TWI334662B - - Google Patents

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Publication number
TWI334662B
TWI334662B TW93107518A TW93107518A TWI334662B TW I334662 B TWI334662 B TW I334662B TW 93107518 A TW93107518 A TW 93107518A TW 93107518 A TW93107518 A TW 93107518A TW I334662 B TWI334662 B TW I334662B
Authority
TW
Taiwan
Prior art keywords
hole
ceramic
layer
manufacturing
forming
Prior art date
Application number
TW93107518A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428684A (en
Inventor
Satoshi Sasaki
Shinya Syoji
Kazushi Tachimoto
Minami Kudo
Mitsunao Homma
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003080933A external-priority patent/JP4330908B2/ja
Priority claimed from JP2003083520A external-priority patent/JP4153338B2/ja
Priority claimed from JP2003083532A external-priority patent/JP4153339B2/ja
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of TW200428684A publication Critical patent/TW200428684A/zh
Application granted granted Critical
Publication of TWI334662B publication Critical patent/TWI334662B/zh

Links

TW93107518A 2003-03-24 2004-03-19 Manufacturing method and manufacturing system of ceramic device TW200428684A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003080933A JP4330908B2 (ja) 2003-03-24 2003-03-24 セラミック素子の製造方法
JP2003081195 2003-03-24
JP2003083520A JP4153338B2 (ja) 2003-03-25 2003-03-25 セラミック素子の製造方法及び製造システム
JP2003083532A JP4153339B2 (ja) 2003-03-25 2003-03-25 セラミック素子の製造方法

Publications (2)

Publication Number Publication Date
TW200428684A TW200428684A (en) 2004-12-16
TWI334662B true TWI334662B (ja) 2010-12-11

Family

ID=34317588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93107518A TW200428684A (en) 2003-03-24 2004-03-19 Manufacturing method and manufacturing system of ceramic device

Country Status (2)

Country Link
CN (1) CN100428518C (ja)
TW (1) TW200428684A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106313925B (zh) * 2015-07-03 2020-03-20 深圳光启尖端技术有限责任公司 超材料的制备方法
CN110253161B (zh) * 2019-06-25 2022-01-21 西南应用磁学研究所 一种旋磁铁氧体基片快速激光通孔方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181400A (ja) * 1987-01-22 1988-07-26 松下電器産業株式会社 セラミツク多層基板
JPH0766555A (ja) * 1993-08-27 1995-03-10 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JP3251862B2 (ja) * 1996-09-06 2002-01-28 株式会社住友金属エレクトロデバイス セラミック多層基板の製造方法
JPH1084185A (ja) * 1996-09-09 1998-03-31 Hitachi Ltd 多層セラミック基板の製造方法
JPH11214824A (ja) * 1998-01-21 1999-08-06 Hitachi Telecom Technol Ltd 焼付けマスクとこの焼付けマスクを用いたプリント配線板の製造方法
DE69916402T2 (de) * 1998-06-16 2009-10-01 The Board Of Regents Of Oklahoma State University, Stillwater System und verfahren zum nachweis von anormalen strahlungsbelichtungen mittels gepulster optisch stimulierter lumineszenz
JP2002026487A (ja) * 2000-07-05 2002-01-25 Sony Corp 基板の基準穴矯正装置および基板の基準穴矯正方法

Also Published As

Publication number Publication date
TW200428684A (en) 2004-12-16
CN100428518C (zh) 2008-10-22
CN1532957A (zh) 2004-09-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees