
- South Korea
- Prior art keywords
- mounting material
- template
- polishing
- structural sheet
- porous structural
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/921—Pad for lens shaping tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
반도체기판이나 유리기판 등을 정밀 연마하는데 사용되는 마운팅재는, 연속다공구조시이트와 템플레이트와의 조합인 점에서, 템플레이트의 교체에 의한 가동률의 저하가, 생산비용의 상승의 요인으로 되고, 또 연마 공작물은 템플레이트에 접촉하여 에지부분에 홈이 발생하며, 불량품의 발생의 원인으로 되어 있었다. 연속다공구조시이트의 적어도 표피층으로 발수성으로 부여한 연마용 마운팅재로하므로서, 템플레이트 없이 정밀 연마를 가능하게 하였다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시예로서, 연마용 마운팅재를 사용한 연마설비의 정면도.
Claims (3)
- 정반에 설치되는 연마용마운팅재로서, 치밀한 다공구조로 된 표피층을 보유하는 수지제의 연속 다공구조 시이트로 이루어지며, 이 연속다공구조시이트는, 적어도 표피층에 발수성을 부여하고 있는 것을 특징으로 하는 연마용 마운팅재.
- 제1항에 있어서, 연속다공정구조시이트가 폴리우레탄 수지에 의하여 제작되어 있는 것을 특징으로 하는 연마용 마운팅재.
- 제1항에 있어서, 불소계 불수제를, 중량비로 1%이상 함유하는 발수제로, 발수성을 부여하고 있는 것을 특징으로 하는 연마용 마운팅재.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9480996A JPH09254027A (ja) | 1996-03-25 | 1996-03-25 | 研磨用マウンテン材 |
JP96-94809 | 1996-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970064825A true KR970064825A (ko) | 1997-10-13 |
Family
ID=14120393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970007184A KR970064825A (ko) | 1996-03-25 | 1997-03-05 | 연마용 마운팅재 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5871393A (ko) |
JP (1) | JPH09254027A (ko) |
KR (1) | KR970064825A (ko) |
TW (1) | TW317521B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6257966B1 (en) * | 1998-04-27 | 2001-07-10 | Tokyo Seimitsu Co., Ltd. | Wafer surface machining apparatus |
US5993293A (en) * | 1998-06-17 | 1999-11-30 | Speedram Corporation | Method and apparatus for improved semiconductor wafer polishing |
JP3697963B2 (ja) * | 1999-08-30 | 2005-09-21 | 富士電機デバイステクノロジー株式会社 | 研磨布および平面研磨加工方法 |
US6439981B1 (en) * | 2000-12-28 | 2002-08-27 | Lsi Logic Corporation | Arrangement and method for polishing a surface of a semiconductor wafer |
US6648743B1 (en) | 2001-09-05 | 2003-11-18 | Lsi Logic Corporation | Chemical mechanical polishing pad |
US6964924B1 (en) | 2001-09-11 | 2005-11-15 | Lsi Logic Corporation | Integrated circuit process monitoring and metrology system |
JP2007243112A (ja) * | 2006-03-13 | 2007-09-20 | Disco Abrasive Syst Ltd | ウェーハの凹状加工方法及び凹凸吸収パッド |
US7316605B1 (en) * | 2006-07-03 | 2008-01-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US7789738B2 (en) * | 2006-07-03 | 2010-09-07 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
US20080064310A1 (en) * | 2006-09-08 | 2008-03-13 | Chung-Chih Feng | Polishing pad having hollow fibers and the method for making the same |
US20080200105A1 (en) * | 2007-02-15 | 2008-08-21 | San Fang Chemical Industry Co., Ltd. | Carrier film for mounting polishing workpiece and method for making the same |
US8087975B2 (en) * | 2007-04-30 | 2012-01-03 | San Fang Chemical Industry Co., Ltd. | Composite sheet for mounting a workpiece and the method for making the same |
US20090252876A1 (en) * | 2007-05-07 | 2009-10-08 | San Fang Chemical Industry Co., Ltd. | Sheet for mounting polishing workpiece and method for making the same |
KR101377538B1 (ko) * | 2009-03-06 | 2014-03-26 | 주식회사 엘지화학 | 유리판 연마 시스템용 하부 유니트 및 이를 이용한 연마 방법 |
JP5388212B2 (ja) * | 2009-03-06 | 2014-01-15 | エルジー・ケム・リミテッド | フロートガラス研磨システム用下部ユニット |
CN102452041B (zh) * | 2010-10-29 | 2014-07-23 | 三芳化学工业股份有限公司 | 吸附垫片及其制造方法 |
TWI590918B (zh) * | 2013-08-16 | 2017-07-11 | 三芳化學工業股份有限公司 | 硏磨墊、硏磨裝置及製造硏磨墊之方法 |
JP6423352B2 (ja) | 2013-09-30 | 2018-11-14 | 富士紡ホールディングス株式会社 | 保持パッド |
CN104339280A (zh) * | 2014-11-13 | 2015-02-11 | 无锡市福吉电子科技有限公司 | 一种抛光盘装置 |
TWI571356B (zh) * | 2016-01-20 | 2017-02-21 | 三芳化學工業股份有限公司 | 可顯色使用壽命終點之吸附墊及其製造方法 |
IT201900006740A1 (it) * | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di strutturazione di substrati |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
JP2655975B2 (ja) * | 1992-09-18 | 1997-09-24 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
JP2616736B2 (ja) * | 1995-01-25 | 1997-06-04 | 日本電気株式会社 | ウエーハ研磨装置 |
US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
JPH08281550A (ja) * | 1995-04-14 | 1996-10-29 | Sony Corp | 研磨装置及びその補正方法 |
US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
-
1996
- 1996-03-25 JP JP9480996A patent/JPH09254027A/ja active Pending
-
1997
- 1997-03-05 KR KR1019970007184A patent/KR970064825A/ko not_active Application Discontinuation
- 1997-03-07 TW TW086102803A patent/TW317521B/zh active
- 1997-03-20 US US08/821,275 patent/US5871393A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5871393A (en) | 1999-02-16 |
JPH09254027A (ja) | 1997-09-30 |
TW317521B (ko) | 1997-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |