JP4478574B2 - 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム - Google Patents

製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム Download PDF

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JP4478574B2
JP4478574B2 JP2004541539A JP2004541539A JP4478574B2 JP 4478574 B2 JP4478574 B2 JP 4478574B2 JP 2004541539 A JP2004541539 A JP 2004541539A JP 2004541539 A JP2004541539 A JP 2004541539A JP 4478574 B2 JP4478574 B2 JP 4478574B2
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manufacturing process
quality
parameters
manufacturing
acceptable
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JP2004541539A
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Japanese (ja)
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JP2006501673A (ja
JP2006501673A5 (https=
Inventor
エイ． ファン コイ
シン バンウォー
ランガラジャン バラス
サブラマニアン ランクマー
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
JP2004541539A 2002-09-30 2003-09-12 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム Expired - Lifetime JP4478574B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system
PCT/US2003/028682 WO2004031859A2 (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (3)

Publication Number Publication Date
JP2006501673A JP2006501673A (ja) 2006-01-12
JP2006501673A5 JP2006501673A5 (https=) 2009-01-15
JP4478574B2 true JP4478574B2 (ja) 2010-06-09

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JP2004541539A Expired - Lifetime JP4478574B2 (ja) 2002-09-30 2003-09-12 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

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CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
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Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
DE10393394B4 (de) 2016-10-13
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TWI332129B (en) 2010-10-21
TW200408919A (en) 2004-06-01
KR100994271B1 (ko) 2010-11-12

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