DE10393394B4 - Intelligentes integriertes Lithographiesteuerungssystem auf der Grundlage des Produktaufbaus und Ausbeuterückkopplungssystem und Verfahren zu dessen Anwendung - Google Patents

Intelligentes integriertes Lithographiesteuerungssystem auf der Grundlage des Produktaufbaus und Ausbeuterückkopplungssystem und Verfahren zu dessen Anwendung Download PDF

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Publication number
DE10393394B4
DE10393394B4 DE10393394.8T DE10393394T DE10393394B4 DE 10393394 B4 DE10393394 B4 DE 10393394B4 DE 10393394 T DE10393394 T DE 10393394T DE 10393394 B4 DE10393394 B4 DE 10393394B4
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Prior art keywords
manufacturing process
parameters
quality
critical
quality index
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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DE10393394.8T
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German (de)
English (en)
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DE10393394T5 (de
Inventor
Khoi A. Phan
Bhanwar Singh
Bharath Rangarajan
Ramkumar Subramanian
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
DE10393394.8T 2002-09-30 2003-09-12 Intelligentes integriertes Lithographiesteuerungssystem auf der Grundlage des Produktaufbaus und Ausbeuterückkopplungssystem und Verfahren zu dessen Anwendung Expired - Lifetime DE10393394B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/261,569 2002-09-30
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system
PCT/US2003/028682 WO2004031859A2 (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (2)

Publication Number Publication Date
DE10393394T5 DE10393394T5 (de) 2005-08-11
DE10393394B4 true DE10393394B4 (de) 2016-10-13

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Family Applications (1)

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DE10393394.8T Expired - Lifetime DE10393394B4 (de) 2002-09-30 2003-09-12 Intelligentes integriertes Lithographiesteuerungssystem auf der Grundlage des Produktaufbaus und Ausbeuterückkopplungssystem und Verfahren zu dessen Anwendung

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
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DE102020215716A1 (de) 2020-12-11 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie
US20230251640A1 (en) * 2022-02-04 2023-08-10 University Of South Florida Systems, methods, and media for monitoring the production process of a product

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KR102083234B1 (ko) * 2015-07-16 2020-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10289109B2 (en) * 2015-10-01 2019-05-14 Globalfoundries Inc. Methods of error detection in fabrication processes
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CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
CN110071059B (zh) * 2019-03-29 2020-12-22 福建省福联集成电路有限公司 一种监控蚀刻的工艺方法及系统
CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
KR20230149310A (ko) * 2021-03-02 2023-10-26 에이에스엠엘 네델란즈 비.브이. 계측 시스템의 작동, 리소그래피 장치, 및 그 방법
US11955358B2 (en) * 2021-09-24 2024-04-09 Applied Materials, Inc. Model-based failure mitigation for semiconductor processing systems
CN114326620B (zh) * 2021-12-25 2022-09-27 北京国控天成科技有限公司 一种全流程自动控制方法、装置及电子设备
JP2024058323A (ja) * 2022-10-14 2024-04-25 株式会社東芝 管理方法、管理システム、プログラム、及び記憶媒体
WO2026070761A1 (ja) * 2024-09-30 2026-04-02 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
DE102020215716A1 (de) 2020-12-11 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie
US20230251640A1 (en) * 2022-02-04 2023-08-10 University Of South Florida Systems, methods, and media for monitoring the production process of a product
US12321159B2 (en) * 2022-02-04 2025-06-03 University Of South Florida Systems, methods, and media for monitoring the production process of a product

Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
JP4478574B2 (ja) 2010-06-09
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TWI332129B (en) 2010-10-21
TW200408919A (en) 2004-06-01
KR100994271B1 (ko) 2010-11-12

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