TWI331207B - - Google Patents
Download PDFInfo
- Publication number
- TWI331207B TWI331207B TW96132201A TW96132201A TWI331207B TW I331207 B TWI331207 B TW I331207B TW 96132201 A TW96132201 A TW 96132201A TW 96132201 A TW96132201 A TW 96132201A TW I331207 B TWI331207 B TW I331207B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- pipe
- plane
- accommodating groove
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
| JP2008097891A JP4974949B2 (ja) | 2007-08-30 | 2008-04-04 | ヒートパイプを有する熱放散器の製造方法及びその製品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200909760A TW200909760A (en) | 2009-03-01 |
| TWI331207B true TWI331207B (enrdf_load_stackoverflow) | 2010-10-01 |
Family
ID=40554106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4974949B2 (enrdf_load_stackoverflow) |
| TW (1) | TW200909760A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012141082A (ja) * | 2010-12-28 | 2012-07-26 | Fujitsu Ltd | 冷却装置及び電子機器 |
| JP7217792B1 (ja) | 2021-10-20 | 2023-02-03 | レノボ・シンガポール・プライベート・リミテッド | 電子機器の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001248982A (ja) * | 2000-03-03 | 2001-09-14 | Fujikura Ltd | ヒートパイプ構造体およびその成形工具 |
| JP4324367B2 (ja) * | 2002-11-06 | 2009-09-02 | ナブテスコ株式会社 | 素子放熱器 |
-
2007
- 2007-08-30 TW TW96132201A patent/TW200909760A/zh not_active IP Right Cessation
-
2008
- 2008-04-04 JP JP2008097891A patent/JP4974949B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4974949B2 (ja) | 2012-07-11 |
| TW200909760A (en) | 2009-03-01 |
| JP2009058213A (ja) | 2009-03-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWM282235U (en) | Improved structure of a heat dissipating device using heat pipes | |
| JP2001223308A (ja) | ヒートシンク | |
| TWI331207B (enrdf_load_stackoverflow) | ||
| TWM334308U (en) | Multi-directional heat pipe assembly structure and heat dissipating device thereof | |
| CN101316495B (zh) | 散热模组 | |
| CN101384153B (zh) | 热管散热器及其制作方法 | |
| CN100562231C (zh) | 热管散热装置 | |
| CN102762081A (zh) | 具有内置风扇的散热器 | |
| JP3168201U (ja) | 放熱モジュール | |
| CN201541416U (zh) | 不同热管管径的导热结构及具有该结构的散热器 | |
| CN202120889U (zh) | 散热模组 | |
| TW201005253A (en) | Manufacturing method for levelly combining evaporation ends of aligned heat pipes to fastening seat and structure thereof | |
| TW200539788A (en) | Heat pipe cooling assembly and method of manufacturing the same | |
| JP2004069234A (ja) | ヒートスプレッダーおよびその製造方法 | |
| TWI327055B (en) | Heat dissipation module | |
| TW200841809A (en) | Heat dissipation device | |
| TWI325105B (en) | Heat dissipation device | |
| TWI308048B (en) | Heat dissipation device | |
| TWI309149B (en) | Heat dissipation device | |
| TWM269703U (en) | Heat sink with heat pipe | |
| JP2012013263A (ja) | 散熱装置及びその散熱装置の製造方法 | |
| CN102651956B (zh) | 散热模块及其制造方法 | |
| TWI294763B (en) | Heat dissipation device | |
| TWI309761B (en) | Thermal module | |
| TWI338215B (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |