TWI346205B - - Google Patents

Info

Publication number
TWI346205B
TWI346205B TW096114932A TW96114932A TWI346205B TW I346205 B TWI346205 B TW I346205B TW 096114932 A TW096114932 A TW 096114932A TW 96114932 A TW96114932 A TW 96114932A TW I346205 B TWI346205 B TW I346205B
Authority
TW
Taiwan
Application number
TW096114932A
Other versions
TW200745559A (en
Inventor
Hiroshi Nakayama
Kohei Hironaka
Yosuke Mabune
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200745559A publication Critical patent/TW200745559A/zh
Application granted granted Critical
Publication of TWI346205B publication Critical patent/TWI346205B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096114932A 2006-04-28 2007-04-27 Holder for conductive contact element TW200745559A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006126515 2006-04-28
PCT/JP2007/058984 WO2007125974A1 (ja) 2006-04-28 2007-04-25 導電性接触子ホルダ

Publications (2)

Publication Number Publication Date
TW200745559A TW200745559A (en) 2007-12-16
TWI346205B true TWI346205B (zh) 2011-08-01

Family

ID=38655500

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096114932A TW200745559A (en) 2006-04-28 2007-04-27 Holder for conductive contact element

Country Status (7)

Country Link
US (1) US7845955B2 (zh)
EP (1) EP2017629B1 (zh)
JP (1) JP5379474B2 (zh)
KR (1) KR101013172B1 (zh)
CN (1) CN101454676B (zh)
TW (1) TW200745559A (zh)
WO (1) WO2007125974A1 (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8984442B2 (en) * 2006-11-17 2015-03-17 Apple Inc. Method and system for upgrading a previously purchased media asset
WO2008072699A1 (ja) * 2006-12-15 2008-06-19 Nhk Spring Co., Ltd. 導電性接触子ホルダ、導電性接触子ユニット、および導電性接触子ホルダの製造方法
KR101174007B1 (ko) * 2008-02-01 2012-08-16 니혼 하츠쵸 가부시키가이샤 프로브 유닛
JP5374079B2 (ja) * 2008-06-20 2013-12-25 東京エレクトロン株式会社 検査用接触構造体
TWI424617B (zh) * 2009-11-20 2014-01-21 Hon Hai Prec Ind Co Ltd 電連接器
CN101710659B (zh) * 2009-12-11 2011-07-27 安拓锐高新测试技术（苏州）有限公司 一种电抗可控芯片测试插座
TWM388122U (en) * 2009-12-18 2010-09-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP5742235B2 (ja) * 2011-01-18 2015-07-01 富士通株式会社 接続部品
US8491315B1 (en) * 2011-11-29 2013-07-23 Plastronics Socket Partners, Ltd. Micro via adapter socket
JP5972366B2 (ja) * 2012-05-22 2016-08-17 日本発條株式会社 ソケット取付構造およびばね部材
TWI514695B (zh) * 2012-08-02 2015-12-21 Hon Hai Prec Ind Co Ltd 電連接器
WO2014123235A1 (ja) * 2013-02-08 2014-08-14 日本発條株式会社 プローブユニット用ベース部材、プローブホルダ、プローブユニット、プローブユニット用ベース部材の製造方法およびプローブユニット用積層構造体
JP6243130B2 (ja) * 2013-03-27 2017-12-06 株式会社エンプラス 電気接触子及び電気部品用ソケット
TWI515436B (zh) * 2013-12-13 2016-01-01 Mpi Corp Detect fixture
SG11201702178TA (en) * 2014-09-19 2017-04-27 Nhk Spring Co Ltd Probe unit
JP6436711B2 (ja) * 2014-10-01 2018-12-12 日本発條株式会社 プローブユニット
TWI702402B (zh) * 2015-05-07 2020-08-21 義大利商探針科技公司 特別用於減少間距應用的具有垂直探針的測試頭
JP2016212040A (ja) * 2015-05-13 2016-12-15 富士通コンポーネント株式会社 コンタクト
US9673539B2 (en) 2015-09-23 2017-06-06 Texas Instruments Incorporated Spring biased contact pin assembly
US9755344B2 (en) 2015-12-28 2017-09-05 Texas Instruments Incorporated Force biased spring probe pin assembly
US10114038B2 (en) 2015-12-28 2018-10-30 Texas Instruments Incorporated Force biased spring probe pin assembly
JP6706079B2 (ja) * 2016-01-18 2020-06-03 新光電気工業株式会社 プローブガイド板及びプローブ装置とそれらの製造方法
MY179228A (en) * 2016-02-22 2020-11-02 Jf Microtechnology Sdn Bhd Kelvin contact assembly and method of installation thereof
KR101882209B1 (ko) * 2016-03-23 2018-07-27 리노공업주식회사 동축 테스트소켓 조립체
JP7021874B2 (ja) * 2017-06-28 2022-02-17 株式会社ヨコオ コンタクトプローブ及び検査治具
SG11202000166QA (en) * 2017-07-13 2020-02-27 Nhk Spring Co Ltd Probe unit
CN109411937B (zh) * 2017-08-14 2021-09-21 富顶精密组件（深圳）有限公司 电连接器及其制造方法
WO2019049481A1 (ja) * 2017-09-08 2019-03-14 株式会社エンプラス 電気接続用ソケット
JP7039259B2 (ja) * 2017-11-16 2022-03-22 株式会社ヨコオ プローブヘッド
JP7169989B2 (ja) * 2017-11-30 2022-11-11 株式会社エンプラス 電気接続用ソケット
JP2020030918A (ja) * 2018-08-21 2020-02-27 東芝デバイス＆ストレージ株式会社 コネクタ及び積層基板モジュール
KR102133675B1 (ko) * 2019-07-03 2020-07-13 주식회사 새한마이크로텍 테스트용 소켓
TWI838543B (zh) * 2019-08-15 2024-04-11 旺矽科技股份有限公司 可同時用於高頻及中低頻訊號測試之探針頭
US11150269B2 (en) * 2019-08-15 2021-10-19 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2853656A (en) * 1953-08-07 1958-09-23 Burroughs Corp Printed circuit panel assembly
US4390220A (en) * 1981-04-02 1983-06-28 Burroughs Corporation Electrical connector assembly for an integrated circuit package
US4668041A (en) * 1985-04-19 1987-05-26 Intel Corporation Low noise test contacts for pin grid array
US5672062A (en) * 1991-01-30 1997-09-30 Labinal Components And Systems, Inc. Electrical connectors
US5046953A (en) * 1990-05-25 1991-09-10 Hewlett-Packard Company Method and apparatus for mounting an integrated circuit on a printed circuit board
US5055054A (en) * 1990-06-05 1991-10-08 E. I. Du Pont De Nemours And Company High density connector
US5174763A (en) 1990-06-11 1992-12-29 Itt Corporation Contact assembly
EP0462706A1 (en) 1990-06-11 1991-12-27 ITT INDUSTRIES, INC. (a Delaware corporation) Contact assembly
US5061192A (en) * 1990-12-17 1991-10-29 International Business Machines Corporation High density connector
US5155905A (en) * 1991-05-03 1992-10-20 Ltv Aerospace And Defense Company Method and apparatus for attaching a circuit component to a printed circuit board
JP2819910B2 (ja) * 1992-01-13 1998-11-05 日本電気株式会社 半導体素子測定装置
US5399104A (en) * 1992-09-28 1995-03-21 Mckenzie Socket Technology, Inc. Socket for multi-lead integrated circuit packages
US5414369A (en) * 1992-11-09 1995-05-09 Nhk Spring Co., Ltd. Coil spring-pressed needle contact probe modules with offset needles
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5713744A (en) * 1994-09-28 1998-02-03 The Whitaker Corporation Integrated circuit socket for ball grid array and land grid array lead styles
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
US5766022A (en) * 1996-05-21 1998-06-16 International Business Machines Corporation Electrical assembly
JPH10142291A (ja) * 1996-11-13 1998-05-29 Advantest Corp Ｉｃ試験装置
EP0999450B1 (en) 1999-08-23 2002-04-10 Agilent Technologies, Inc. (a Delaware corporation) Modular interface between test and application equipment
JP2001099889A (ja) 1999-09-29 2001-04-13 Yokowo Co Ltd 高周波回路の検査装置
US6247939B1 (en) * 2000-08-14 2001-06-19 Unisys Corporation Connector for making multiple pressed co-axial connections having an air dielectric
US6846184B2 (en) * 2003-01-24 2005-01-25 High Connection Density Inc. Low inductance electrical contacts and LGA connector system
TW570358U (en) * 2003-03-21 2004-01-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
US6932618B1 (en) * 2003-05-14 2005-08-23 Xilinx, Inc. Mezzanine integrated circuit interconnect
JP2005049163A (ja) 2003-07-31 2005-02-24 Yokowo Co Ltd 高周波・高速用デバイスの検査治具および検査用プローブ
JP4689196B2 (ja) 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット
JP2005337904A (ja) * 2004-05-27 2005-12-08 New Japan Radio Co Ltd 半導体装置特性測定用治具および半導体装置特性測定方法
US7690925B2 (en) * 2005-02-24 2010-04-06 Advanced Interconnections Corp. Terminal assembly with pin-retaining socket
US7220134B2 (en) * 2005-02-24 2007-05-22 Advanced Interconnections Corporation Low profile LGA socket assembly
JP4757531B2 (ja) * 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
JP5037683B2 (ja) * 2007-05-25 2012-10-03 モレックス インコーポレイテド 発熱体及び電源用のヒートシンク
WO2009091958A1 (en) * 2008-01-17 2009-07-23 Amphenol Corporation Interposer assembly and method
TWM339799U (en) * 2008-02-29 2008-09-01 Advanced Connectek Inc Signal terminal and male connector containing same

Also Published As

Publication number Publication date
JP5379474B2 (ja) 2013-12-25
US20090311890A1 (en) 2009-12-17
EP2017629A4 (en) 2016-06-29
CN101454676B (zh) 2011-12-07
EP2017629A1 (en) 2009-01-21
US7845955B2 (en) 2010-12-07
WO2007125974A1 (ja) 2007-11-08
EP2017629B1 (en) 2018-02-21
JPWO2007125974A1 (ja) 2009-09-10
CN101454676A (zh) 2009-06-10
KR20090012249A (ko) 2009-02-02
TW200745559A (en) 2007-12-16
KR101013172B1 (ko) 2011-02-10

Similar Documents

Publication Publication Date Title
TWI346205B (zh)
BRPI0720064A2 (zh)
BRMU8603216U8 (zh)
BRPI0715824A8 (zh)
BRPI0713487A2 (zh)
BR122016023444A2 (zh)
BRPI0708307B8 (zh)
CH2121272H1 (zh)
AT504380A8 (zh)
BY9789C1 (zh)
CN300725931S (zh) 童装(3815)
CN300725924S (zh) 童装(3789)
CN300725944S (zh) 童装(3890)
CN300725943S (zh) 童装(3876)
CN300725942S (zh) 童装(3874)
CN300725941S (zh) 童装(3872)
CN300725940S (zh) 童装(3870)
CN300725912S (zh) 童装(3706)
CN300725913S (zh) 童装(3712)
CN300725914S (zh) 童装(3714)
CN300725915S (zh) 童装(3728)
CN300725916S (zh) 童装(3732)
CN300725917S (zh) 童装(3734)
CN300725918S (zh) 童装(3748)
CN300725919S (zh) 童装(3752)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees