TW200504134A - Resin composition for printed circuit board, prepreg, laminate, and printed circuit board made with the same - Google Patents
Resin composition for printed circuit board, prepreg, laminate, and printed circuit board made with the sameInfo
- Publication number
- TW200504134A TW200504134A TW093108944A TW93108944A TW200504134A TW 200504134 A TW200504134 A TW 200504134A TW 093108944 A TW093108944 A TW 093108944A TW 93108944 A TW93108944 A TW 93108944A TW 200504134 A TW200504134 A TW 200504134A
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit board
- resin composition
- prepreg
- laminate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/009258 WO2005007742A1 (ja) | 2003-07-22 | 2003-07-22 | 印刷配線板用樹脂組成物、プリプレグ、積層板、及びこれを用いたプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504134A true TW200504134A (en) | 2005-02-01 |
TWI346673B TWI346673B (zh) | 2011-08-11 |
Family
ID=34074132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093108944A TW200504134A (en) | 2003-07-22 | 2004-03-31 | Resin composition for printed circuit board, prepreg, laminate, and printed circuit board made with the same |
Country Status (10)
Country | Link |
---|---|
US (1) | US7566501B2 (zh) |
EP (1) | EP1650248B1 (zh) |
JP (2) | JP4277123B2 (zh) |
KR (1) | KR100699778B1 (zh) |
CN (1) | CN100441608C (zh) |
AT (1) | ATE439389T1 (zh) |
AU (1) | AU2003252667A1 (zh) |
DE (1) | DE602004022558D1 (zh) |
TW (1) | TW200504134A (zh) |
WO (2) | WO2005007742A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112006002475T5 (de) * | 2005-09-15 | 2008-07-24 | Sekisui Chemical Co., Ltd. | Harzzusammensetzung, blattförmig ausgebildeter Körper, Prepreg, gehärteter Körper, Laminat und Mehrschichtlaminat |
MY157959A (en) * | 2006-03-03 | 2016-08-30 | Sumitomo Bakelite Co | Intermediate layer material and composite laminate |
GB2449146B (en) * | 2008-01-22 | 2009-04-22 | Gurit | Fibre-reinforced composite material and manufacture thereof |
CN101578010B (zh) * | 2009-06-10 | 2011-02-16 | 陕西生益科技有限公司 | 高相比漏电起痕指数无铅兼容cem-3覆铜板制备方法 |
TWI494363B (zh) * | 2009-09-04 | 2015-08-01 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
WO2011034055A1 (ja) * | 2009-09-15 | 2011-03-24 | 旭化成イーマテリアルズ株式会社 | プリプレグ |
KR20110081588A (ko) * | 2010-01-08 | 2011-07-14 | 삼성전기주식회사 | 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판 |
CN102858839B (zh) * | 2010-04-23 | 2015-11-25 | 松下知识产权经营株式会社 | 环氧树脂组合物、预浸料、覆金属层叠板以及印制电路布线板 |
JP5587730B2 (ja) * | 2010-10-25 | 2014-09-10 | パナソニック株式会社 | 絶縁樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板 |
TWI418593B (zh) * | 2010-11-10 | 2013-12-11 | Iteq Corp | 無鹵環氧樹脂組合物及應用該無鹵環氧樹脂組合物所製成之膠片與基板 |
JP2014109027A (ja) * | 2012-12-04 | 2014-06-12 | Hitachi Chemical Co Ltd | エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板 |
KR101341749B1 (ko) * | 2013-03-14 | 2013-12-16 | 주식회사 한국카본 | 건축용 내외장재의 제조방법 |
CN103694644B (zh) * | 2013-12-30 | 2015-11-04 | 景旺电子科技(龙川)有限公司 | 一种环氧树脂组合物、金属基覆铜板及其制作方法 |
JP6604564B2 (ja) * | 2014-04-08 | 2019-11-13 | パナソニックIpマネジメント株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
CN106134296B (zh) * | 2014-04-08 | 2020-01-17 | 松下知识产权经营株式会社 | 印刷电路板用树脂组合物、预浸料、覆金属层压板、印刷电路板 |
JP6604565B2 (ja) * | 2015-02-13 | 2019-11-13 | パナソニックIpマネジメント株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板 |
WO2015155982A1 (ja) * | 2014-04-08 | 2015-10-15 | パナソニックIpマネジメント株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
CN106147132B (zh) * | 2015-07-17 | 2019-09-27 | 上海国纪电子材料有限公司 | 树脂组合物及含其的胶液、半固化片与覆铜板及制备方法 |
JP6664092B2 (ja) * | 2015-10-07 | 2020-03-13 | パナソニックIpマネジメント株式会社 | 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板及びプリント配線板 |
WO2017154167A1 (ja) * | 2016-03-10 | 2017-09-14 | 三井金属鉱業株式会社 | 多層積層板及びこれを用いた多層プリント配線板の製造方法 |
JP6672953B2 (ja) * | 2016-03-29 | 2020-03-25 | 味の素株式会社 | 樹脂シート |
US11370908B2 (en) * | 2018-06-27 | 2022-06-28 | 3M Innovative Properties Company | Curable compositions and related methods |
JP6767709B2 (ja) * | 2019-07-11 | 2020-10-14 | パナソニックIpマネジメント株式会社 | プリント配線板用樹脂組成物、プリプレグ、金属張積層板およびプリント配線板 |
Family Cites Families (20)
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JPH01197554A (ja) * | 1988-02-02 | 1989-08-09 | Toshiba Corp | 難燃性樹脂組成物およびその製造法 |
US5004764A (en) * | 1988-02-12 | 1991-04-02 | Mitsui Petrochemical Industries, Ltd. | Composition for vibration damper, process for manufacture thereof, and vibration damper |
JPH01210431A (ja) * | 1988-02-17 | 1989-08-24 | Dainippon Ink & Chem Inc | 積層板の連続製造方法 |
JPH0260955A (ja) * | 1988-08-26 | 1990-03-01 | Somar Corp | 層間絶縁層形成に好適な樹脂組成物 |
JP2587870B2 (ja) * | 1988-12-06 | 1997-03-05 | 松下電工株式会社 | 紙基材積層板用エポキシ樹脂組成物 |
JPH02219814A (ja) * | 1989-02-21 | 1990-09-03 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JP2993065B2 (ja) * | 1990-07-27 | 1999-12-20 | 三菱瓦斯化学株式会社 | 表面平滑金属箔張積層板 |
JP3724024B2 (ja) * | 1995-11-13 | 2005-12-07 | 大日本インキ化学工業株式会社 | 積層板用エポキシ樹脂組成物 |
JPH10319589A (ja) * | 1997-05-15 | 1998-12-04 | Hitachi Ltd | 多層配線板及びその製造方法 |
JP3548691B2 (ja) * | 1998-01-07 | 2004-07-28 | 太陽インキ製造株式会社 | 液状熱硬化性充填用組成物及びそれを用いたプリント配線板の永久穴埋め方法 |
TW399398B (en) * | 1998-01-07 | 2000-07-21 | Taiyo Ink Seizo K K | Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof |
US6001950A (en) * | 1998-09-22 | 1999-12-14 | Borden Chemical, Inc. | Phenol-novolacs with improved optical properties |
JP2000273290A (ja) * | 1999-03-26 | 2000-10-03 | Hitachi Chem Co Ltd | エポキシ樹脂ワニスの製造方法、エポキシ樹脂プリプレグの製造方法及びエポキシ樹脂積層板の製造方法 |
JP2001102758A (ja) * | 1999-10-01 | 2001-04-13 | Hitachi Chem Co Ltd | プリント配線板とそのプリント配線板に用いる絶縁樹脂シート並びにその絶縁樹脂シートの製造方法 |
AU2089701A (en) * | 1999-12-13 | 2001-06-18 | Dow Chemical Company, The | Phosphorus element-containing crosslinking agents and flame retardant phosphoruselement-containing epoxy resin compositions prepared therewith |
JP3489025B2 (ja) * | 2000-01-14 | 2004-01-19 | 大塚化学ホールディングス株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品 |
JP2003020327A (ja) | 2001-07-10 | 2003-01-24 | Sumitomo Bakelite Co Ltd | 樹脂組成物、これを用いたプリプレグ及び積層板 |
JP3846854B2 (ja) * | 2001-10-22 | 2006-11-15 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
JP4148501B2 (ja) * | 2002-04-02 | 2008-09-10 | 三井金属鉱業株式会社 | プリント配線板の内蔵キャパシタ層形成用の誘電体フィラー含有樹脂及びその誘電体フィラー含有樹脂を用いて誘電体層を形成した両面銅張積層板並びにその両面銅張積層板の製造方法 |
JP2004149577A (ja) * | 2002-10-28 | 2004-05-27 | Matsushita Electric Works Ltd | プリプレグ及び積層板 |
-
2003
- 2003-07-22 WO PCT/JP2003/009258 patent/WO2005007742A1/ja not_active Application Discontinuation
- 2003-07-22 AU AU2003252667A patent/AU2003252667A1/en not_active Abandoned
-
2004
- 2004-03-31 KR KR1020057025153A patent/KR100699778B1/ko active IP Right Grant
- 2004-03-31 AT AT04724838T patent/ATE439389T1/de active
- 2004-03-31 EP EP04724838A patent/EP1650248B1/en not_active Expired - Fee Related
- 2004-03-31 WO PCT/JP2004/004723 patent/WO2005007724A1/ja active Application Filing
- 2004-03-31 US US10/565,407 patent/US7566501B2/en active Active
- 2004-03-31 TW TW093108944A patent/TW200504134A/zh unknown
- 2004-03-31 JP JP2005511778A patent/JP4277123B2/ja not_active Expired - Lifetime
- 2004-03-31 DE DE200460022558 patent/DE602004022558D1/de not_active Expired - Lifetime
- 2004-03-31 CN CNB2004800208292A patent/CN100441608C/zh not_active Expired - Lifetime
-
2008
- 2008-12-26 JP JP2008335334A patent/JP2009138201A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1650248A1 (en) | 2006-04-26 |
WO2005007724A8 (ja) | 2005-06-23 |
JP4277123B2 (ja) | 2009-06-10 |
WO2005007724A1 (ja) | 2005-01-27 |
TWI346673B (zh) | 2011-08-11 |
EP1650248A4 (en) | 2007-03-07 |
KR20060058776A (ko) | 2006-05-30 |
CN1826365A (zh) | 2006-08-30 |
ATE439389T1 (de) | 2009-08-15 |
DE602004022558D1 (de) | 2009-09-24 |
CN100441608C (zh) | 2008-12-10 |
JP2009138201A (ja) | 2009-06-25 |
KR100699778B1 (ko) | 2007-03-28 |
AU2003252667A1 (en) | 2005-02-04 |
US7566501B2 (en) | 2009-07-28 |
US20060216495A1 (en) | 2006-09-28 |
EP1650248B1 (en) | 2009-08-12 |
JPWO2005007724A1 (ja) | 2006-08-31 |
WO2005007742A1 (ja) | 2005-01-27 |
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