KR100994271B1 - 제품 설계 및 수율 피드백 시스템에 기초하는 포괄적인집적 리소그래피 공정 제어 시스템 - Google Patents

제품 설계 및 수율 피드백 시스템에 기초하는 포괄적인집적 리소그래피 공정 제어 시스템 Download PDF

Info

Publication number
KR100994271B1
KR100994271B1 KR1020057005554A KR20057005554A KR100994271B1 KR 100994271 B1 KR100994271 B1 KR 100994271B1 KR 1020057005554 A KR1020057005554 A KR 1020057005554A KR 20057005554 A KR20057005554 A KR 20057005554A KR 100994271 B1 KR100994271 B1 KR 100994271B1
Authority
KR
South Korea
Prior art keywords
parameters
manufacturing process
quality
design
quality indicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020057005554A
Other languages
English (en)
Korean (ko)
Other versions
KR20050062576A (ko
Inventor
콰이 에이. 판
반와르 싱
바라쓰 랑가라잔
람쿠마르 서브라마니안
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20050062576A publication Critical patent/KR20050062576A/ko
Application granted granted Critical
Publication of KR100994271B1 publication Critical patent/KR100994271B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
KR1020057005554A 2002-09-30 2003-09-12 제품 설계 및 수율 피드백 시스템에 기초하는 포괄적인집적 리소그래피 공정 제어 시스템 Expired - Lifetime KR100994271B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,569 2002-09-30
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (2)

Publication Number Publication Date
KR20050062576A KR20050062576A (ko) 2005-06-23
KR100994271B1 true KR100994271B1 (ko) 2010-11-12

Family

ID=32030023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057005554A Expired - Lifetime KR100994271B1 (ko) 2002-09-30 2003-09-12 제품 설계 및 수율 피드백 시스템에 기초하는 포괄적인집적 리소그래피 공정 제어 시스템

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10355573B4 (de) * 2003-11-28 2007-12-20 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Erhöhen der Produktionsausbeute durch Steuern der Lithographie auf der Grundlage elektrischer Geschwindigkeitsdaten
US20050288773A1 (en) * 2004-01-22 2005-12-29 Glocker David A Radiopaque coating for biomedical devices
US7379184B2 (en) * 2004-10-18 2008-05-27 Nanometrics Incorporated Overlay measurement target
KR100588914B1 (ko) 2004-12-22 2006-06-09 동부일렉트로닉스 주식회사 웨이퍼 상의 트랜지스터의 균일한 전기적 특성을 위한노광방법
US7808643B2 (en) * 2005-02-25 2010-10-05 Nanometrics Incorporated Determining overlay error using an in-chip overlay target
US7477396B2 (en) * 2005-02-25 2009-01-13 Nanometrics Incorporated Methods and systems for determining overlay error based on target image symmetry
US20070240121A1 (en) * 2006-01-31 2007-10-11 Caterpillar Inc. System for evaluating component value
US7352439B2 (en) * 2006-08-02 2008-04-01 Asml Netherlands B.V. Lithography system, control system and device manufacturing method
GB0621408D0 (en) * 2006-10-27 2006-12-06 Ibm A method, apparatus and software for determining a relative measure of build quality for a built system
US7359820B1 (en) * 2007-01-03 2008-04-15 International Business Machines Corporation In-cycle system test adaptation
KR101504504B1 (ko) * 2008-05-21 2015-03-20 케이엘에이-텐코어 코오포레이션 툴 및 프로세스 효과들을 분리하기 위한 기판 매트릭스
US8321263B2 (en) * 2009-04-17 2012-11-27 Hartford Fire Insurance Company Processing and display of service provider performance data
JP5399191B2 (ja) * 2009-09-30 2014-01-29 大日本スクリーン製造株式会社 基板処理装置、基板処理装置のための検査装置、ならびに検査用コンピュータプログラムおよびそれを記録した記録媒体
IL210832A (en) * 2010-02-19 2016-11-30 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN102800563B (zh) * 2011-05-26 2014-11-05 中芯国际集成电路制造(上海)有限公司 晶片投片方法与晶片投片装置
US9227295B2 (en) * 2011-05-27 2016-01-05 Corning Incorporated Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
KR101530848B1 (ko) * 2012-09-20 2015-06-24 국립대학법인 울산과학기술대학교 산학협력단 데이터마이닝을 이용하여 생산 공정에서 품질을 관리하는 장치 및 방법
KR101508641B1 (ko) * 2013-08-08 2015-04-08 국립대학법인 울산과학기술대학교 산학협력단 생산 공정에서 데이터마이닝을 이용하여 제품 상태를 예측하는 장치 및 방법
KR102083234B1 (ko) * 2015-07-16 2020-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10289109B2 (en) * 2015-10-01 2019-05-14 Globalfoundries Inc. Methods of error detection in fabrication processes
US10241502B2 (en) 2015-10-01 2019-03-26 Globalfoundries Inc. Methods of error detection in fabrication processes
US10311186B2 (en) * 2016-04-12 2019-06-04 Globalfoundries Inc. Three-dimensional pattern risk scoring
CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
CN110071059B (zh) * 2019-03-29 2020-12-22 福建省福联集成电路有限公司 一种监控蚀刻的工艺方法及系统
CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
DE102020215716A1 (de) 2020-12-11 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie
KR20230149310A (ko) * 2021-03-02 2023-10-26 에이에스엠엘 네델란즈 비.브이. 계측 시스템의 작동, 리소그래피 장치, 및 그 방법
US11955358B2 (en) * 2021-09-24 2024-04-09 Applied Materials, Inc. Model-based failure mitigation for semiconductor processing systems
CN114326620B (zh) * 2021-12-25 2022-09-27 北京国控天成科技有限公司 一种全流程自动控制方法、装置及电子设备
US12321159B2 (en) * 2022-02-04 2025-06-03 University Of South Florida Systems, methods, and media for monitoring the production process of a product
JP2024058323A (ja) * 2022-10-14 2024-04-25 株式会社東芝 管理方法、管理システム、プログラム、及び記憶媒体
WO2026070761A1 (ja) * 2024-09-30 2026-04-02 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195910A (ja) * 1998-12-24 2000-07-14 Mosel Vitelic Inc ウェハーテストの不良パターン自動識別装置と方法
WO2001080306A2 (en) * 2000-04-13 2001-10-25 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
US20020072003A1 (en) * 2000-10-30 2002-06-13 Nova Measuring Instruments Ltd. Process control for micro-lithography
KR100597595B1 (ko) * 1999-07-14 2006-07-06 주식회사 하이닉스반도체 반도체 제조를 위한 사진공정에서의 샘플 웨이퍼 처리 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2679500B2 (ja) 1990-12-17 1997-11-19 モトローラ・インコーポレイテッド 総合的なシステム歩留りを計算するための方法
US5351202A (en) * 1992-02-27 1994-09-27 International Business Machines Corporation Evaluation and ranking of manufacturing line non-numeric information
US5642296A (en) * 1993-07-29 1997-06-24 Texas Instruments Incorporated Method of diagnosing malfunctions in semiconductor manufacturing equipment
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5481475A (en) 1993-12-10 1996-01-02 International Business Machines Corporation Method of semiconductor device representation for fast and inexpensive simulations of semiconductor device manufacturing processes
JP3099932B2 (ja) 1993-12-14 2000-10-16 株式会社東芝 インテリジェントテストラインシステム
US5822218A (en) * 1996-08-27 1998-10-13 Clemson University Systems, methods and computer program products for prediction of defect-related failures in integrated circuits
US6301516B1 (en) * 1999-03-25 2001-10-09 General Electric Company Method for identifying critical to quality dependencies
US6582618B1 (en) 1999-09-08 2003-06-24 Advanced Micro Devices, Inc. Method of determining etch endpoint using principal components analysis of optical emission spectra
US6248602B1 (en) * 1999-11-01 2001-06-19 Amd, Inc. Method and apparatus for automated rework within run-to-run control semiconductor manufacturing
US6470231B1 (en) * 2000-04-21 2002-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for auto dispatching wafer
US6535775B1 (en) * 2000-09-01 2003-03-18 General Electric Company Processor system and method for integrating computerized quality design tools
DE10048809A1 (de) * 2000-09-29 2002-04-18 Itemic Ag Verfahren zur Bestimmung des größten Lagefehlers von Strukturelementen eines Wafers
US6627464B2 (en) * 2001-02-07 2003-09-30 Eni Technology, Inc. Adaptive plasma characterization system
DE10106505A1 (de) * 2001-02-13 2002-08-29 Bosch Gmbh Robert Verfahren und Vorrichtung zur Zustandserfassung von technischen Systemen wie Energiespeicher
JP2004527117A (ja) 2001-03-23 2004-09-02 東京エレクトロン株式会社 部分最小自乗を使用したエンドポイント検知方法と装置
JP2002297217A (ja) * 2001-03-29 2002-10-11 Japan Institute Of Plant Maintenance 製造業務における品質管理方法、品質管理支援システム及び傾向管理プログラム
EP1253497B1 (en) 2001-04-27 2008-04-02 Qimonda Dresden GmbH & Co. oHG Method for adjusting processing parameters of plate-like objects in a processing tool
WO2003025685A1 (en) * 2001-09-14 2003-03-27 Ibex Process Technology, Inc. Scalable, hierarchical control for complex processes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195910A (ja) * 1998-12-24 2000-07-14 Mosel Vitelic Inc ウェハーテストの不良パターン自動識別装置と方法
KR100597595B1 (ko) * 1999-07-14 2006-07-06 주식회사 하이닉스반도체 반도체 제조를 위한 사진공정에서의 샘플 웨이퍼 처리 방법
WO2001080306A2 (en) * 2000-04-13 2001-10-25 Advanced Micro Devices, Inc. Automated process monitoring and analysis system for semiconductor processing
WO2001080306A3 (en) 2000-04-13 2002-07-18 Advanced Micro Devices Inc Automated process monitoring and analysis system for semiconductor processing
US20020072003A1 (en) * 2000-10-30 2002-06-13 Nova Measuring Instruments Ltd. Process control for micro-lithography

Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
DE10393394B4 (de) 2016-10-13
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
JP4478574B2 (ja) 2010-06-09
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TWI332129B (en) 2010-10-21
TW200408919A (en) 2004-06-01

Similar Documents

Publication Publication Date Title
KR100994271B1 (ko) 제품 설계 및 수율 피드백 시스템에 기초하는 포괄적인집적 리소그래피 공정 제어 시스템
US10866524B2 (en) Method and system for overlay control
US8108805B2 (en) Simplified micro-bridging and roughness analysis
KR102242414B1 (ko) 산업 공정과 관련된 진단 정보를 얻는 방법 및 장치
JP5658317B2 (ja) モデルベースのリソグラフィ誘導レイアウト設計を実行するための方法
US6178360B1 (en) Methods and apparatus for determining optimum exposure threshold for a given photolithographic model
KR100375559B1 (ko) 공정장치의 제어방법
EP2620976A1 (en) Overlay model for aligning and exposing semiconductor wafers
US12406197B2 (en) Prediction and metrology of stochastic photoresist thickness defects
US20220187786A1 (en) Method for generating a control scheme and device manufacturing method
CN110168447B (zh) 用于确定对指纹的贡献的方法
WO2006104244A1 (ja) 光リソグラフィの光近接補正におけるマスクパターン設計方法および設計装置ならびにこれを用いた半導体装置の製造方法
US11366397B2 (en) Method and apparatus for simulation of lithography overlay
EP4399573B1 (en) Method for converting metrology data
TWI814370B (zh) 用於程序控制之因果卷積網路
WO2020177973A1 (en) Extracting a feature from a data set
KR102770697B1 (ko) 리소그래피로 처리된 반도체 장치에 대한 프로세스 제어 방법
US20250076772A1 (en) Resist pattern prediction device and resist pattern prediction device construction system
Rietman et al. A system model for feedback control and analysis of yield: A multistep process model of effective gate length, poly line width, and IV parameters

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20131017

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20141023

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20161019

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20181018

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20191016

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20230913

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000