M334308 八、新型說明： 【新型所屬技術領域】 本創作係有關於-種熱管結構，尤指一種多埶其 組合結構及具有該結構的散熱裝置。 、、5 【先前技術】M334308 VIII. New description: [New technical field] This creation relates to a kind of heat pipe structure, especially a multi-turn combination structure and a heat dissipating device having the same. ,,5 [prior art]
近代散熱技術的發展，熱管因具有：重量輕、耐久性 刼作容易、不需外加能量即能使其運作等優點，因 熱管已被廣泛地運用在消費性電子產品的散熱裝置 例如：中央處理器的散熱裝置或顯示卡的散熱裝置 一般習知之熱管結構係為一封閉管體所製成，此種結 構僅適用於小面積的散熱區域，若是需要大面積且熱源^ 散的散熱區域，習知之熱管結構則不敷使用，或可利用複 數熱官組合之結構來提供大面積的散熱，但複數熱管組合 •之結構則會增加成本而亦無法解決熱源分散的散熱問題； 一般習知之熱管大多具有彎折之結構，熱管一旦彎折之 -後，其内部毛細組織則容易產生剝離的現象，使其内部之 工作流體無法正常作用，造成熱管的散熱效能降低，因 此，如何不將熱管彎折又能具有較大的散熱面積？本創作 人即針對此課題進行研究。 【新型内容】 本創作之一目的，在於提供一種多向式熱管組合結 M334308 -構，藉由該多向式熱管組合結構利用複數熱管及一轉接 =能以最低的成本達到對具有分散熱源的電子裝置 散熱作用。 组人：工達2述之目的，本創作係提供-種多向式熱管 .二：構，包括至少三熱管及一轉接座，其中，該熱管之 =係為-封閉端’其另-端係為―開口端，該轉接座具 參 體’於該座體上設有至少三相互連通的承接孔，各 忒承接孔分別供各該熱管之開口端連接。 人处作之另—目的，在於提供—種具有多向式熱管組 構的散熱裝置，藉由該多向式熱管^結構可對應- 熱=散熱源之電子裝置，能解決大範圍之分散熱源的散 為了達成上述之目的，本創作係提供-種具有多向式 熱管賴熱裝置，包括一多向式熱管組合結構、複數導^ ^及禝數散熱體’其中，該多向式熱管組合結構，係包含 =三=及一轉接座，該熱管具有一開口端，該轉接座 =一座體，於該座體上設有至少三相互連通的承接孔， 各该承接孔分別供各該熱管之開口端連接，該等導敎塊， =r熱管相互連接，該等散熱體，分別與各該熱管 相互連接。 【實施方式】 配合圖式說明如 並非用來對本創 有關本創作之詳細說明及技術内容， 下，然而所附圖式僅提供參考與說明用， M334308 作加以限制者。 請參照第一至三圖所示，係分別為本創作之立體分解 圖、立體組合圖及第二圖之3_3剖視圖，本創作係提供一 種多向式熱管組合結構，包括至少三熱管及一轉接座 .20，其中，該熱管10之一端係為一封閉端u，其另一端係 為一開口端12，該轉接座20具有一座體21，於該座體21上 ，設有至少三相互連通的承接孔22，各該承接孔22分別供各 該熱管10之開口端12連接。該熱管1〇係嵌入該承接孔四而 與該座體21相連接，該座體21具有三個承接孔22，可使三 熱管10相互連接，而各該熱flG之外緣直徑係小於各該承 接孔22之内緣直徑，以使各該熱管1〇嵌入各該承接孔22， 並使各該熱管10之端面相互貼接，另外，該等熱管1〇内部 具有毛細組織13，各該熱管之毛細叙織13係相互接觸。 另外，亦可使各該熱管10之内緣直徑係大於各該承接錢 之外緣直徑，以使各該熱管1〇套入各該承接㈣，並使各 該熱管1〇與該座體21相互連接，另外，該座龍係為熱傳 W生佳之金屬材料，如：銅、銘等材料所製成。 立請參照第四及五圖所示’係分別為本創作之使用狀態 p圖及弟二較佳實施例使用狀態示意圖，本創作應用時 導熱㈣及散熱體40而成為一種具有多向式熱管 電子 、&板上，所叙主機«包含複數 椹：杳，、中、亥散熱裝置包括-多向式熱管組合結 構、禝數導熱塊30及複數散熱體4〇。 該多向式熱管組合結構，係包含至少三熱管ι〇及一轉 M334308 封閉端11，其另一端係為 座體21，於該座體21上設 各該承接孔22分別供各談 接座20，該熱管10之一端係為一 一開口端12，該轉接座2〇具有一 有至少二相互連通的承接孔Μ， 熱管10之開口端12連接。 "複數導熱塊30，與該等熱㈣相互固定連接，進一牛 ㈣’ 5彡等導熱塊3G之—面仙接於該等熱管Μ之一處， 該等導熱塊30之另-面係貼接於所述之電子零件7〇，另 該等導熱塊㈣以熱傳導性佳之金屬，如銅、銘等材 稷数敢熱體40 人該4熱管10相互固定連接，進一 4 =二各該散熱體40上係開設有—通孔41，使該等散熱: 套设於该等熱管10、遠離該等導熱塊30之-處，另 外，該等散熱體4G係以熱傳導性佳之金屬，如銅、銘等相 料所製成。 導熱塊3G之作用在於將f子零件70所散發的熱能吸 ^ ’並傳至熱管10，再利用熱管10將熱量傳至散熱體40 ^ ’以排除熱量。該多向式熱管組合結構、導熱塊3〇及散 熱體40之配置可對應主機板上的電子零件7()之位置，如第 Γ圖’係對兩個f子零件70做散熱，而第五圖之實施例即 疋對二個電子零件70做散熱。 电請參照第六至八圖所示，係分別為本創作之第三較佳 貫，例立體圖、第三較佳實施例使用狀態示意圖及第四較 佳實施例立體圖，轉接錢可具有四個承接孔22，以連接 四熱管10並可使散熱區域擴大，因應主機板上之電子次 M334308 ‘ 70的配置而做更有效率之應用；另外，亦 孔22的轉接座20盥且右TO ? & 、/、有一承接 、有四承接孔22的轉接座2〇結合使用， 可構成一多點狀散熱區域。 再者，該座體21係可為Τ字型座體（如第一圖所 示）、人字型座體（如第八圖斤 糾-、处… 所）或十字型座體（如第 二”不，'亥夕向式熱管結構之散熱區域可以有更多 變化因=用者，用，以藉此達到最大之散熱功= 本創作之夕向式熱管組合結構及具該纟士 散熱裝置具有下列優點： 八Μ""令 1♦能針對具有分散熱源的電子裝置確實進行_作 ?，若利用傳統之複數熱管間隔排列的結構，雖可… 盖需散熱的區域，但也增加了散熱震置的體^。疋王復 • 2:=少的熱管數量對具有分散熱源二子裝置確 只進仃月丈熱作用，可大幅減低成本。 3.不=對熱管進行彎折之動作，不會使散熱效能降 -般傳統熱管料之結構，有可能產生熱管内部的毛 、、、田組織剝離之現象，而導致散熱效能降低。 綜上所述，當知本創作之多向式熱 該結構的散熱裝置已具有產業利用性 :構及具有 又本創作之構造亦未曾見於同類產品及公：用進：：二 合新型專利申請要件，爰依專利法提出申^。，完全符 【圖式簡單說明】 第一圖係為本創作之立體分解圖。 M334308 - 楚一θ 弟一圓In the development of modern heat-dissipation technology, heat pipes have the advantages of light weight, durability, easy operation, and operation without additional energy. Heat pipes have been widely used in heat dissipation devices for consumer electronic products such as central processing. The heat dissipating device of the device or the heat dissipating device of the display card generally has a heat pipe structure which is made of a closed pipe body. The structure is only suitable for a small area of the heat dissipating area, and if it is a heat dissipating area requiring a large area and a heat source, Knowing that the heat pipe structure is not enough, or the structure of the complex heat officer can be used to provide large-area heat dissipation, but the structure of the multiple heat pipe combination will increase the cost and can not solve the heat dissipation problem of the heat source dispersion; The structure has a bent structure, and once the heat pipe is bent, the internal capillary structure is liable to be peeled off, so that the internal working fluid cannot function normally, and the heat dissipation performance of the heat pipe is lowered. Therefore, how to not bend the heat pipe Can it have a large heat dissipation area? This creator is working on this topic. [New content] One of the purposes of this creation is to provide a multi-directional heat pipe combination M334308-structure, which utilizes a plurality of heat pipes and a transfer = the lowest heat cost to achieve a distributed heat source The heat dissipation of the electronic device. Group: The purpose of Gongda 2, this creation provides a kind of multi-directional heat pipe. Two: structure, including at least three heat pipes and an adapter, wherein the heat pipe = is the closed end 'the other - The end portion is an "open end", and the adapter seat has a plurality of receiving holes on the seat body that are connected to each other, and the respective receiving holes are respectively connected to the open ends of the heat pipes. Another purpose of the person is to provide a heat dissipating device having a multi-directional heat pipe structure, and the multi-directional heat pipe structure can correspond to the electronic device of the heat source and the heat dissipating source, and can solve a wide range of dispersing heat sources. In order to achieve the above objectives, the present invention provides a multi-directional heat pipe heat-reducing device, including a multi-directional heat pipe combination structure, a plurality of guides and a plurality of heat sinks, wherein the multi-directional heat pipe combination The structure comprises: three== and an adapter, the heat pipe has an open end, the adapter is a body, and at least three receiving holes are connected to the body, and the receiving holes are respectively provided for each The open ends of the heat pipes are connected to each other, and the heat exchangers are connected to each other. [Embodiment] The description of the drawings is not intended to be a detailed description and technical content of the present invention. However, the drawings are provided for reference and explanation only, and M334308 is used as a limitation. Please refer to the first to third figures, which are respectively the three-dimensional exploded view, the three-dimensional combined view and the third view of the third figure. The present invention provides a multi-directional heat pipe combination structure including at least three heat pipes and one turn. a socket. 20, wherein one end of the heat pipe 10 is a closed end u, and the other end is an open end 12, the adapter 20 has a body 21, and the base body 21 is provided with at least three The receiving holes 22 are connected to each other, and the receiving holes 22 are respectively connected to the open ends 12 of the heat pipes 10. The heat pipe 1 is inserted into the receiving hole 4 and connected to the seat body 21. The seat body 21 has three receiving holes 22, so that the three heat pipes 10 are connected to each other, and the diameter of the outer edge of each of the heat flG is smaller than each The inner diameter of the receiving hole 22 is such that the heat pipes 1 〇 are embedded in the receiving holes 22, and the end faces of the heat pipes 10 are attached to each other. Further, the heat pipes 1 have a capillary structure 13 inside. The capillary of the heat pipe is in contact with each other. In addition, the diameter of the inner edge of each of the heat pipes 10 may be greater than the diameter of the outer edge of each of the receiving heats, so that each of the heat pipes 1〇 is nested into each of the receiving portions (four), and each of the heat pipes 1〇 and the seat body 21 are They are connected to each other. In addition, the dragon system is made of metal materials such as copper and Ming. Please refer to the fourth and fifth figures for the purpose of the use of the creative state of the creation of the p and the second embodiment of the preferred embodiment of the preferred embodiment, the application of the heat conduction (four) and the heat sink 40 to become a multi-directional heat pipe On the electronic, & board, the host «contains a plurality of 椹: 杳, zhong, hai heat sinks including - multi-directional heat pipe combination structure, 导热 number of heat conduction block 30 and a plurality of heat sinks 4 〇. The multi-directional heat pipe assembly structure comprises at least three heat pipes ι and one turn M334308 closed end 11 , and the other end is a seat body 21 , and the receiving holes 22 are respectively provided on the seat body 21 for each socket 20, one end of the heat pipe 10 is an open end 12, and the adapter base 2 has a receiving hole having at least two communicating with each other, and the open end 12 of the heat pipe 10 is connected. " a plurality of heat conducting blocks 30, which are fixedly connected to the heats (four), and are connected to one of the heat pipes 3G, such as a heat conductor 3G, and the other faces of the heat conducting blocks 30 Attached to the electronic component 7〇, the other heat conducting blocks (4) are made of a metal having good thermal conductivity, such as copper, Ming, etc., and the heat pipes are 40, and the 4 heat pipes 10 are fixedly connected to each other, and 4 to 2 The heat dissipating body 40 is provided with a through hole 41, so that the heat dissipating is disposed on the heat pipe 10 away from the heat conducting block 30, and the heat dissipating body 4G is made of a metal having good thermal conductivity, such as Made of copper, Ming and other materials. The function of the heat conducting block 3G is to absorb the heat energy radiated from the f sub-part 70 and transfer it to the heat pipe 10, and then transfer heat to the heat sink 40^' by the heat pipe 10 to remove heat. The configuration of the multi-directional heat pipe assembly structure, the heat-conducting block 3〇 and the heat sink 40 can correspond to the position of the electronic component 7() on the motherboard, as shown in FIG. 2, the heat dissipation of the two f-sub-parts 70 is performed. The embodiment of the fifth figure is to dissipate heat from the two electronic components 70. Please refer to the sixth to eighth figures for the electricity, which are respectively the third preferred embodiment of the creation, the perspective view of the third preferred embodiment, and the perspective view of the fourth preferred embodiment. The receiving holes 22 are connected to the four heat pipes 10 and can expand the heat dissipation area, so that the application of the electronic sub-M334308 '70 on the main board can be more efficient; in addition, the transfer seat of the hole 22 is 20 and right. TO ? &, /, has a socket, with four sockets 22, the adapter 2 〇 can be combined to form a multi-point heat dissipation area. Furthermore, the seat body 21 can be a U-shaped seat body (as shown in the first figure), a herringbone seat body (such as the eighth figure, and a cross-shaped seat body). Second, no, 'the heat dissipation area of the hoisting heat pipe structure can have more changes due to the use of the user, in order to achieve the maximum heat dissipation work = the tempering heat pipe combination structure of the creation and the gentleman heat dissipation The device has the following advantages: The gossip "" 1♦ can be used for electronic devices with distributed heat sources. If the structure is arranged by a plurality of conventional heat pipes, the area to be cooled can be covered, but the area is increased. The body of the heat sink is located. 疋王复• 2:=The number of heat pipes is small, and the two sub-devices with dispersed heat source do only enter the heat of the moon, which can greatly reduce the cost. 3. No = bending the heat pipe It will not reduce the heat dissipation performance - the structure of the traditional heat pipe material may cause the phenomenon of hair removal in the heat pipe inside and outside the field, resulting in a decrease in heat dissipation efficiency. In summary, when the knowledge of the creation is multi-directional The heat dissipation device of this structure has industrial utilization: And the structure with the creation of this creation has not been seen in similar products and public: use:: the new patent application requirements of the two-in-one, according to the patent law, the application is complete. [Complete description of the drawing] The first picture is the creation The three-dimensional exploded view. M334308 - Chu Yi θ
第三圖 第四圖 第五圖 第六圖 弟七圖 弟八®I 係為本創作之第 係為本創作之第The third picture The fourth picture The fifth picture The sixth picture The younger brother's figure is the first of the creation.
【主1011132021304041 係為本創作之立體組合圖。 係為弟一圖之3-3剖視圖。 係為本創作之使用狀態示意圖。 係為本創作之第二較佳實施例使用狀態示意圖 係為本創作之第三較佳實施例立體圖。 三較佳實施例使用狀態示意圖 四較佳實施例立體圖。 要元件符號說明】 熱管 封閉端 毛細組織 轉接座 座體 導熱塊 散熱體 通孔 12 開口端 22 承接孔 電子零件 70[Main 1011132021304041 is a three-dimensional combination of the creation. It is a 3-3 cross-sectional view of the younger brother. This is a schematic diagram of the state of use of this creation. A schematic view of the state of use of the second preferred embodiment of the present invention is a perspective view of a third preferred embodiment of the present invention. Three Preferred Embodiments FIG. 4 is a perspective view of a preferred embodiment. Description of the symbol of the component] Heat pipe Closed end Capillary structure Adapter seat Seat block Thermal block Heat sink Through hole 12 Open end 22 Receiving hole Electronic parts 70