CN100428518C - 陶瓷元件的制造方法及其制造系统 - Google Patents
陶瓷元件的制造方法及其制造系统 Download PDFInfo
- Publication number
- CN100428518C CN100428518C CNB200410008849XA CN200410008849A CN100428518C CN 100428518 C CN100428518 C CN 100428518C CN B200410008849X A CNB200410008849X A CN B200410008849XA CN 200410008849 A CN200410008849 A CN 200410008849A CN 100428518 C CN100428518 C CN 100428518C
- Authority
- CN
- China
- Prior art keywords
- hole
- ceramic
- manufacture method
- ceramic material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 claims abstract description 73
- 238000010438 heat treatment Methods 0.000 claims abstract description 56
- 229910010293 ceramic material Inorganic materials 0.000 claims description 44
- 238000007639 printing Methods 0.000 claims description 32
- 238000001035 drying Methods 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 23
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- 230000008602 contraction Effects 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 description 65
- 238000010586 diagram Methods 0.000 description 15
- 238000012797 qualification Methods 0.000 description 15
- 238000012545 processing Methods 0.000 description 11
- 238000007650 screen-printing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 230000009187 flying Effects 0.000 description 8
- 239000006071 cream Substances 0.000 description 6
- 238000002788 crimping Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 230000003902 lesion Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003080933A JP4330908B2 (ja) | 2003-03-24 | 2003-03-24 | セラミック素子の製造方法 |
JP2003081195 | 2003-03-24 | ||
JP2003-081195 | 2003-03-24 | ||
JP2003080933 | 2003-03-24 | ||
JP2003-080933 | 2003-03-24 | ||
JP2003081195 | 2003-03-24 | ||
JP2003-083520 | 2003-03-25 | ||
JP2003083520 | 2003-03-25 | ||
JP2003-083532 | 2003-03-25 | ||
JP2003083520A JP4153338B2 (ja) | 2003-03-25 | 2003-03-25 | セラミック素子の製造方法及び製造システム |
JP2003083532 | 2003-03-25 | ||
JP2003083532A JP4153339B2 (ja) | 2003-03-25 | 2003-03-25 | セラミック素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1532957A CN1532957A (zh) | 2004-09-29 |
CN100428518C true CN100428518C (zh) | 2008-10-22 |
Family
ID=34317588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200410008849XA Expired - Lifetime CN100428518C (zh) | 2003-03-24 | 2004-03-24 | 陶瓷元件的制造方法及其制造系统 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN100428518C (ja) |
TW (1) | TW200428684A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106313925B (zh) * | 2015-07-03 | 2020-03-20 | 深圳光启尖端技术有限责任公司 | 超材料的制备方法 |
CN110253161B (zh) * | 2019-06-25 | 2022-01-21 | 西南应用磁学研究所 | 一种旋磁铁氧体基片快速激光通孔方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5043223A (en) * | 1987-01-22 | 1991-08-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic substrate and method for making the same |
JPH0766555A (ja) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
JPH1084184A (ja) * | 1996-09-06 | 1998-03-31 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
JPH1084185A (ja) * | 1996-09-09 | 1998-03-31 | Hitachi Ltd | 多層セラミック基板の製造方法 |
JPH11214824A (ja) * | 1998-01-21 | 1999-08-06 | Hitachi Telecom Technol Ltd | 焼付けマスクとこの焼付けマスクを用いたプリント配線板の製造方法 |
US6316782B1 (en) * | 1998-06-16 | 2001-11-13 | The Board Of Regents For Oklahoma State University | System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence |
JP2002026487A (ja) * | 2000-07-05 | 2002-01-25 | Sony Corp | 基板の基準穴矯正装置および基板の基準穴矯正方法 |
-
2004
- 2004-03-19 TW TW93107518A patent/TW200428684A/zh not_active IP Right Cessation
- 2004-03-24 CN CNB200410008849XA patent/CN100428518C/zh not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5043223A (en) * | 1987-01-22 | 1991-08-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic substrate and method for making the same |
JPH0766555A (ja) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
JPH1084184A (ja) * | 1996-09-06 | 1998-03-31 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
JPH1084185A (ja) * | 1996-09-09 | 1998-03-31 | Hitachi Ltd | 多層セラミック基板の製造方法 |
JPH11214824A (ja) * | 1998-01-21 | 1999-08-06 | Hitachi Telecom Technol Ltd | 焼付けマスクとこの焼付けマスクを用いたプリント配線板の製造方法 |
US6316782B1 (en) * | 1998-06-16 | 2001-11-13 | The Board Of Regents For Oklahoma State University | System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence |
JP2002026487A (ja) * | 2000-07-05 | 2002-01-25 | Sony Corp | 基板の基準穴矯正装置および基板の基準穴矯正方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200428684A (en) | 2004-12-16 |
CN1532957A (zh) | 2004-09-29 |
TWI334662B (ja) | 2010-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20081022 |
|
CX01 | Expiry of patent term |