TWI332129B - Process control system and method of performing a fabrication process - Google Patents

Process control system and method of performing a fabrication process Download PDF

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Publication number
TWI332129B
TWI332129B TW092126058A TW92126058A TWI332129B TW I332129 B TWI332129 B TW I332129B TW 092126058 A TW092126058 A TW 092126058A TW 92126058 A TW92126058 A TW 92126058A TW I332129 B TWI332129 B TW I332129B
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TW
Taiwan
Prior art keywords
quality
parameters
component
key parameters
matrix
Prior art date
Application number
TW092126058A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408919A (en
Inventor
Khoi A Phan
Bhanwar Singh
Bharath Rangarajan
Ramkumar Subramanian
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200408919A publication Critical patent/TW200408919A/zh
Application granted granted Critical
Publication of TWI332129B publication Critical patent/TWI332129B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
TW092126058A 2002-09-30 2003-09-22 Process control system and method of performing a fabrication process TWI332129B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (2)

Publication Number Publication Date
TW200408919A TW200408919A (en) 2004-06-01
TWI332129B true TWI332129B (en) 2010-10-21

Family

ID=32030023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092126058A TWI332129B (en) 2002-09-30 2003-09-22 Process control system and method of performing a fabrication process

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

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CN106971953A (zh) * 2015-10-01 2017-07-21 格罗方德半导体公司 制造制程中的误差检测方法

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KR102083234B1 (ko) * 2015-07-16 2020-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10241502B2 (en) 2015-10-01 2019-03-26 Globalfoundries Inc. Methods of error detection in fabrication processes
US10311186B2 (en) * 2016-04-12 2019-06-04 Globalfoundries Inc. Three-dimensional pattern risk scoring
CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
CN110071059B (zh) * 2019-03-29 2020-12-22 福建省福联集成电路有限公司 一种监控蚀刻的工艺方法及系统
CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
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Publication number Priority date Publication date Assignee Title
CN106971953A (zh) * 2015-10-01 2017-07-21 格罗方德半导体公司 制造制程中的误差检测方法
CN106971953B (zh) * 2015-10-01 2020-10-02 格罗方德半导体公司 制造制程中的误差检测方法

Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
DE10393394B4 (de) 2016-10-13
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
JP4478574B2 (ja) 2010-06-09
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TW200408919A (en) 2004-06-01
KR100994271B1 (ko) 2010-11-12

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