TWI350573B - Semiconductor device package and method for manufacturing same - Google Patents

Semiconductor device package and method for manufacturing same

Info

Publication number
TWI350573B
TWI350573B TW093124401A TW93124401A TWI350573B TW I350573 B TWI350573 B TW I350573B TW 093124401 A TW093124401 A TW 093124401A TW 93124401 A TW93124401 A TW 93124401A TW I350573 B TWI350573 B TW I350573B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
device package
manufacturing same
manufacturing
same
Prior art date
Application number
TW093124401A
Other languages
English (en)
Other versions
TW200520120A (en
Inventor
Shafidul Islam
Daniel Kwok Lau
San Antonio Romarico Santos
Anang Subagio
Michael Hannan Mckerreghan
Edmunda Gut-Omen Litilit
Original Assignee
Advanced Interconnect Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Interconnect Tech Ltd filed Critical Advanced Interconnect Tech Ltd
Publication of TW200520120A publication Critical patent/TW200520120A/zh
Application granted granted Critical
Publication of TWI350573B publication Critical patent/TWI350573B/zh

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Classifications

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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
TW093124401A 2003-08-14 2004-08-13 Semiconductor device package and method for manufacturing same TWI350573B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615907B (zh) * 2014-09-16 2018-02-21 Toshiba Memory Corp 導線接合裝置及半導體裝置

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755179B2 (en) * 2004-12-20 2010-07-13 Semiconductor Components Industries, Llc Semiconductor package structure having enhanced thermal dissipation characteristics
US7439100B2 (en) * 2005-08-18 2008-10-21 Semiconductor Components Industries, L.L.C. Encapsulated chip scale package having flip-chip on lead frame structure and method
US20070063333A1 (en) * 2005-09-20 2007-03-22 Texas Instruments Incorporated Semiconductor package with internal shunt resistor
US8022512B2 (en) 2006-02-28 2011-09-20 Unisem (Mauritus) Holdings Limited No lead package with heat spreader
US7816186B2 (en) * 2006-03-14 2010-10-19 Unisem (Mauritius) Holdings Limited Method for making QFN package with power and ground rings
TWI286375B (en) * 2006-03-24 2007-09-01 Chipmos Technologies Inc Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for fabricating the same
SG139573A1 (en) 2006-07-17 2008-02-29 Micron Technology Inc Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods
JP4533875B2 (ja) * 2006-09-12 2010-09-01 株式会社三井ハイテック 半導体装置およびこの半導体装置に使用するリードフレーム製品並びにこの半導体装置の製造方法
KR100813621B1 (ko) * 2006-10-03 2008-03-17 삼성전자주식회사 적층형 반도체 소자 패키지
US7741704B2 (en) 2006-10-18 2010-06-22 Texas Instruments Incorporated Leadframe and mold compound interlock in packaged semiconductor device
SG149726A1 (en) 2007-07-24 2009-02-27 Micron Technology Inc Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
MY154596A (en) * 2007-07-25 2015-06-30 Carsem M Sdn Bhd Thin plastic leadless package with exposed metal die paddle
SG150396A1 (en) 2007-08-16 2009-03-30 Micron Technology Inc Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods
US8492883B2 (en) 2008-03-14 2013-07-23 Advanced Semiconductor Engineering, Inc. Semiconductor package having a cavity structure
US8017451B2 (en) 2008-04-04 2011-09-13 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) * 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same
US8269324B2 (en) * 2008-07-11 2012-09-18 Stats Chippac Ltd. Integrated circuit package system with chip on lead
US20100044850A1 (en) * 2008-08-21 2010-02-25 Advanced Semiconductor Engineering, Inc. Advanced quad flat non-leaded package structure and manufacturing method thereof
TWI414048B (zh) * 2008-11-07 2013-11-01 Advanpack Solutions Pte Ltd 半導體封裝件與其製造方法
TWI372454B (en) * 2008-12-09 2012-09-11 Advanced Semiconductor Eng Quad flat non-leaded package and manufacturing method thereof
US8124447B2 (en) 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101958300B (zh) * 2010-09-04 2012-05-23 江苏长电科技股份有限公司 双面图形芯片倒装模组封装结构及其封装方法
TW201241970A (en) * 2011-04-08 2012-10-16 Advanced Semiconductor Eng Semiconductor package with recesses in the edged leadas
JP5706254B2 (ja) * 2011-07-05 2015-04-22 株式会社東芝 半導体装置
CN102263081A (zh) * 2011-07-29 2011-11-30 天水华天科技股份有限公司 带双凸点的四边扁平无引脚双ic芯片封装件及其生产方法
CN102254893A (zh) * 2011-07-29 2011-11-23 天水华天科技股份有限公司 一种带双凸点的四边扁平无引脚封装件及其生产方法
CN102263080B (zh) * 2011-07-29 2015-06-17 天水华天科技股份有限公司 带双凸点的四边扁平无引脚三ic芯片封装件及其生产方法
CN102376671A (zh) * 2011-11-29 2012-03-14 杭州矽力杰半导体技术有限公司 引线框架以及应用其的倒装芯片式半导体封装结构
CN102446781B (zh) * 2011-12-08 2014-09-24 华中科技大学 相变存储器芯片的封装方法
CN111508908A (zh) * 2012-09-20 2020-08-07 斯莱戈科技公司 极薄封装
US9142491B2 (en) * 2012-09-28 2015-09-22 Conexant Systems, Inc. Semiconductor package with corner pins
ITMI20130473A1 (it) * 2013-03-28 2014-09-29 St Microelectronics Srl Metodo per fabbricare dispositivi elettronici
US9324642B2 (en) 2013-11-12 2016-04-26 Infineon Technologies Ag Method of electrically isolating shared leads of a lead frame strip
US9437458B2 (en) 2013-11-12 2016-09-06 Infineon Technologies Ag Method of electrically isolating leads of a lead frame strip
US9287238B2 (en) 2013-12-02 2016-03-15 Infineon Technologies Ag Leadless semiconductor package with optical inspection feature
US9570381B2 (en) 2015-04-02 2017-02-14 Advanced Semiconductor Engineering, Inc. Semiconductor packages and related manufacturing methods
US9847281B2 (en) 2015-06-30 2017-12-19 Stmicroelectronics, Inc. Leadframe package with stable extended leads
DE102015224257A1 (de) * 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Elektrische Leiterbahn, Verfahren und Verwendung
CN105789167A (zh) * 2016-03-15 2016-07-20 昂宝电子（上海）有限公司 集成电路芯片封装装置、和引线框架
US9870985B1 (en) * 2016-07-11 2018-01-16 Amkor Technology, Inc. Semiconductor package with clip alignment notch
CN107195612A (zh) * 2017-06-20 2017-09-22 南京矽邦半导体有限公司 一种基于加长半蚀刻拱形内引脚qfn框架及其封装芯片
US11538768B2 (en) * 2019-10-04 2022-12-27 Texas Instruments Incorporated Leadframe with ground pad cantilever
CN113192920A (zh) * 2021-05-21 2021-07-30 南京矽邦半导体有限公司 一种qfn封装的引脚结构
US20230063278A1 (en) * 2021-08-27 2023-03-02 Texas Instruments Incorporated Laser-cut lead-frame for integrated circuit (ic) packages
CN117133746B (zh) * 2023-10-26 2024-01-30 成都电科星拓科技有限公司 用于双面焊接的方形扁平无引脚封装芯片结构及封装方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0348018B1 (en) 1982-03-10 1999-05-19 Hitachi, Ltd. Method of manufacture of a resin encapsulated semiconductor device
JP2852134B2 (ja) * 1991-02-20 1999-01-27 日本電気株式会社 バンプ形成方法
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US6281568B1 (en) * 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
JP3062192B1 (ja) 1999-09-01 2000-07-10 松下電子工業株式会社 リ―ドフレ―ムとそれを用いた樹脂封止型半導体装置の製造方法
JP3450238B2 (ja) 1999-11-04 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
US6238952B1 (en) * 2000-02-29 2001-05-29 Advanced Semiconductor Engineering, Inc. Low-pin-count chip package and manufacturing method thereof
US6452255B1 (en) 2000-03-20 2002-09-17 National Semiconductor, Corp. Low inductance leadless package
KR100559664B1 (ko) * 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) * 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
JP3883784B2 (ja) * 2000-05-24 2007-02-21 三洋電機株式会社 板状体および半導体装置の製造方法
US6838319B1 (en) 2000-08-31 2005-01-04 Micron Technology, Inc. Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
JP2002118222A (ja) 2000-10-10 2002-04-19 Rohm Co Ltd 半導体装置
US6437429B1 (en) 2001-05-11 2002-08-20 Walsin Advanced Electronics Ltd Semiconductor package with metal pads
FR2825515B1 (fr) * 2001-05-31 2003-12-12 St Microelectronics Sa Boitier semi-conducteur a grille evidee et grille evidee
JP2003017646A (ja) * 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置およびその製造方法
US6812552B2 (en) 2002-04-29 2004-11-02 Advanced Interconnect Technologies Limited Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US6940154B2 (en) 2002-06-24 2005-09-06 Asat Limited Integrated circuit package and method of manufacturing the integrated circuit package
US7033517B1 (en) * 2003-09-15 2006-04-25 Asat Ltd. Method of fabricating a leadless plastic chip carrier
US7154186B2 (en) * 2004-03-18 2006-12-26 Fairchild Semiconductor Corporation Multi-flip chip on lead frame on over molded IC package and method of assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI615907B (zh) * 2014-09-16 2018-02-21 Toshiba Memory Corp 導線接合裝置及半導體裝置

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US7563648B2 (en) 2009-07-21
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