CN100428518C - 陶瓷元件的制造方法及其制造系统 - Google Patents

陶瓷元件的制造方法及其制造系统 Download PDF

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Publication number
CN100428518C
CN100428518C CNB200410008849XA CN200410008849A CN100428518C CN 100428518 C CN100428518 C CN 100428518C CN B200410008849X A CNB200410008849X A CN B200410008849XA CN 200410008849 A CN200410008849 A CN 200410008849A CN 100428518 C CN100428518 C CN 100428518C
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CN
China
Prior art keywords
hole
ceramic
manufacture method
ceramic material
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB200410008849XA
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English (en)
Chinese (zh)
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CN1532957A (zh
Inventor
佐佐木诚志
东海林慎也
立本一志
工藤南
本间光尚
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TDK Corp
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TDK Corp
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Publication date
Priority claimed from JP2003080933A external-priority patent/JP4330908B2/ja
Priority claimed from JP2003083520A external-priority patent/JP4153338B2/ja
Priority claimed from JP2003083532A external-priority patent/JP4153339B2/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of CN1532957A publication Critical patent/CN1532957A/zh
Application granted granted Critical
Publication of CN100428518C publication Critical patent/CN100428518C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
CNB200410008849XA 2003-03-24 2004-03-24 陶瓷元件的制造方法及其制造系统 Expired - Lifetime CN100428518C (zh)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2003080933A JP4330908B2 (ja) 2003-03-24 2003-03-24 セラミック素子の製造方法
JP2003081195 2003-03-24
JP2003-081195 2003-03-24
JP2003080933 2003-03-24
JP2003-080933 2003-03-24
JP2003081195 2003-03-24
JP2003-083520 2003-03-25
JP2003083520 2003-03-25
JP2003-083532 2003-03-25
JP2003083520A JP4153338B2 (ja) 2003-03-25 2003-03-25 セラミック素子の製造方法及び製造システム
JP2003083532 2003-03-25
JP2003083532A JP4153339B2 (ja) 2003-03-25 2003-03-25 セラミック素子の製造方法

Publications (2)

Publication Number Publication Date
CN1532957A CN1532957A (zh) 2004-09-29
CN100428518C true CN100428518C (zh) 2008-10-22

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CNB200410008849XA Expired - Lifetime CN100428518C (zh) 2003-03-24 2004-03-24 陶瓷元件的制造方法及其制造系统

Country Status (2)

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CN (1) CN100428518C (ja)
TW (1) TW200428684A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106313925B (zh) * 2015-07-03 2020-03-20 深圳光启尖端技术有限责任公司 超材料的制备方法
CN110253161B (zh) * 2019-06-25 2022-01-21 西南应用磁学研究所 一种旋磁铁氧体基片快速激光通孔方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043223A (en) * 1987-01-22 1991-08-27 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic substrate and method for making the same
JPH0766555A (ja) * 1993-08-27 1995-03-10 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JPH1084184A (ja) * 1996-09-06 1998-03-31 Sumitomo Kinzoku Electro Device:Kk セラミック多層基板の製造方法
JPH1084185A (ja) * 1996-09-09 1998-03-31 Hitachi Ltd 多層セラミック基板の製造方法
JPH11214824A (ja) * 1998-01-21 1999-08-06 Hitachi Telecom Technol Ltd 焼付けマスクとこの焼付けマスクを用いたプリント配線板の製造方法
US6316782B1 (en) * 1998-06-16 2001-11-13 The Board Of Regents For Oklahoma State University System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence
JP2002026487A (ja) * 2000-07-05 2002-01-25 Sony Corp 基板の基準穴矯正装置および基板の基準穴矯正方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043223A (en) * 1987-01-22 1991-08-27 Matsushita Electric Industrial Co., Ltd. Multilayer ceramic substrate and method for making the same
JPH0766555A (ja) * 1993-08-27 1995-03-10 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
JPH1084184A (ja) * 1996-09-06 1998-03-31 Sumitomo Kinzoku Electro Device:Kk セラミック多層基板の製造方法
JPH1084185A (ja) * 1996-09-09 1998-03-31 Hitachi Ltd 多層セラミック基板の製造方法
JPH11214824A (ja) * 1998-01-21 1999-08-06 Hitachi Telecom Technol Ltd 焼付けマスクとこの焼付けマスクを用いたプリント配線板の製造方法
US6316782B1 (en) * 1998-06-16 2001-11-13 The Board Of Regents For Oklahoma State University System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence
JP2002026487A (ja) * 2000-07-05 2002-01-25 Sony Corp 基板の基準穴矯正装置および基板の基準穴矯正方法

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Publication number Publication date
TW200428684A (en) 2004-12-16
CN1532957A (zh) 2004-09-29
TWI334662B (ja) 2010-12-11

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