KR20090012249A - 도전성 접촉자 홀더 - Google Patents
도전성 접촉자 홀더 Download PDFInfo
- Publication number
- KR20090012249A KR20090012249A KR1020087028992A KR20087028992A KR20090012249A KR 20090012249 A KR20090012249 A KR 20090012249A KR 1020087028992 A KR1020087028992 A KR 1020087028992A KR 20087028992 A KR20087028992 A KR 20087028992A KR 20090012249 A KR20090012249 A KR 20090012249A
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- South Korea
- Prior art keywords
- conductive contact
- conductive
- holder
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- 239000004020 conductor Substances 0.000 claims abstract description 16
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- 229910000833 kovar Inorganic materials 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (7)
- 회로구조에 대하여 신호의 입출력을 행하는 신호용 도전성 접촉자와, 상기 회로구조에 대하여 어스전위의 공급을 행하는 어스용 도전성 접촉자를 수용하는 도전성 접촉자 홀더에 있어서,절연성재료에 의하여 형성되고, 상기 신호용 도전성 접촉자를 대략 전체 길이에 걸쳐 직접 삽입하는 제 1 삽입구멍을 가지는 절연성 홀더부재와,도전성재료에 의하여 형성되고, 상기 어스용 도전성 접촉자의 일부를 접촉 가능하게 삽입하는 제 2 삽입구멍을 가지는 도전성 블럭부재를 구비한 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 1항에 있어서,상기 절연성 홀더부재는, 상기 제 1 삽입구멍의 길이방향으로 적층된 제 1 및 제 2 홀더부재를 가지고,상기 도전성 블럭부재는, 상기 제 1 홀더부재와 상기 제 2 홀더부재와의 사이에 위치하는 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 2항에 있어서,상기 도전성 블럭부재의 일부는, 상기 도전성 접촉자 홀더의 표면에 노출되어 있는 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 1항 내지 제 3항 중 어느 한 항에 있어서,도전성재료에 의하여 형성되고, 상기 어스용 도전성 접촉자보다 전체 길이가 짧은 제 2 어스용 도전성 접촉자의 끝부를 삽입하는 오목부를 가짐과 동시에, 상기도전성 블럭부재를 배치 가능한 중공부를 가지는 도전성 중공 블럭부재를 더 구비하고,상기 중공부에, 상기 도전성 블럭부재와 상기 절연성 홀더부재의 상기 제 1 삽입구멍 형성부분의 적어도 일부를 배치한 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 4항에 있어서,상기 도전성 중공 블럭부재의 일부는, 상기 도전성 접촉자 홀더의 표면에 노출되어 있는 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 4항에 있어서,상기 도전성 블럭부재는, 상기 제 2 어스용 도전성 접촉자의 끝부를 삽입하는 오목부를 가지는 것을 특징으로 하는 도전성 접촉자 홀더.
- 제 4항에 있어서,상기 절연성 홀더부재와 상기 도전성 중공 블럭부재를 나사 및 접착제 중 적 어도 어느 한쪽을 이용하여 고정한 것을 특징으로 하는 도전성 접촉자 홀더.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00126515 | 2006-04-28 | ||
JP2006126515 | 2006-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090012249A true KR20090012249A (ko) | 2009-02-02 |
KR101013172B1 KR101013172B1 (ko) | 2011-02-10 |
Family
ID=38655500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087028992A KR101013172B1 (ko) | 2006-04-28 | 2007-04-25 | 도전성 접촉자 홀더 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7845955B2 (ko) |
EP (1) | EP2017629B1 (ko) |
JP (1) | JP5379474B2 (ko) |
KR (1) | KR101013172B1 (ko) |
CN (1) | CN101454676B (ko) |
TW (1) | TW200745559A (ko) |
WO (1) | WO2007125974A1 (ko) |
Cited By (3)
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KR20170086413A (ko) * | 2016-01-18 | 2017-07-26 | 신꼬오덴기 고교 가부시키가이샤 | 프로브 가이드판, 프로브 장치 및 그 제조 방법 |
KR20170110346A (ko) * | 2016-03-23 | 2017-10-11 | 리노공업주식회사 | 동축 테스트소켓 조립체 |
KR102133675B1 (ko) * | 2019-07-03 | 2020-07-13 | 주식회사 새한마이크로텍 | 테스트용 소켓 |
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US8344747B2 (en) * | 2008-02-01 | 2013-01-01 | Nhk Spring Co., Ltd. | Probe unit |
JP5374079B2 (ja) * | 2008-06-20 | 2013-12-25 | 東京エレクトロン株式会社 | 検査用接触構造体 |
TWI424617B (zh) * | 2009-11-20 | 2014-01-21 | Hon Hai Prec Ind Co Ltd | 電連接器 |
CN101710659B (zh) * | 2009-12-11 | 2011-07-27 | 安拓锐高新测试技术(苏州)有限公司 | 一种电抗可控芯片测试插座 |
TWM388122U (en) * | 2009-12-18 | 2010-09-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP5742235B2 (ja) * | 2011-01-18 | 2015-07-01 | 富士通株式会社 | 接続部品 |
US8491315B1 (en) * | 2011-11-29 | 2013-07-23 | Plastronics Socket Partners, Ltd. | Micro via adapter socket |
US20150139722A1 (en) * | 2012-05-22 | 2015-05-21 | Nhk Spring Co., Ltd. | Socket attachment structure and spring member |
TWI514695B (zh) * | 2012-08-02 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電連接器 |
WO2014123235A1 (ja) * | 2013-02-08 | 2014-08-14 | 日本発條株式会社 | プローブユニット用ベース部材、プローブホルダ、プローブユニット、プローブユニット用ベース部材の製造方法およびプローブユニット用積層構造体 |
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US10082525B2 (en) * | 2014-09-19 | 2018-09-25 | Nhk Spring Co., Ltd. | Probe unit |
JP6436711B2 (ja) * | 2014-10-01 | 2018-12-12 | 日本発條株式会社 | プローブユニット |
KR102577451B1 (ko) * | 2015-05-07 | 2023-09-12 | 테크노프로브 에스.피.에이. | 특히 감소된 피치 적용을 위한, 수직형 프로브를 구비한 테스트 헤드 |
JP2016212040A (ja) * | 2015-05-13 | 2016-12-15 | 富士通コンポーネント株式会社 | コンタクト |
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2007
- 2007-04-25 CN CN2007800154830A patent/CN101454676B/zh not_active Expired - Fee Related
- 2007-04-25 EP EP07742419.0A patent/EP2017629B1/en not_active Expired - Fee Related
- 2007-04-25 JP JP2008513247A patent/JP5379474B2/ja active Active
- 2007-04-25 WO PCT/JP2007/058984 patent/WO2007125974A1/ja active Application Filing
- 2007-04-25 KR KR1020087028992A patent/KR101013172B1/ko active IP Right Grant
- 2007-04-25 US US12/226,682 patent/US7845955B2/en active Active
- 2007-04-27 TW TW096114932A patent/TW200745559A/zh not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170086413A (ko) * | 2016-01-18 | 2017-07-26 | 신꼬오덴기 고교 가부시키가이샤 | 프로브 가이드판, 프로브 장치 및 그 제조 방법 |
KR20170110346A (ko) * | 2016-03-23 | 2017-10-11 | 리노공업주식회사 | 동축 테스트소켓 조립체 |
US10976348B2 (en) | 2016-03-23 | 2021-04-13 | Leeno Industrial Inc. | Test socket assembly |
KR102133675B1 (ko) * | 2019-07-03 | 2020-07-13 | 주식회사 새한마이크로텍 | 테스트용 소켓 |
Also Published As
Publication number | Publication date |
---|---|
EP2017629A1 (en) | 2009-01-21 |
EP2017629A4 (en) | 2016-06-29 |
JPWO2007125974A1 (ja) | 2009-09-10 |
TW200745559A (en) | 2007-12-16 |
KR101013172B1 (ko) | 2011-02-10 |
EP2017629B1 (en) | 2018-02-21 |
CN101454676B (zh) | 2011-12-07 |
CN101454676A (zh) | 2009-06-10 |
US20090311890A1 (en) | 2009-12-17 |
JP5379474B2 (ja) | 2013-12-25 |
TWI346205B (ko) | 2011-08-01 |
WO2007125974A1 (ja) | 2007-11-08 |
US7845955B2 (en) | 2010-12-07 |
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