CN1685492B - 根据产品设计及产率反馈系统的综合性集成光刻制程控制系统 - Google Patents

根据产品设计及产率反馈系统的综合性集成光刻制程控制系统 Download PDF

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Publication number
CN1685492B
CN1685492B CN038228262A CN03822826A CN1685492B CN 1685492 B CN1685492 B CN 1685492B CN 038228262 A CN038228262 A CN 038228262A CN 03822826 A CN03822826 A CN 03822826A CN 1685492 B CN1685492 B CN 1685492B
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China
Prior art keywords
processing procedure
quality
quality index
parameters
matrix
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Expired - Lifetime
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CN038228262A
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Chinese (zh)
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CN1685492A (zh
Inventor
K·A·潘
B·辛格
B·兰加拉坚
R·苏布拉马尼亚姆
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
CN038228262A 2002-09-30 2003-09-12 根据产品设计及产率反馈系统的综合性集成光刻制程控制系统 Expired - Lifetime CN1685492B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/261,569 2002-09-30
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system
PCT/US2003/028682 WO2004031859A2 (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (2)

Publication Number Publication Date
CN1685492A CN1685492A (zh) 2005-10-19
CN1685492B true CN1685492B (zh) 2012-12-26

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CN038228262A Expired - Lifetime CN1685492B (zh) 2002-09-30 2003-09-12 根据产品设计及产率反馈系统的综合性集成光刻制程控制系统

Country Status (9)

Country Link
US (1) US6915177B2 (https=)
JP (1) JP4478574B2 (https=)
KR (1) KR100994271B1 (https=)
CN (1) CN1685492B (https=)
AU (1) AU2003276881A1 (https=)
DE (1) DE10393394B4 (https=)
GB (1) GB2410834B (https=)
TW (1) TWI332129B (https=)
WO (1) WO2004031859A2 (https=)

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US7808643B2 (en) * 2005-02-25 2010-10-05 Nanometrics Incorporated Determining overlay error using an in-chip overlay target
US7477396B2 (en) * 2005-02-25 2009-01-13 Nanometrics Incorporated Methods and systems for determining overlay error based on target image symmetry
US20070240121A1 (en) * 2006-01-31 2007-10-11 Caterpillar Inc. System for evaluating component value
US7352439B2 (en) * 2006-08-02 2008-04-01 Asml Netherlands B.V. Lithography system, control system and device manufacturing method
GB0621408D0 (en) * 2006-10-27 2006-12-06 Ibm A method, apparatus and software for determining a relative measure of build quality for a built system
US7359820B1 (en) * 2007-01-03 2008-04-15 International Business Machines Corporation In-cycle system test adaptation
KR101504504B1 (ko) * 2008-05-21 2015-03-20 케이엘에이-텐코어 코오포레이션 툴 및 프로세스 효과들을 분리하기 위한 기판 매트릭스
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US9227295B2 (en) * 2011-05-27 2016-01-05 Corning Incorporated Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
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KR101508641B1 (ko) * 2013-08-08 2015-04-08 국립대학법인 울산과학기술대학교 산학협력단 생산 공정에서 데이터마이닝을 이용하여 제품 상태를 예측하는 장치 및 방법
KR102083234B1 (ko) * 2015-07-16 2020-03-02 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
US10289109B2 (en) * 2015-10-01 2019-05-14 Globalfoundries Inc. Methods of error detection in fabrication processes
US10241502B2 (en) 2015-10-01 2019-03-26 Globalfoundries Inc. Methods of error detection in fabrication processes
US10311186B2 (en) * 2016-04-12 2019-06-04 Globalfoundries Inc. Three-dimensional pattern risk scoring
CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
CN110071059B (zh) * 2019-03-29 2020-12-22 福建省福联集成电路有限公司 一种监控蚀刻的工艺方法及系统
CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
US20220066411A1 (en) * 2020-08-31 2022-03-03 Applied Materials, Inc. Detecting and correcting substrate process drift using machine learning
DE102020215716A1 (de) 2020-12-11 2022-06-15 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie
KR20230149310A (ko) * 2021-03-02 2023-10-26 에이에스엠엘 네델란즈 비.브이. 계측 시스템의 작동, 리소그래피 장치, 및 그 방법
US11955358B2 (en) * 2021-09-24 2024-04-09 Applied Materials, Inc. Model-based failure mitigation for semiconductor processing systems
CN114326620B (zh) * 2021-12-25 2022-09-27 北京国控天成科技有限公司 一种全流程自动控制方法、装置及电子设备
US12321159B2 (en) * 2022-02-04 2025-06-03 University Of South Florida Systems, methods, and media for monitoring the production process of a product
JP2024058323A (ja) * 2022-10-14 2024-04-25 株式会社東芝 管理方法、管理システム、プログラム、及び記憶媒体
WO2026070761A1 (ja) * 2024-09-30 2026-04-02 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

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Also Published As

Publication number Publication date
JP2006501673A (ja) 2006-01-12
GB0505193D0 (en) 2005-04-20
US20040063009A1 (en) 2004-04-01
DE10393394B4 (de) 2016-10-13
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
AU2003276881A8 (en) 2004-04-23
WO2004031859A2 (en) 2004-04-15
GB2410834A (en) 2005-08-10
WO2004031859A3 (en) 2004-06-17
DE10393394T5 (de) 2005-08-11
JP4478574B2 (ja) 2010-06-09
AU2003276881A1 (en) 2004-04-23
KR20050062576A (ko) 2005-06-23
TWI332129B (en) 2010-10-21
TW200408919A (en) 2004-06-01
KR100994271B1 (ko) 2010-11-12

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