TWI351354B - - Google Patents

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Publication number
TWI351354B
TWI351354B TW094113409A TW94113409A TWI351354B TW I351354 B TWI351354 B TW I351354B TW 094113409 A TW094113409 A TW 094113409A TW 94113409 A TW94113409 A TW 94113409A TW I351354 B TWI351354 B TW I351354B
Authority
TW
Taiwan
Prior art keywords
conductive layer
substrate
contact type
data carrier
type data
Prior art date
Application number
TW094113409A
Other languages
English (en)
Chinese (zh)
Other versions
TW200540026A (en
Inventor
Nakanishi Yuki
Sakata Hideto
Igarashi Akihiko
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of TW200540026A publication Critical patent/TW200540026A/zh
Application granted granted Critical
Publication of TWI351354B publication Critical patent/TWI351354B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
TW094113409A 2004-04-28 2005-04-27 Conductive member for non-contact data carrier and manufacturing method and device thereof TW200540026A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004134659 2004-04-28
JP2005058239 2005-03-02
JP2005106822A JP4752307B2 (ja) 2004-04-28 2005-04-01 非接触型データキャリア用導電部材とその製造方法及び装置

Publications (2)

Publication Number Publication Date
TW200540026A TW200540026A (en) 2005-12-16
TWI351354B true TWI351354B (enExample) 2011-11-01

Family

ID=35242084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113409A TW200540026A (en) 2004-04-28 2005-04-27 Conductive member for non-contact data carrier and manufacturing method and device thereof

Country Status (6)

Country Link
US (1) US7930822B2 (enExample)
EP (1) EP1744607A4 (enExample)
JP (1) JP4752307B2 (enExample)
CN (1) CN1985552B (enExample)
TW (1) TW200540026A (enExample)
WO (1) WO2005107347A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4779556B2 (ja) * 2005-10-07 2011-09-28 大日本印刷株式会社 非接触型データキャリア用導電部材の製造方法及び装置
JP2008015969A (ja) * 2006-07-10 2008-01-24 Dainippon Printing Co Ltd 非接触型データキャリア用導電部材の製造方法及び装置
US8162231B2 (en) 2006-11-01 2012-04-24 Dai Nippon Printing Co., Ltd. Noncontact IC tag label and method of manufacturing the same
JP5083091B2 (ja) * 2008-07-24 2012-11-28 大日本印刷株式会社 非接触型データキャリア用導電部材の形成方法及び装置
JP5128676B2 (ja) * 2008-11-14 2013-01-23 凸版印刷株式会社 非接触ｉｃラベルおよび物品
WO2012067225A1 (ja) * 2010-11-19 2012-05-24 凸版印刷株式会社 金属箔パターン積層体、金属箔の型抜き方法、回路基板、その製造方法、および太陽電池モジュール
KR102067846B1 (ko) * 2011-06-06 2020-01-17 디에스엠 아이피 어셋츠 비.브이. 금속박 패턴 적층체, 금속박 적층체, 금속박 적층 기판, 태양 전지 모듈 및 금속박 패턴 적층체의 제조 방법
WO2013019922A2 (en) 2011-08-03 2013-02-07 Graphic Packaging International, Inc. Systems and methods for forming laminates with patterned microwave energy interactive material
DE102012209328A1 (de) * 2012-06-01 2013-12-05 3D-Micromac Ag Verfahren und Anlage zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement
US9380709B2 (en) 2013-03-15 2016-06-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method of cutting conductive patterns
WO2015048000A1 (en) * 2013-09-26 2015-04-02 Graphic Packaging International, Inc. Laminates, and systems and methods for laminating
JP6379667B2 (ja) * 2014-05-21 2018-08-29 Tdk株式会社 アンテナ装置及びその製造方法
WO2016070915A1 (de) * 2014-11-05 2016-05-12 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum beschichten eines produktsubstrats
ES2873874T3 (es) 2014-12-22 2021-11-04 Graphic Packaging Int Llc Sistemas y procedimientos para formar laminados
EP3432224B1 (en) * 2016-03-18 2022-06-29 Sato Holdings Kabushiki Kaisha Method for manufacturing an rfid inlet
CN107482302A (zh) * 2017-07-01 2017-12-15 华中科技大学 一种rfid天线制作方法
CN108566732B (zh) * 2018-05-14 2020-09-01 龙南骏亚柔性智能科技有限公司 一种柔性pcb电子器件褶皱制备结构
WO2020141331A1 (en) * 2019-01-04 2020-07-09 Sherkin Technologies Uk Ltd Improvements in or relating to flexible electronics
US10709022B1 (en) * 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
CN112589913A (zh) * 2021-03-05 2021-04-02 赛柯赛斯新能源科技(苏州)有限公司 柔性电路板圆刀裁切工艺及其加工装置
CN117048173A (zh) * 2023-08-28 2023-11-14 晶科能源股份有限公司 层压机及层压机的层压方法
CN118514411A (zh) * 2024-04-19 2024-08-20 隆基绿能科技股份有限公司 一种光伏背板加工设备及方法

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US3573126A (en) * 1968-06-07 1971-03-30 Gti Corp Methods of manufacturing electrical circuits
US3713944A (en) * 1970-05-28 1973-01-30 Essex International Inc A method of manufacture of printed circuits by die stamping
US4091125A (en) * 1976-11-08 1978-05-23 Delgadillo Joseph A Circuit board and method for producing same
US4682415A (en) * 1985-10-28 1987-07-28 U.S. Product Development Company Method of making printed circuits
ATE440480T1 (de) * 1993-12-30 2009-09-15 Miyake Kk Verbundfolie mit schaltungsfírmiger metallfolie oder dergleichen und verfahren zur herstellung
JP3116209B2 (ja) 1994-12-01 2000-12-11 株式会社三宅 共振タグ等の回路様金属箔シートの製造方法
US5759422A (en) * 1996-02-14 1998-06-02 Fort James Corporation Patterned metal foil laminate and method for making same
JPH10187922A (ja) * 1996-10-23 1998-07-21 Furukawa Electric Co Ltd:The プリペイドカード
US6320556B1 (en) * 2000-01-19 2001-11-20 Moore North America, Inc. RFID foil or film antennas
JP3536977B2 (ja) * 2000-10-24 2004-06-14 ローム株式会社 非接触型ｉｃカード及びその集合体及びその製造方法
JP2002298109A (ja) * 2001-03-30 2002-10-11 Toppan Forms Co Ltd 非接触型ｉｃメディアおよびその製造方法
JP4770065B2 (ja) * 2001-06-06 2011-09-07 大日本印刷株式会社 意匠性の高いｒｆｉｄタグ、およびその製造方法
DE10145749A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht
JP3998975B2 (ja) * 2001-12-28 2007-10-31 大日本印刷株式会社 電磁波遮蔽用シート
FR2841089B1 (fr) * 2002-06-14 2004-07-30 Sequoias Procede de fabrication industrielle, en ligne, d'antennes pour transpondeurs rfid
JP4012019B2 (ja) * 2002-08-30 2007-11-21 大日本印刷株式会社 アンテナ配線パターンの形成方法

Also Published As

Publication number Publication date
CN1985552B (zh) 2012-09-05
EP1744607A4 (en) 2010-10-27
EP1744607A1 (en) 2007-01-17
TW200540026A (en) 2005-12-16
CN1985552A (zh) 2007-06-20
US20070214637A1 (en) 2007-09-20
US7930822B2 (en) 2011-04-26
JP4752307B2 (ja) 2011-08-17
JP2006277700A (ja) 2006-10-12
WO2005107347A1 (ja) 2005-11-10

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MM4A Annulment or lapse of patent due to non-payment of fees