GB2410834B - Comprehensive integrated lithographic process control system based on product design and yield feedback system - Google Patents

Comprehensive integrated lithographic process control system based on product design and yield feedback system

Info

Publication number
GB2410834B
GB2410834B GB0505193A GB0505193A GB2410834B GB 2410834 B GB2410834 B GB 2410834B GB 0505193 A GB0505193 A GB 0505193A GB 0505193 A GB0505193 A GB 0505193A GB 2410834 B GB2410834 B GB 2410834B
Authority
GB
United Kingdom
Prior art keywords
design
product
process control
lithographic process
control system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0505193A
Other languages
English (en)
Other versions
GB0505193D0 (en
GB2410834A (en
Inventor
Khoi A Phan
Bhanwar Singh
Bharath Rangarajan
Ramkumar Subramanian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0505193D0 publication Critical patent/GB0505193D0/en
Publication of GB2410834A publication Critical patent/GB2410834A/en
Application granted granted Critical
Publication of GB2410834B publication Critical patent/GB2410834B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
GB0505193A 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system Expired - Lifetime GB2410834B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system
PCT/US2003/028682 WO2004031859A2 (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (3)

Publication Number Publication Date
GB0505193D0 GB0505193D0 (en) 2005-04-20
GB2410834A GB2410834A (en) 2005-08-10
GB2410834B true GB2410834B (en) 2006-04-19

Family

ID=32030023

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0505193A Expired - Lifetime GB2410834B (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

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US7808643B2 (en) * 2005-02-25 2010-10-05 Nanometrics Incorporated Determining overlay error using an in-chip overlay target
US7477396B2 (en) * 2005-02-25 2009-01-13 Nanometrics Incorporated Methods and systems for determining overlay error based on target image symmetry
US20070240121A1 (en) * 2006-01-31 2007-10-11 Caterpillar Inc. System for evaluating component value
US7352439B2 (en) * 2006-08-02 2008-04-01 Asml Netherlands B.V. Lithography system, control system and device manufacturing method
GB0621408D0 (en) * 2006-10-27 2006-12-06 Ibm A method, apparatus and software for determining a relative measure of build quality for a built system
US7359820B1 (en) * 2007-01-03 2008-04-15 International Business Machines Corporation In-cycle system test adaptation
KR101504504B1 (ko) * 2008-05-21 2015-03-20 케이엘에이-텐코어 코오포레이션 툴 및 프로세스 효과들을 분리하기 위한 기판 매트릭스
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KR101508641B1 (ko) * 2013-08-08 2015-04-08 국립대학법인 울산과학기술대학교 산학협력단 생산 공정에서 데이터마이닝을 이용하여 제품 상태를 예측하는 장치 및 방법
KR102083234B1 (ko) * 2015-07-16 2020-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10289109B2 (en) * 2015-10-01 2019-05-14 Globalfoundries Inc. Methods of error detection in fabrication processes
US10241502B2 (en) 2015-10-01 2019-03-26 Globalfoundries Inc. Methods of error detection in fabrication processes
US10311186B2 (en) * 2016-04-12 2019-06-04 Globalfoundries Inc. Three-dimensional pattern risk scoring
CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
CN110071059B (zh) * 2019-03-29 2020-12-22 福建省福联集成电路有限公司 一种监控蚀刻的工艺方法及系统
CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
DE102020215716A1 (de) 2020-12-11 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie
KR20230149310A (ko) * 2021-03-02 2023-10-26 에이에스엠엘 네델란즈 비.브이. 계측 시스템의 작동, 리소그래피 장치, 및 그 방법
US11955358B2 (en) * 2021-09-24 2024-04-09 Applied Materials, Inc. Model-based failure mitigation for semiconductor processing systems
CN114326620B (zh) * 2021-12-25 2022-09-27 北京国控天成科技有限公司 一种全流程自动控制方法、装置及电子设备
US12321159B2 (en) * 2022-02-04 2025-06-03 University Of South Florida Systems, methods, and media for monitoring the production process of a product
JP2024058323A (ja) * 2022-10-14 2024-04-25 株式会社東芝 管理方法、管理システム、プログラム、及び記憶媒体
WO2026070761A1 (ja) * 2024-09-30 2026-04-02 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

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Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
DE10393394B4 (de) 2016-10-13
US6915177B2 (en) 2005-07-05
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
JP4478574B2 (ja) 2010-06-09
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TWI332129B (en) 2010-10-21
TW200408919A (en) 2004-06-01
KR100994271B1 (ko) 2010-11-12

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PE20 Patent expired after termination of 20 years

Expiry date: 20230911