TWI346673B - - Google Patents

Info

Publication number
TWI346673B
TWI346673B TW093108944A TW93108944A TWI346673B TW I346673 B TWI346673 B TW I346673B TW 093108944 A TW093108944 A TW 093108944A TW 93108944 A TW93108944 A TW 93108944A TW I346673 B TWI346673 B TW I346673B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
composition
silica filler
resins
hence
Prior art date
Application number
TW093108944A
Other languages
English (en)
Other versions
TW200504134A (en
Inventor
Hidetsugu Motobe
Akinori Hibino
Katsuhiko Itou
Original Assignee
Panasonic Elec Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Elec Works Co Ltd filed Critical Panasonic Elec Works Co Ltd
Publication of TW200504134A publication Critical patent/TW200504134A/zh
Application granted granted Critical
Publication of TWI346673B publication Critical patent/TWI346673B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
TW093108944A 2003-07-22 2004-03-31 Resin composition for printed circuit board, prepreg, laminate, and printed circuit board made with the same TW200504134A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/009258 WO2005007742A1 (ja) 2003-07-22 2003-07-22 印刷配線板用樹脂組成物、プリプレグ、積層板、及びこれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW200504134A TW200504134A (en) 2005-02-01
TWI346673B true TWI346673B (zh) 2011-08-11

Family

ID=34074132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093108944A TW200504134A (en) 2003-07-22 2004-03-31 Resin composition for printed circuit board, prepreg, laminate, and printed circuit board made with the same

Country Status (10)

Country Link
US (1) US7566501B2 (zh)
EP (1) EP1650248B1 (zh)
JP (2) JP4277123B2 (zh)
KR (1) KR100699778B1 (zh)
CN (1) CN100441608C (zh)
AT (1) ATE439389T1 (zh)
AU (1) AU2003252667A1 (zh)
DE (1) DE602004022558D1 (zh)
TW (1) TW200504134A (zh)
WO (2) WO2005007742A1 (zh)

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JP5332608B2 (ja) * 2006-03-03 2013-11-06 住友ベークライト株式会社 中間層材料およびコンポジット積層板
GB2449146B (en) * 2008-01-22 2009-04-22 Gurit Fibre-reinforced composite material and manufacture thereof
CN101578010B (zh) * 2009-06-10 2011-02-16 陕西生益科技有限公司 高相比漏电起痕指数无铅兼容cem-3覆铜板制备方法
TWI494363B (zh) * 2009-09-04 2015-08-01 Iteq Corp An epoxy resin composition and a film and a substrate made of the epoxy resin composition
CN102498163B (zh) * 2009-09-15 2014-07-30 旭化成电子材料株式会社 预浸料坯
KR20110081588A (ko) * 2010-01-08 2011-07-14 삼성전기주식회사 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판
JP5651169B2 (ja) * 2010-04-23 2015-01-07 パナソニック株式会社 エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
JP5587730B2 (ja) * 2010-10-25 2014-09-10 パナソニック株式会社 絶縁樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
TWI418593B (zh) * 2010-11-10 2013-12-11 Iteq Corp 無鹵環氧樹脂組合物及應用該無鹵環氧樹脂組合物所製成之膠片與基板
JP2014109027A (ja) * 2012-12-04 2014-06-12 Hitachi Chemical Co Ltd エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板
KR101341749B1 (ko) * 2013-03-14 2013-12-16 주식회사 한국카본 건축용 내외장재의 제조방법
CN103694644B (zh) * 2013-12-30 2015-11-04 景旺电子科技(龙川)有限公司 一种环氧树脂组合物、金属基覆铜板及其制作方法
US9775239B2 (en) 2014-04-08 2017-09-26 Panasonic Intellectual Property Management Co., Ltd. Resin composition for printed wiring board, prepreg, metal-clad laminate, and printed wiring board
WO2015155982A1 (ja) * 2014-04-08 2015-10-15 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP6604564B2 (ja) * 2014-04-08 2019-11-13 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP6604565B2 (ja) * 2015-02-13 2019-11-13 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板
CN106147132B (zh) * 2015-07-17 2019-09-27 上海国纪电子材料有限公司 树脂组合物及含其的胶液、半固化片与覆铜板及制备方法
JP6664092B2 (ja) * 2015-10-07 2020-03-13 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板及びプリント配線板
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
JP6672953B2 (ja) 2016-03-29 2020-03-25 味の素株式会社 樹脂シート
EP3814398A1 (en) * 2018-06-27 2021-05-05 3M Innovative Properties Company Curable compositions and related methods
JP6767709B2 (ja) * 2019-07-11 2020-10-14 パナソニックＩｐマネジメント株式会社 プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板

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Also Published As

Publication number Publication date
KR20060058776A (ko) 2006-05-30
KR100699778B1 (ko) 2007-03-28
DE602004022558D1 (de) 2009-09-24
WO2005007724A8 (ja) 2005-06-23
US7566501B2 (en) 2009-07-28
CN1826365A (zh) 2006-08-30
TW200504134A (en) 2005-02-01
EP1650248A1 (en) 2006-04-26
CN100441608C (zh) 2008-12-10
AU2003252667A1 (en) 2005-02-04
JP4277123B2 (ja) 2009-06-10
JP2009138201A (ja) 2009-06-25
WO2005007724A1 (ja) 2005-01-27
US20060216495A1 (en) 2006-09-28
ATE439389T1 (de) 2009-08-15
EP1650248B1 (en) 2009-08-12
EP1650248A4 (en) 2007-03-07
WO2005007742A1 (ja) 2005-01-27
JPWO2005007724A1 (ja) 2006-08-31

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