CN100428518C - Method for producing ceramic element and its producing system - Google Patents
Method for producing ceramic element and its producing system Download PDFInfo
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- CN100428518C CN100428518C CNB200410008849XA CN200410008849A CN100428518C CN 100428518 C CN100428518 C CN 100428518C CN B200410008849X A CNB200410008849X A CN B200410008849XA CN 200410008849 A CN200410008849 A CN 200410008849A CN 100428518 C CN100428518 C CN 100428518C
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- 239000000919 ceramic Substances 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 claims abstract description 73
- 238000010438 heat treatment Methods 0.000 claims abstract description 56
- 229910010293 ceramic material Inorganic materials 0.000 claims description 44
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- 150000001875 compounds Chemical class 0.000 claims description 4
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 4
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
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Abstract
To provide a method for manufacturing a ceramic element wherein electrical connection between one end face side and the other end face side of a ceramic layer is performed reliably via a through hole. After forming a green sheet 34 on the top face of a carrier film 32, the film 32 and the sheet 34 are heated within a heating furnace 36 to be contracted with heat before forming a through hole at the sheet 34. Thus, even when the film 32 and the sheet 34 are heated in a process after forming the through hole, the film 32 and the sheet 34 are hardly contracted in addition with heat. Consequently, the through hole is prevented from being deformed and the forming position of the through hole is prevented from being deviated. Thus, the electrical connection between one end face side and the other end face side of the ceramic layer is performed reliably via the through hole.
Description
Technical field
The present invention relates to the manufacture method and the manufacturing system thereof of ceramic components such as lamination type piezoelectric element, lamination type piezoelectric actuator, piezoelectric transducer, in particular to the manufacture method and the manufacturing system that form the ceramic component that is electrically connected between an end face that makes above-mentioned ceramic layer by through hole and the other end.
Background technology
In recent years, just flourish as the technological development of the lamination type piezoelectric element of one of ceramic component.This lamination type piezoelectric element is disclosed in as in the Japanese Patent Application Publication 2002-254634 communique.
Lamination type piezoelectric element described in this patent documentation is that piezoelectric body layer that will be formed Butut by a plurality of absolute electrodes and the piezoelectric body layer that is formed Butut by common electrode replace lamination, utilizes conductive component through being formed at through hole on the piezoelectric body layer proper alignment each absolute electrode on the thickness direction of lamination type piezoelectric element is connected and formation.On this lamination type piezoelectric element,, in piezoelectric body layer, optionally make with the above-mentioned predetermined corresponding active part of absolute electrode (producing the part of strain because of piezoelectric effect) to be subjected to displacement by between predetermined absolute electrode and common electrode, applying voltage.
Summary of the invention
Be in the ceramic component of representative with aforesaid lamination type piezoelectric element, along with the miniaturization of element itself be formed at the Highgrade integration of electrode on the element etc., people's expectation can utilize between a end face that through hole makes ceramic layer and the other end and form the technology that reliably is electrically connected.
At this, the present invention promptly is in light of this situation, is purpose so that the manufacture method and the manufacturing system that form the ceramic component that reliably is electrically connected between the end face that can utilize through hole to make ceramic layer and the other end to be provided.
In order to achieve the above object, the manufacture method of the 1st kind of ceramic component of the present invention is to make the manufacture method that forms the ceramic component that is electrically connected between end face of ceramic layer and the other end by being formed on through hole on the ceramic layer, it is characterized in that having: form operation on the surface of holding member as the ceramic material layer of ceramic layer; Make holding member and ceramic material layer carry out the operation of thermal contraction simultaneously; On the ceramic material layer of thermal contraction, form the operation of through hole.
In the manufacture method of the 1st kind of ceramic component, after forming ceramic material layer on the surface of holding member, before forming through hole on this ceramic material layer, make holding member and ceramic material layer generation thermal contraction.Thus, even in the operation after through hole forms holding member and ceramic layer are heated, holding member and ceramic layer also have further thermal contraction hardly.So, can prevent that the distortion of shape of through holes or through hole from forming problems such as offset, can between end face of ceramic layer and other end, realize being electrically connected reliably by through hole.
In addition, in the manufacture method of the 1st kind of ceramic component, have: after forming through hole, the operation of printing paste electric conducting material on ceramic material layer; With the dry operation that is printed on the electric conducting material on the above-mentioned ceramic material layer under predetermined temperature, in the thermal contraction operation, be preferably with the temperature that is higher than baking temperature and make holding member and above-mentioned ceramic material layer realization thermal contraction.When so making holding member and above-mentioned ceramic material layer realize thermal contraction, just can prevent the distortion of the dried shape of through holes of electric conducting material or the problems such as skew that through hole forms the position with the temperature that is higher than the predetermined baking temperature of electric conducting material when dry.
And the manufacture method of the 2nd kind of ceramic component of the present invention is to make the manufacture method that forms the ceramic component that is electrically connected between end face of ceramic layer and the other end by being formed on through hole on the ceramic layer, it is characterized in that, laser radiation with 2 subharmonic that utilize the YAG laser or 3 subharmonic contains lead-containing compounds and forms the ceramic material of above-mentioned ceramic layer, and forms the operation of through hole on above-mentioned ceramic material.
The inventor finds, utilizes the laser radiation of 2 subharmonic of YAG laser or 3 subharmonic to contain the ceramic material of lead-containing compounds (lead titanates and lead zirconate titanate etc.), can obtain good through hole as described below.That is, with prior art in commonly used by CO
2Piling up around the through hole when laser carries out laser radiation has a large amount of flyings to compare, and carries out laser radiation by 2 subharmonic or 3 subharmonic of YAG laser, does not almost have flying to pile up around can making through hole.Because this can prevent that the through hole that causes because of flying from stopping up, therefore can by for example in through hole filled conductive cream carry out silk screen printing, in through hole, form conductive component reliably.So, can utilize through hole between end face of ceramic layer and other end, to form reliably and be electrically connected.
And in the manufacture method of the 2nd kind of ceramic component, be preferably to utilize and transfer Q to make the laser pulsing.Usually, when utilizing laser radiation to form through hole, for example when utilizing accent Q not make the laser pulsing, be difficult to carry out management processing, make shape of through holes be taper, and the flying that produces because of processing do not disperse, be deposited in around the through hole and become the processing bits to the expansion of the plane of incidence side of laser.But, make the vibration of laser pulsing by for example transferring Q, can be easy to obtain bigger peak power.Thus, for example form from an end face irradiating laser of ceramic material through hole and comprise this through hole interior when an end face forms electrode pattern, can reduce the relative size of through hole with respect to this electrode.So, can make electrode become finer, and then can realize the miniaturization of the highly integrated and ceramic component of electrode.
In addition, the manufacture method of the 3rd kind of ceramic component of the present invention is a kind ofly to make the manufacture method that forms the ceramic component that is electrically connected between end face of ceramic layer and the other end by being formed on through hole on the ceramic layer, it is characterized in that, have: by electric conducting material being printed on the ceramic material as above-mentioned ceramic layer, and form the operation of the conduction Butut that covers an end face that is formed at the through hole on the above-mentioned ceramic material; With the operation that will be printed on the above-mentioned electric conducting material drying under predetermined temperature on the above-mentioned ceramic material, between the operation of operation that forms above-mentioned conduction Butut and dry above-mentioned electric conducting material, to be lower than the heating-up temperature of above-mentioned baking temperature, heating is printed with the ceramic material of above-mentioned electric conducting material.
In the manufacture method of the 3rd kind of ceramic component, behind the conduction Butut that forms an end face that covers through hole by the printing conductive material, to be lower than the heating-up temperature heating ceramic material of the baking temperature that makes this electric conducting material bone dry.Utilize this heating, make the electric conducting material that is printed onto on the ceramic material softening, so electric conducting material is passed in through hole.This effect is to become clearly in 25 ℃～50 ℃ the temperature range time in heating-up temperature.Then, at this dry this electric conducting material in heating back, can in through hole, form continuous conductive component really to the other end by through hole one end face thus.So, utilize the manufacture method of this ceramic component, can utilize through hole between end face of ceramic layer and other end, to form reliably and be electrically connected.
In addition, the manufacture method of the 4th kind of ceramic component of the present invention is a kind ofly to make the manufacture method that forms the ceramic component that is electrically connected between end face of ceramic layer and the other end by being formed on through hole on the ceramic layer, it is characterized in that, have: be labeled as position reference with the 1st, the through hole that forms through hole on as the ceramic material of above-mentioned ceramic layer forms operation; By electric conducting material being printed onto the operation that forms the 2nd mark on the ceramic material and cover the conduction Butut of above-mentioned through hole one end face; Detect the detection operation of the position relation between above-mentioned the 1st mark and above-mentioned the 2nd mark.
In addition, the manufacturing system of ceramic component of the present invention is a kind ofly to make the manufacturing system that forms the ceramic component that is electrically connected between end face of ceramic layer and the other end by being formed on through hole on the ceramic layer, it is characterized in that, have: be labeled as position reference with the 1st, the through hole that forms through hole on as the ceramic material of above-mentioned ceramic layer forms mechanism; By electric conducting material is printed onto on the ceramic material, form the printing mechanism of the conduction Butut of the 2nd mark and above-mentioned through hole one end face of covering; Detect the testing agency of the position relation between above-mentioned the 1st mark and above-mentioned the 2nd mark.
In the manufacture method and manufacturing system of the 4th kind of ceramic component, be labeled as position reference with the 1st and form through hole, form the conduction Butut and the 2nd mark of an end face that covers this through hole simultaneously by printing.Therefore, by detecting the position relation between the 1st mark and the 2nd mark, can be in the hope of the formation position of conductive fabric figure with respect to through hole.Thus, when the conduction Butut is offset with respect to the through hole occurrence positions, can revise this offset, on ceramic material, form the conduction Butut simultaneously, also can will finish the ceramic component lamination that conductive fabric figure forms according to the relation of the position between the 1st mark and the 2nd mark.And when the conduction Butut consequently can not be revised greater than predetermined value with respect to the offset of through hole, it is defective that this ceramic component is judged as, thereby it can be removed immediately, makes it can not flow to subsequent handling.And owing to can improve the positional precision of conduction Butut with respect to through hole according to the present invention, so, can utilize through hole between end face of ceramic layer and other end, to realize being electrically connected reliably.
Ceramic component of the present invention is meant the element with the ceramic layer that is formed by ceramic material, for example lamination type piezoelectric element, piezoelectric transducer, electric capacity, inductance, transformer and filter and the device that is composited by these elements.
The effect of invention
As mentioned above, can make according to the present invention and can utilize through hole between end face of ceramic layer and other end, to form the ceramic component that is electrically connected reliably.
Description of drawings
Fig. 1 is the exploded perspective view of the lamination type piezoelectric element that made by the process for preparing ceramic and the manufacturing system of embodiments of the present invention.
Fig. 2 perpendicular observed amplification profile of direction of length direction with lamination type piezoelectric element shown in Figure 1 of serving as reasons.
Fig. 3 is the schematic diagram that the substrate of embodiment of the present invention 1 forms operation.
Fig. 4 is the schematic diagram of the heat treatment step of embodiment of the present invention 1.
Fig. 5 is the schematic diagram that the through hole of embodiment of the present invention 1 forms operation.
Fig. 6 is the schematic diagram of the 1st printing process, heating process and the 1st drying process of embodiment of the present invention 1.
Fig. 7 is the schematic diagram of the lamination operation of embodiment of the present invention 1.
Fig. 8 is that the through hole of embodiments of the present invention 2 forms the view during the laser radiation in the operation.
Fig. 9 is that the through hole of embodiments of the present invention 2 forms the view after the laser radiation in the operation.
Figure 10 utilizes laser radiation to form the comparative result schematic diagram of the state of through hole.
Figure 11 is the profile of the tellite behind enforcement the 1st printing process in the embodiment of the present invention 3.
Figure 12 is the profile of the tellite behind enforcement the 1st drying process in the embodiment of the present invention 3.
Figure 13 is in embodiment of the present invention 3, be set at 2 minutes (necessarily) heating time in the heating process, the schematic diagram of lamination type piezoelectric element qualification rate when changing heating-up temperature.
Figure 14 is in embodiment of the present invention 3, the heating-up temperature in the heating process is set at the schematic diagram of 25 ℃ (necessarily), the lamination type piezoelectric element qualification rate of change during heating time.
Figure 15 is in embodiment of the present invention 3, the heating-up temperature in the heating process is set at the schematic diagram of 50 ℃ (necessarily), the lamination type piezoelectric element qualification rate of change during heating time.
Figure 16 is the schematic diagram that is used to illustrate the location situation of embodiment of the present invention 4, and (a) the expression through hole forms operation, (b) expression the 1st printing process, (c) expression the 2nd printing process.
Figure 17 is that the manufacturing system of embodiment of the present invention 4 constitutes block diagram.
Embodiment
With reference to the accompanying drawings, preferred implementation of the present invention is elaborated.
At first, see figures.1.and.2, the lamination type piezoelectric element 1 (ceramic component) that makes is according to the embodiment of the present invention described.
As shown in Figure 1, the structure of lamination type piezoelectric element 1 is: each 4 of the piezoelectric body layers 5 (ceramic layer) that will be formed with the piezoelectric body layer 3 (ceramic layer) of absolute electrode 2 and be formed with common electrode 4 are lamination alternately, and with the piezoelectric body layer 7 that is formed with terminal electrode and as the piezoelectric body layer 9 of substrate from clamping up and down.
In addition, each piezoelectric patches 3,5,7,9 is a main component with the lead zirconate titanate, and the rectangle that forms 10mm * 30mm, thickness 30 μ m is lamellar.And absolute electrode 2 and common electrode 4 are main component with silver and palladium, utilize silk screen printing to form Butut.Following each electrode is identical therewith.
Above the piezoelectric body layer 3, a plurality of absolute electrodes 2 are configured to rectangular at each.Each absolute electrode 2 keeps certain intervals between mutually, and not energising mutually, and be subjected to vibration effect between can preventing mutually.Conductive component (except that the piezoelectric body layer 3 of lower side) in the through hole 13 that is formed under each absolute electrode 2 and its outboard end on the piezoelectric body layer 3 is connected.
In addition, the edge on piezoelectric body layer 3 is formed with the common electrode 4,4 that is used to make branch to be in piezoelectric body layer 5 up and down and realizes the repeater electrode 6 that is electrically connected.This repeater electrode 6 be positioned at it under be formed at the through hole 8 on the piezoelectric body layer 3 conductive component link to each other.
In addition, at each above the piezoelectric body layer 5, on the thickness direction of lamination type piezoelectric element 1, the outboard end of each absolute electrode 2 of piezoelectric body layer 3 form opposed to each other repeater electrode 16 (below, with " thickness direction of lamination type piezoelectric element 1 ", promptly " thickness direction of piezoelectric body layer 3,5 " abbreviates " thickness direction " as).Each repeater electrode 16 be positioned at it under be formed on the through hole 13 on the piezoelectric body layer 5 conductive component link to each other.
And on piezoelectric body layer 5, be formed with rectangular common electrode 4.This common electrode 4 seen by thickness direction, coincides with part beyond the outboard end of each absolute electrode 2 of piezoelectric body layer 3, is densely covered shape (ベ shape).And common electrode 4 with on thickness direction, link to each other with conductive component in the repeater electrode 6 of piezoelectric body layer 3 is formed on through hole 8 on the piezoelectric body layer 5 opposed to each other.
In addition, on the piezoelectric body layer 7 of the superiors, each repeater electrode 16 with piezoelectric body layer 5 on thickness direction forms outer electrode 17 opposed to each other, and the repeater electrode 6 with piezoelectric body layer 3 on thickness direction forms outer electrode 18 opposed to each other.And, each outer electrode 17 under it be formed on piezoelectric body layer 7 on through hole 13 in conductive component link to each other, and outer electrode 18 under it be formed on piezoelectric body layer 7 on the interior conductive component of through hole 8 link to each other.In addition, on undermost piezoelectric body layer 9, rise, form the lamellar common electrode 19 of rectangle at regular intervals by the peripheral part of piezoelectric body layer 9.
And each outer electrode 17,18 of the superiors is equipped with the silver-plated electrode that is used for realizing with driving power the lead be electrically connected, plays a role as the terminal electrode of lamination type piezoelectric element 1.
By piezoelectric body layer 3,5,7,9 laminations that will be formed with aforesaid electrode pattern, each outer electrode 17 for the superiors, 4 absolute electrode 2 sandwich repeater electrodes 16, along the thickness direction proper alignment, each electrode 2,16,17 of proper alignment utilizes the conductive component in the through hole 13 to realize being electrically connected.Particularly, as shown in Figure 2, adjacent relative absolute electrode 2,2 sandwich repeater electrodes 16 on thickness direction utilize the conductive component 14 in the through hole 13 to realize being electrically connected.
In addition, clip repeater electrode 6 proper alignment on thickness direction for 18,4 common electrodes 4 of outer electrode and the undermost common electrode 19 of the superiors, each electrode 4,6,18,19 of proper alignment utilizes the conductive components 14 in the through hole 8 to realize being electrically connected.
By the electrical connection on this lamination type piezoelectric element 1, when between predetermined external electrode 17 and outer electrode 18, applying voltage, between the absolute electrode 2 of 17 times proper alignment of predetermined electrode and common electrode 4,19, be applied with voltage.Thus, in piezoelectric body layer 3,5, as shown in Figure 2, outboard end part and the part between the common electrode 4,19 in addition that is sandwiched in absolute electrode 2 produces electric field, and this part is shifted as active portion 21.So by selecting to apply the outer electrode 17 of voltage, the proper alignment that can make and be configured to selection in the rectangular absolute electrode 2 corresponding active portion 21 externally active portion under the electrode 17 21 is subjected to displacement along thickness direction.Such lamination type piezoelectric element 1 needs the drive source of the various devices of micro-displacement applicable to valve control of micropump etc.
Then with reference to Fig. 3～Fig. 7, be example with the manufacture method of above-mentioned lamination type piezoelectric element 1, the manufacture method of the ceramic component of embodiment of the present invention 1 is described.
At first, as shown in Figure 3, in the piezoelectric that with the lead zirconate titanate is main component, sneak into organic bond, organic solvent etc., make cream, this cream is stored in the jar 31.Then, with counterdie (holding member) 32 by spool 33 volume during another spool 33, on counterdie 32, form tellite (ceramic material layer) 34 by the scraper plate method as piezoelectric body layer 3,5,7,9.In addition, used thickness is that 54 μ m, width are that the clear PET film of 100mm is as counterdie 32.And the thickness that is formed on the top tellite 34 of counterdie 32 is 40 μ m.
After substrate forms operation, as shown in Figure 4, roll up during another spool 33 by spool 33 at the counterdie 32 that will be formed with tellite 34, use heating furnace 36 simultaneously counterdie 32 and tellite 34 to be heated.Make them force to shrink (heat treatment step).Thus, just can prevent counterdie 32 and the thermal contraction of tellite 34 in subsequent handling, positional precision that can be very high forms through hole and electrode pattern.
Behind heat treatment step, as shown in Figure 5, the counterdie 32 that will be formed with tellite 34 is on one side rolled up to another spool 33 from spool 33, utilize perforating device 37 to form the position reference hole on one side, with this position reference hole is benchmark, utilizes laser processing device 38 to form through hole 8,13 (not shown) (through hole formation operation) on the precalculated position of tellite 34.In addition, can be in follow-up cut-out operation form the hole, reference position in outer edge as the tellite 34 of remaining part, or also can stay at this to form the hole, reference position on white when existing on the outer edge of counterdie 32 when not forming white of staying of tellite 32.
As shown in Figure 6, after through hole forms operation, use silk-screen printing device 39, by the upper face side of tellite 34, filled conductive cream in through hole 8,13 (paste electric conducting material) is implemented silk screen printing (the 1st printing process).Then, for making conductive paste at through hole 8,13 inner dryings, curing and then formation conductive component 14, counterdie 32 and tellite 34 are put into drying machine (the 1st drying process), and before the 1st drying process, with the temperature that is lower than this baking temperature, counterdie 32 and tellite 34 (heating process) are carried out the timing heating.Utilize this heating to make conductive paste softening, make the conductive paste can be positively by flowing to the bottom in the through hole 8,13.
Behind the 1st drying process, the silk screen printing (the 2nd printing process) of conductive paste is carried out in the precalculated position on tellite 34.Then counterdie 32 and tellite 34 are put into drying machine, make conductive paste drying, curing, form (the 2nd drying processes) such as each electrodes 2,4,17,19.In addition, used conductive paste mixes organic bond, organic solvent etc. and makes in the 1st and the 2nd printing process in the metal material of silver that contains predetermined ratio and palladium.
As shown in Figure 7, behind the 2nd drying process, use stripping off device 41 to peel off the tellite 34a of certain-length by counterdie 32, the lamination sequential laminating tellite 34a according to same with above-mentioned lamination type piezoelectric element 1 carries out pre-crimping (lamination operation).
After the lamination operation,, with each tellite 34a thermo-compressed, make laminate blank (crimping process) thus while heat to the pressurization of lamination direction.Go out a plurality of laminate blank elements by this laminate blank by the preliminary dimension cutting then, the laminate blank element that cuts out is implemented degreasing, fired processing, make lamination type piezoelectric element 1 (finishing step) through the formation of terminal electrode, split pole processing etc.
Heat treatment step to present embodiment is described in detail then.
In this heat treatment step, be preferably with the temperature more than 90 ℃, below 150 ℃ and make counterdie 32 and tellite 34 realization thermal contractions.And consider that thermal contraction effect and manufacturing cost, heat treatment time are preferably 2～5 minutes.
At this, the temperature during thermal contraction is preferably above the reasons are as follows at 90 ℃:, in the above-mentioned the 1st and the 2nd drying process, be to be higher than 50 ℃ (being preferably more than 70 ℃), to be lower than drying, the curing of carrying out conductive paste in 90 ℃ the temperature range.Therefore, when making counterdie 32 and tellite 34 thermal contractions with the temperature more than 90 ℃, can make counterdie 32 and tellite 34 in drying process, almost not have thermal contraction, therefore can prevent the distortion of through hole 8,13 in this drying process, or prevent that through hole 8,13 is offset with respect to the datum hole occurrence positions.
And the temperature during thermal contraction is preferably the reasons are as follows below 150 ℃:, when when being higher than 150 ℃ temperature heating, then moderate finite deformation or fusion might take place in counterdie 32.In addition, the bond composition of tellite 34 also might go bad.
Like this, by forming at substrate between operation and the through hole formation operation heat treatment step is set, even in the subsequent handling of through hole formation operation counterdie 32 and tellite 34 are heated, thermal contraction can further not take place in counterdie 32 and tellite 34 yet.
Thus, just can prevent that the datum hole generation strain or its formation position that utilize perforating device 37 to form from problems such as skew taking place, therefore, can be benchmark with this datum hole, forms through hole 8,13 with high accuracy on the precalculated position of tellite 34.And, can high accuracy filled conductive cream in through hole 8,13 carry out silk screen printing or the silk screen printing of conductive paste and the lamination of implementing each tellite 34a with high accuracy in the lamination operation are carried out in the precalculated position on tellite 34.In addition, be provided with under the situation in position reference hole, when heat treatment step not being set, then might produce big offset in the white portion of staying of the counterdie 32 that does not form tellite 32.So it is very effective that heat treatment step is set in this case.
Then, at manufactured size be " 10mm * 30mm; thickness is 30 μ m " piezoelectric body layer 3 above when being formed with the lamination type piezoelectric element 1 of 300 (4 row 75 row) absolute electrodes, to the situation of having implemented heat treatment step with do not implement the heat treatment step situation, measure the relative lamination skew of each piezoelectric body layer 3,5 on the lamination type piezoelectric element 1.As a result, the lamination skew of not implementing under the heat treatment step situation is 50 μ m～100 μ m, otherwise under the situation of having implemented heat treatment step, the lamination skew is below the 20 μ m.
As mentioned above, owing to form in the subsequent handling of operation at through hole, thermal contraction takes place in counterdie 32 and tellite 34 hardly, so can prevent the distortion of the through hole 8,13 that formed by laser processing device 38.Can in through hole 8,13, form conductive component 14 reliably thus.
From the above mentioned, manufacture method according to the ceramic component of present embodiment, form between the operation heat treatment step be set by form operation and through hole at substrate, just can be made into utilize through hole 8,13 the upper face side of piezoelectric body layer 3 and below realize the lamination type piezoelectric element 1 that is electrically connected reliably between the side.
Then with reference to Fig. 8～Figure 10, be example with the manufacture method of above-mentioned lamination type piezoelectric element 1, the manufacture method of the ceramic component of invention execution mode 2 is described.
In the present embodiment, the same with above-mentioned execution mode 1, form operation, heat treatment step, through hole through substrate and form operation, the 1st printing process, heating process, the 1st drying process, the 2nd printing process, the 2nd drying process, lamination operation, crimping process and finishing step and make lamination type piezoelectric element 1.
Through hole formation operation to present embodiment is described in detail then.
As shown in Figure 8, in through hole forms operation, the counterdie 32 that is formed with tellite 34 by vacuum suction on the articles holding table 43 that is disposed between the spool 33,33.Counterdie 32 and tellite 34 vacuum suction on articles holding table 43, are utilized laser processing device 38,, laser L is converged on the focal point P in precalculated position of tellite 34 by the upper face side irradiating laser L of tellite 34.
At this moment, focal point P is with respect to the position of tellite 34, be to photograph, be located on precalculated position with respect to the position reference hole according to this image data with a plurality of position references hole (position reference portion) that CCD camera (camera) forms utilizing perforating device 37.
In addition, laser L is the pulsed oscillation laser of 3 subharmonic of Nd:YAG laser, and illuminate condition is: frequency 30kHz, pulse duration 210nsec, average power 5W.Then, for on tellite 34, forming through hole 13, and make through fusion etc. and be formed on hole on the counterdie 32 below desired depth, set the number of times (that is, utilize laser comes and goes the irradiation number of times when transferring Q to produce vibration) of emission laser on the precalculated position of tellite 34 according to the thickness of tellite 34 and composition etc.In the present embodiment, for thickness be 40 μ m, to consist of with (Pb0.97Sr0.03) [Ti0.564Zr0.535] be principal component and with the Nb that is 0.5 quality % with respect to 1 mole of principal component addition
2O
3During for the tellite 34 irradiating laser L of accessory ingredient, the irradiation number of times of setting is 30 times.
By this laser L irradiation, as shown in Figure 9, position fusion, the evaporation of tellite 34 Stimulated Light L irradiation form through hole 13, almost do not have flying to pile up around the through hole 13.Thereby, because of the obstruction to through hole 13 that can prevent that flying from causing, so by filled conductive cream in through hole 13, carry out silk screen printing, can in through hole 13, form conductive component 14 reliably.
And, in general, when forming through hole by irradiating laser, through hole be shaped as taper to the expansion of laser entrance face one side, but, just can suppress the situation generation that through hole expands to taper by for example transferring Q to make the vibration of laser L pulsing.In the present embodiment, can suppress the degree that the through hole upper face side enlarges is: when lateral aperture below the through hole 13 was 40 μ m, the upper face side aperture was 50 μ m.
Thus, just can make to comprise that the top absolute electrode of being formed at of this through hole 13 2 is thinner shape, and then can realize the miniaturization of the highly integrated of absolute electrode 2 and lamination type piezoelectric element 1.And, can make the conductive pastes that are filled in the through hole 13 be easy to upper face side by tellite 34 flow to below side, thereby can make conductive paste positively flow to bottom in the through hole 13.
In addition, as shown in Figure 9, set irradiation number of times irradiating laser L as described above, just can prevent the damage of counterdie 32.In the present embodiment, the lesion depths of counterdie 32 can be controlled at below the 18 μ m.
Like this, just can prevent to be filled in the through hole 13 conductive paste by ooze out between tellite 34 and the counterdie 32 tellite 34 below.And, because the damage of tellite 34 is minimum,, in addition, utilize this vacuum suction can prevent the generation of the situation such as vacant in counterdie 32 damages, hole so in through hole forms the subsequent handling of operation, can carry out vacuum suction to counterdie 32 reliably.
Then, at manufactured size be " 10mm * 30mm, thickness are 30 μ m " piezoelectric body layer 3 above when being formed with the lamination type piezoelectric element 1 of 300 (4 row 75 row) absolute electrodes 2, calculate its qualification rate, then can obtain following result.That is, when being formed through hole by laser radiation when vacant on counterdie 32, qualification rate is less than 20%; The lesion depths of counterdie 32 is when 18～48 μ m, and qualification rate is about 50%.And when the lesion depths of counterdie 32 during at 0～18 μ m, qualification rate is greater than 90%.And when being subjects with 140 lamination type piezoelectric elements 1, when all normally obtaining electric capacity with absolute electrode 2 corresponding 300 places, be qualified product, calculate qualification rate.
Below, the comparative result of the laser radiation that forms laser radiation in the operation and other situation at above-mentioned through hole is described.
As shown in figure 10, when using CO
2During laser (wavelength is 10.6 μ m), the flying bulk deposition that is formed by laser radiation is around through hole.And when first-harmonic (wavelength is 1064nm) continuous (CW) vibration of YAG laser, it is big that the through hole of laser entrance face side becomes.And when making first-harmonic (wavelength is 1064nm) the pulsing vibration of YAG laser by accent Q, thermal impact increases, and is difficult to the aperture of control through hole, and it is also a lot of to process deposit.
Otherwise, when making 3 subharmonic (wavelength is 355nm) the pulsing vibration of YAG laser by accent Q (present embodiment), almost do not have flying to be deposited in around the through hole, and also can suppress the through hole expansion of laser entrance face side.And when when transferring Q to make 2 subharmonic (wavelength is 532nm) the pulsing vibration of YAG laser, also can obtain and same effect when transferring Q to make the 3 subharmonic pulsings vibration of YAG laser.According to above-mentioned comparative result, the starting of oscillation laser that is derived from the YAG laser is preferably wavelength conversion to the laser below the 532nm.
As mentioned above, according to the manufacture method of the ceramic component of present embodiment, on tellite 34, form good through hole 8,13 in the operation owing to can form, so can in through hole 8,13, form reliable conductive component 14 at through hole.Thus, can in each piezoelectric body layer 3 for example, utilize the conductive components 14 in the through hole 13 that the absolute electrode 2 of upper face side reliably is connected with repeater electrode 16 realizations of following side.In addition, in each piezoelectric body layer 5, utilize the conductive component 14 in the through hole 8,13 to make the common electrode 4 of upper face side realize reliably being connected with the absolute electrode 2 of following side.Thereby, can make between the upper face side that utilizes through hole 8,13 to make piezoelectric body layer 3,5 and the following side and form the lamination type piezoelectric element 1 that is electrically connected reliably.
Below with reference to Figure 11～Figure 15, be example with the manufacture method of above-mentioned lamination type piezoelectric element 1, the manufacture method of the ceramic component of embodiment of the present invention 3 is described.
In the present embodiment, the same with above-mentioned execution mode 1, form operation, heat treatment step, through hole formation operation, the 1st printing process, heating process, the 1st drying process, the 2nd printing process, the 2nd drying process, lamination operation through substrate, crimping process and finishing step, and make lamination type piezoelectric element 1.
The 1st printing process, heating process and the 1st drying process to present embodiment is described in more detail then.
As shown in figure 11, in the 1st printing process, 34a forms the conductive fabric Figure 63 that comprises through hole 13 on tellite 34.If after the 1st printing process has just finished, just put tellite 34 into drying oven 52, then conductive paste can not drop to through hole 13 interior bottoms naturally and promptly solidifies, and might cause loose contact from now on.But because in the present embodiment, between the 1st printing process and the 1st drying process, be provided with heating process, so can prevent the generation of this loose contact.
That is, in heating process, tellite 34 is put into heating furnace 51, to be lower than the heating-up temperature heating of baking temperature, make the conductive paste that forms conductive fabric Figure 63 softening, therefore, conductive paste can positively flow to the bottom in the through hole 13.
Then, in the 1st drying process, tellite 34 is put into drying oven 52, with the baking temperature heating, make conductive paste drying, curing then, so, as shown in figure 12, can in through hole 13, form continuous conductive component 14 from upper end to the lower end of through hole 13.
Like this, just can be in through hole 8,13 formation can be on tellite 34 the 34a side and below realize the reliable conductive component 14 that is electrically connected between the 34b side, so, according to the manufacture method of the ceramic component of present embodiment, just can be made into utilize through hole 8,13 the upper face side of piezoelectric body layer 3,5 and below form the lamination type piezoelectric element 1 that is electrically connected reliably between the side.
In addition, in above-mentioned heating process, be preferably heating-up temperature is located in 25 ℃～50 ℃ the temperature range, and be more than 1 minute heating time.And the baking temperature in above-mentioned the 1st drying process is in being higher than 50 ℃ (being preferably more than 70 ℃), being lower than 90 ℃ temperature range.
At this, heating-up temperature preferably is located at 25 ℃～50 ℃ the interior reason of temperature range as shown in Figure 13.Figure 13 is illustrated in manufactured size when being formed with the lamination type piezoelectric element 1 of 300 (4 row, 75 row) absolute electrodes 2 above the piezoelectric body layer 3 of " 10mm * 30mm; thickness is 30 μ m ", the qualification rate schematic diagram of the lamination type piezoelectric element 1 when setting heating time and be 2 minutes (necessarily) and making the heating-up temperature variation.By the schematic diagram of Figure 13 as can be known: when heating-up temperature was in 25 ℃～50 ℃ scope, qualification rate surpassed 90%; And when surpassing 50 ℃, qualification rate sharply descends.Its main cause can think because heating-up temperature when surpassing 50 ℃, and conductive paste promptly solidifies before the bottom in arriving through hole 13.
In addition, be preferably the reason that to be set in heating time more than 1 minute as can be known by Figure 14 and Figure 15.Figure 14 represents that heating-up temperature is made as 25 ℃ (necessarily) and the qualification rate schematic diagram of lamination type piezoelectric element 1 when changed heating time (with Figure 13 time specification identical).Figure 15 represents that heating-up temperature is the qualification rate schematic diagram of 50 ℃ (necessarily constant) lamination type piezoelectric element 1 when changed heating time (with Figure 13 time specification identical).By Figure 14 and figure shown in Figure 15 as can be known, be more than 1 minute the time when heating time, qualification rate surpasses 90%; And when the heating time of less than in the time of 1 minute, qualification rate sharply descends.Its main cause can think since heating time less than in the time of 1 minute, heating process promptly finishes before the bottom of conductive paste in arriving through hole 13.In addition, when long-time heating, can cause operating efficiency to descend, so under present embodiment, preferably set heating time in 1～3 minute scope.
Then with reference to Figure 16～Figure 17, be example with the manufacture method and the manufacturing system of above-mentioned lamination type piezoelectric element 1, the manufacture method and the manufacturing system of the ceramic component of invention execution mode 4 described.
In the present embodiment, the same with above-mentioned execution mode 1, form operation, heat treatment step, through hole through substrate and form operation, the 1st printing process, heating process, the 1st drying process, the 2nd printing process, the 2nd drying process, lamination operation, crimping process and finishing step and make lamination type piezoelectric element 1.
With the action of the manufacturing system of the ceramic component of present embodiment, through hole is formed operation, the 1st printing process and the 2nd printing process describe then.As shown in figure 17, manufacturing system 60 has laser processing device (through hole forms mechanism) 38, silk-screen printing device (printing mechanism) 39 and position relation detecting device (testing agency) 61.
Shown in Figure 16 (a), in through hole forms operation, form 2 and on another outer edge, form 1, totally 3 position reference holes (the 1st mark) 45 in an outer edge of tellite 34 with perforating device 37.Then, when forming through hole 13, each position datum hole 45 is made a video recording with the CCD camera 46a (comprising laser processing device 38) that is arranged on each position datum hole 45 top.Image data according to this shooting makes counterdie 32 and tellite 34 move, locate, and forms through hole 13 on the precalculated position of tellite 34.Thus, forming in the operation at through hole, by laser processing device 38, is position reference with position reference hole 45, forms through hole 13 on tellite 34.
In addition, in Figure 16,, only represented 1 through hole 13, and in fact, on tellite 34, be formed with a plurality of through holes 8,13 for simple and clear.And as mentioned above, the formation position in position reference hole 45 is not limited to the outer edge as the tellite 34 of the defective material in the follow-up cut-out operation, on the outer edge of counterdie 32, exist do not form tellite 34 stay white part the time, also can be formed on this and stay white part.
Then, shown in Figure 16 (b), in the 1st printing process, when being printed onto the conductive paste filling in the through hole 13, each position datum hole 45 is made a video recording by the CCD camera 46b (comprising silk-screen printing device 39) that is arranged on each position datum hole 45 top.Image data according to this shooting makes counterdie 32 and tellite 34 move, locate, and printing comprises the substrate Butut (conduction Butut) 47 of this through hole 13 to cover an end face of through hole 13 on the precalculated position of tellite 34.Meanwhile, by same plate-making, print 3 typographic(al) marks (the 2nd mark) 48.This typographic(al) mark 48 forms 1 in an outer edge of tellite 34, forms 2 in another outer edge.
Then, shown in Figure 16 (c), in the 2nd printing process, during as the electrode pattern 49 of absolute electrode 2 grades, utilize the CCD camera 46c (comprising position relation detecting device 61) that is arranged on each position datum hole 45 and each typographic(al) mark 48 top that each position datum hole 45 and each typographic(al) mark 48 are made a video recording in printing.In position relation detecting device 61, the position in the X-Y coordinate system concerns according to image data detection position datum hole of taking 45 and typographic(al) mark 48 then.
By detection to this position relation, for example, when typographic(al) mark 48 with respect to position reference hole 45 on Y direction during the occurrence positions skew, primary backing Figure 47 is through hole 13 occurrence positions skew (with reference to Figure 16 (c)) on Y direction relatively also.That is, the position relation in the X-Y coordinate system by detection position datum hole 45 and typographic(al) mark 48 can be tried to achieve the offset of primary backing Figure 47 with respect to through hole 13.
Thus, when primary backing Figure 47 is offset with respect to through hole 13 occurrence positions,, counterdie 32 and tellite 34 are moved according to the relation of the position between position reference hole 45 and the typographic(al) mark 48, electrode pattern 49 makes it comprise primary backing Figure 47 really tellite 34 location.And, FEEDBACK CONTROL is carried out in the location of the tellite in the 1st printing process 34, to revise the offset of new primary backing Figure 47 with respect to through hole 13 according to the relation of the position between position reference hole 45 and the typographic(al) mark 48.
And, be not limited only to the mode that electrode pattern 49 is combined with primary backing Figure 47 as the localization method in the 2nd printing process.For example, both can adopt and make electrode pattern 49 combine, also can adopt the mode that electrode pattern 49 and primary backing Figure 47 are combined with respect to the centre position of the offset of through hole 13 with through hole 13.
Like this, position relation by detection position datum hole 45 and typographic(al) mark 48, when offset has taken place with respect to through hole 13 in primary backing Figure 47, just can in the 2nd printing process, revise the formation position of electrode pattern 49 with respect to primary backing Figure 47, and, utilize FEEDBACK CONTROL, can revise the formation position of primary backing Figure 47 with respect to through hole 13.And when primary backing Figure 47 consequently can not use greater than predetermined value with respect to the offset of through hole 13, the tellite 34 that then will be formed with this primary backing Figure 47 was judged to be defective item, can immediately it be removed, and flows to subsequent handling to avoid it.In addition, in the lamination operation, also can carry out the lamination of tellite 34 accurately according to the relation of the position between position reference hole 45 and the typographic(al) mark 48.
From the above mentioned, manufacture method and manufacturing system according to the ceramic component of present embodiment, just can improve the positional precision with respect to through hole 13 such as primary backing Figure 47 and electrode pattern 49, can be made into utilize through hole 8,13 the upper face side of piezoelectric body layer 3 and below form the reliable lamination type piezoelectric element 1 that is electrically connected between the side.
And be formed in according to the manufacture method of the ceramic component of present embodiment the piezoelectric body layer 3 that is of a size of " 10mm * 30mm, thickness are 30 μ m " above be formed with the lamination type piezoelectric element 1 of 300 (4 row, 75 row) absolute electrodes 2, obtain following result.That is, compare when positioning with the position relation according to position reference hole 45 and typographic(al) mark 48, when positioning according to the either party, the loose contact of through hole 8,13 has increased by 30% unexpectedly.In addition, when positioning according to the position of position reference hole 45 and typographic(al) mark 48 relation, the relative lamination skew of each piezoelectric body layer 3,5 can be controlled in below the 20 μ m, by comparison, when positioning according to the either party, the relative lamination skew average out to 50 μ m of each piezoelectric body layer 3,5.
The present invention is not limited only to above-mentioned execution mode.For example, the formation position that needs only the 1st and the 2nd mark can be surveyed, and is promptly applicable.So the 1st mark is not limited to also can be groove or typographic(al) mark as the described through hole of above-mentioned execution mode, the formation object of the 1st mark also is not limited only to ceramic materials such as tellite, and also can be holding members such as counterdie.And the shape of the 1st and the 2nd mark also is not limited to as the described circle of above-mentioned execution mode, and goes back linear or cross.In addition, when the 1st and the 2nd mark be shaped as circle the time, when forming 2 respectively, can detect the two-dimensional position relation of the 1st mark and the 2nd mark, and, form 3 respectively when above as described in the above-mentioned execution mode, can further improve the accuracy of detection of position relation.
Claims (9)
1. a utilization is formed on through hole on the ceramic layer and makes the manufacture method that forms the ceramic component that is electrically connected between end face of described ceramic layer and the other end, it is characterized in that having:
In the operation of holding member surface formation as the ceramic material layer of described ceramic layer;
The operation that makes described holding member and described ceramic material layer carry out thermal contraction; With
On the described ceramic material layer of thermal contraction, form the operation of through hole.
2. the manufacture method of ceramic component as claimed in claim 1 is characterized in that, has: after forming described through hole, and the operation of printing paste electric conducting material on described ceramic material layer; With the dry operation that is printed on the electric conducting material on the described ceramic material layer under predetermined temperature,
In described thermal contraction operation, make described holding member and described ceramic material layer realize thermal contraction with the temperature that is higher than described baking temperature.
3. the manufacture method of the ceramic component described in claim 1 is characterized in that,
Utilize the laser radiation of 2 subharmonic of YAG laser or 3 subharmonic to contain lead-containing compounds and form the ceramic material of described ceramic layer, and on described ceramic material, form described through hole.
4. the manufacture method of the ceramic component described in claim 3 is characterized in that, described compound is a lead zirconate titanate.
5. the manufacture method of the ceramic component described in claim 3 or 4 is characterized in that, makes described laser pulsing vibration.
6. the manufacture method of ceramic component as claimed in claim 5 is characterized in that, utilizes and transfers Q that described laser is vibrated.
7. the manufacture method of the ceramic component described in claim 1 is characterized in that, also has:
By electric conducting material being printed on the ceramic material as described ceramic layer, and form the operation of the conduction Butut that covers an end face that is formed at the described through hole on the described ceramic material; With
To be printed on the operation of the described electric conducting material drying under predetermined temperature on the described ceramic material,
Between the operation of operation that forms described conduction Butut and dry described electric conducting material, to be lower than the heating-up temperature of described baking temperature, heating is printed with the ceramic material of described electric conducting material.
8. the manufacture method of ceramic component as claimed in claim 7 is characterized in that, described heating-up temperature is in 25 ℃～50 ℃ scope.
9. the manufacture method of the ceramic component described in claim 1 is characterized in that, also has:
Form before the described through hole, becoming the operation that forms the 1st mark on the ceramic material of described ceramic layer;
Be labeled as position reference, the operation of the described through hole of formation on described ceramic material with the described the 1st;
Be labeled as position reference with the described the 1st, by electric conducting material is printed onto on the described ceramic material, and forms the 2nd mark and cover the operation of the conduction Butut of described through hole one end face;
Detect the detection operation of the position relation between described the 1st mark and described the 2nd mark; With
On described ceramic material, form the operation of electrode pattern,
In the operation that forms described electrode pattern, revise the formation position of described electrode pattern according to the position relation of detected described the 1st mark and the 2nd mark.
Applications Claiming Priority (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003081195 | 2003-03-24 | ||
| JP2003080933A JP4330908B2 (en) | 2003-03-24 | 2003-03-24 | Method for manufacturing ceramic element |
| JP2003080933 | 2003-03-24 | ||
| JP2003-081195 | 2003-03-24 | ||
| JP2003-080933 | 2003-03-24 | ||
| JP2003081195 | 2003-03-24 | ||
| JP2003083520 | 2003-03-25 | ||
| JP2003083520A JP4153338B2 (en) | 2003-03-25 | 2003-03-25 | Method and system for manufacturing ceramic element |
| JP2003083532 | 2003-03-25 | ||
| JP2003-083520 | 2003-03-25 | ||
| JP2003083532A JP4153339B2 (en) | 2003-03-25 | 2003-03-25 | Manufacturing method of ceramic element |
| JP2003-083532 | 2003-03-25 |
Publications (2)
| Publication Number | Publication Date |
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| CN1532957A CN1532957A (en) | 2004-09-29 |
| CN100428518C true CN100428518C (en) | 2008-10-22 |
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| TW (1) | TW200428684A (en) |
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| CN106313925B (en) * | 2015-07-03 | 2020-03-20 | 深圳光启尖端技术有限责任公司 | Preparation method of metamaterial |
| CN110253161B (en) * | 2019-06-25 | 2022-01-21 | 西南应用磁学研究所 | Rapid laser through hole method for gyromagnetic ferrite substrate |
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| US5043223A (en) * | 1987-01-22 | 1991-08-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic substrate and method for making the same |
| JPH0766555A (en) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JPH1084185A (en) * | 1996-09-09 | 1998-03-31 | Hitachi Ltd | Manufacture of multilayer ceramic board |
| JPH1084184A (en) * | 1996-09-06 | 1998-03-31 | Sumitomo Kinzoku Electro Device:Kk | Manufacturing method of ceramic multilayer board |
| JPH11214824A (en) * | 1998-01-21 | 1999-08-06 | Hitachi Telecom Technol Ltd | Printing mask and manufacture of printed wiring board using the same |
| US6316782B1 (en) * | 1998-06-16 | 2001-11-13 | The Board Of Regents For Oklahoma State University | System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence |
| JP2002026487A (en) * | 2000-07-05 | 2002-01-25 | Sony Corp | Device and method for correcting reference hole of substrate |
-
2004
- 2004-03-19 TW TW93107518A patent/TW200428684A/en not_active IP Right Cessation
- 2004-03-24 CN CNB200410008849XA patent/CN100428518C/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5043223A (en) * | 1987-01-22 | 1991-08-27 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic substrate and method for making the same |
| JPH0766555A (en) * | 1993-08-27 | 1995-03-10 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic component |
| JPH1084184A (en) * | 1996-09-06 | 1998-03-31 | Sumitomo Kinzoku Electro Device:Kk | Manufacturing method of ceramic multilayer board |
| JPH1084185A (en) * | 1996-09-09 | 1998-03-31 | Hitachi Ltd | Manufacture of multilayer ceramic board |
| JPH11214824A (en) * | 1998-01-21 | 1999-08-06 | Hitachi Telecom Technol Ltd | Printing mask and manufacture of printed wiring board using the same |
| US6316782B1 (en) * | 1998-06-16 | 2001-11-13 | The Board Of Regents For Oklahoma State University | System and method for the detection of abnormal radiation exposures using pulsed optically stimulated luminescence |
| JP2002026487A (en) * | 2000-07-05 | 2002-01-25 | Sony Corp | Device and method for correcting reference hole of substrate |
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| CN1532957A (en) | 2004-09-29 |
| TWI334662B (en) | 2010-12-11 |
| TW200428684A (en) | 2004-12-16 |
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