TWM241970U - Heat sink device - Google Patents

Description

M241970 V. Creation instructions (1) [Technical field to which the new type belongs _ This creation is about a plural number on a thermal dream device; f x Zhi is a private creation that is applied to the random r11 for arrangement changes. [First-gang technology] According to the characteristics of heat pipe with high heat conduction capacity, heavy denier, simple structure and multi-purpose, this knife is light and non-movable. Since it is used for a long time, it consumes electricity and is very unpleasant. Φ 工 $ 玟 j has to deliver a lot of heat and does not need to be suitable for the heat dissipation of electronic products. Generally, a heat pipe is applied to a heat releasing device 1 at one end of an electronic heat pipe, which is mainly a% ^ # electronic heating element for heat transfer connection, while the other end does not have a plurality of heat dissipation fins. Produced by the 敎 element! The South ’s heat conduction capacity makes the electrons “,,, and heat generated by the heat sink 1 can be transferred to the heat sink fins through the heat pipe. One row of heat and cooling, at the same time, for each heat sink fin The hoarding: li can also be used with a cooling fan to quickly drive away heat to achieve a good heat dissipation effect; in addition, in order to allow the heat generated by the electronic heating element to be quickly transferred to each cooling fin, usually Taking a plurality of heat pipes as 'however', when the heat pipes are arranged side by side, if the distance between the heat pipes is too large, the number of heat pipes that can be arranged is relatively reduced, and it is not conducive to the heat pipes contacting the source center; And if the distance between each heat pipe is too small, it is easy for each…, moss to generate dense heat at the place where it passes through the heat sink, so that the airflow blown by the cooling fan cannot easily enter the smaller distance and drive this heat away. from 'Furthermore, the dilemma of excessive heat concentration is not conducive to heat removal. With this in mind, in order to improve and solve the above-mentioned shortcomings, the author devoted himself to researching and cooperating with the application of science to finally propose a reasonable design and effectively improve the above. Missing Creation.

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V. Creation Instructions (2) [New Content] The main purpose of this creation is to integrate the multiple heat pipes in a scattered and effective arrangement to increase the airflow of each heat pipe on the cooling fan under the condition of quantity. For another purpose of this creation, each heat pipe can be placed on the heat dissipation fins to exert the effect of spreading the surface area of the heat dissipation fins to achieve a uniform temperature. A heat-dissipating device can be provided. When the heat-dissipating device is installed, a certain width is provided for the heat pipes without reducing the number of heat pipes provided, and the distance between the heat-dissipating parts is provided for entering and taking away heat. In order to provide a heat dissipation device, the teeth on the system are evenly distributed, so as to promote the thermal expansion of the effective position, and to promote the expansion of heat. Another purpose of this creation is to provide a heat dissipation device, which can also make the f heat pipe It is in contact with the center of the heat source to quickly conduct the heat generated from the main heat source through each heat pipe and take it away from the heat source.

^ In order to achieve the above-mentioned items, this creative department provides a heat sink: a heat conduction base and at least two heat pipes; each heat pipe has an X heat part and a heat radiation part, and the heat receiving part is separately from the heat conduction base. The seat is thermally connected, and the political and thermal parts are located at least one opposite side of the heat conduction base # = two sides are arranged alternately, and the heat dissipation parts of each heat pipe are arranged on a plurality of fins, fins; Obtain a heat sink that can reach the above items. [Implementation] In order to enable the review committee to further understand the characteristics and technical content of this creation, please refer to the following detailed description and drawings of this creation, but the attached drawings It is provided for reference and explanation purposes only, and is not intended to supplement,

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V. Creation Description (3) Please refer to the first, second, and third images, which are the three-dimensional, top, and cross-sectional views of the creation, respectively. This creative system provides a heat dissipation device, which mainly includes a heat conduction base 1 and at least two heat pipes 2, 2; of which: the heat conduction base 1 is made of a material with good thermal conductivity, such as a name, etc., and can be a flat plate A heat-conducting body 10 having a thermal conductivity constant greater than that of the heat-conducting base 1 is embedded in the bottom surface of the heat-conducting base 1. The heat-conducting body 10 can be made of copper and is a piece of body. The central heating unit (Cpu) 4 and other electronic heating components are attached (as shown in the sixth figure); and at the top surface of the heat conduction base 1, at least two spaced grooves 1 1 are recessed, each groove The 11 series passes directly above the heat conducting body 10 for the above heat pipes 2 and 2, respectively, when they are partially buried in each groove 11 and can be directly contacted with the heat conducting body 10; A plurality of heat dissipation fins 12 are vertically arranged on the top surface of the heat conduction base 1 to help the heat conduction base 1 to quickly dissipate heat. Each of the heat pipes 2 and 2 ′ may have an L-shaped curved shape (as shown in the third figure), and each has a heat receiving portion 20, 20 ′ and a heat radiating portion 21, 21 ′, and each heat pipe 2 2, 2, the heat receiving portions 20, 20 'and the heat dissipating portions 21, 21, extend integrally to form a bent portion 22, 22' to form the heat pipes 2, 2, described above; the heat pipes 2, 2 are heated The sections 20 and 20 are necessary to be connected to the above-mentioned heat-conducting base 1 for heat transfer. In the practical example listed in this creation, each of the heat pipes 2 and 2 and the heat-receiving sections 20 and 20 are respectively buried in Each recess 1 of the heat conduction base 1 is in the art tank 11 and is in contact with the surface of the heat conductor, so that the heat pipes 2 and 2 'can quickly conduct the heat absorbed by the heat conductor 10 through the heat receiving sections 20 and 20 to quickly conduct heat. To the heat sink 21, 2 1 ′. And this creation mainly lies in the heat dissipation sections 21, 21 of these heat pipes 2, 2,

M241970 V. Creation instructions (4) Position ΓΪ Heat conduction base 1 & less than one of the two opposite directions Submit "ΐ, back, said" relative direction "can be the heat conduction base 1" or left and right " Iso-direction, or other directions on the heat-conducting base J ί :: as opposed to the direction on one side; as shown in the second and third figures, this', taking the left and right directions of the heat-conducting base 1 as an example, Each of the heat pipes 2, 2 and the heating parts 20 and 20 are along the left and right sides of the heat conduction base ^: and the knife σ is placed in each groove 11 and since each groove 11 is It is set at intervals, so the heat receiving sections 20 and 20 of the heat pipes 2 and 2 can maintain a certain distance s, and the heat dissipating sections 21 and 21 are arranged left and right alternately, as shown in the figure two. As shown, a heat pipe 2 is interposed between two adjacent heat radiating portions 21 on the same side (right side) of the heat conduction base 1, that is, one of the heat radiating portions 21 is located on the other side of the heat conduction dust seat (left side). In addition, the heat radiating portions 21 and 21 of each heat pipe 2 and 2 are commonly disposed on a plurality of heat radiating fins 3 arranged in a stack, and are transmitted to each of the heat radiating portions 21 and 21 by f, and the heat passes through the heat radiating fins. 3 Exhaust heat and cooling. Based on this, as shown in the first and fourth figures, under a certain width b, this creation can not only maintain the heat pipes 2 and 2, generally a reasonable number of installations, but also make the heat pipes located on the same side of the heat conduction base The distance d between the heat radiating portions 21 of 2 is increased to a heat pipe 2, and the outer diameter plus a double distance s, so that the heat radiating portions 21 and 21 of each of the tubes 2, 2 may not be close to each other and the heat receiving portion 20, 20, can pass through the heat again; on the heart; as shown in the fifth and sixth figures, when a cooling fan 5 is set on one side of the ~ cooling device, the airflow from the cooling fan 5 = The heat-dissipating parts 21 and 21 of each delicious heat-relief 2 and 2 are arranged in close proximity to each other, so as to drive the heat hidden between the heat-dissipating fins 3 outward, and

M241970 V. At the time of creation (5) ^, since the heat dissipation sections 21 and 21 are arranged alternately at the two sides, when each heat dissipation section 2 1, 21 is connected in series with the heat dissipation fins 3 The radiating sections 21 and 21 'are connected in series on the radiating fins 3, and are distributed relatively, and can be evenly distributed on the radiating fins 3, so that the hot spots are evenly distributed to effectively use each radiating heat. The surface area of the fins 3 achieves the effect of uniform heat dissipation. Therefore, with this creative heat dissipation device, it can have at least the following many excellent bases: ff 二 ^ 处 2 and; wide distance between the heat conduction two [so the distance d between each other can be enough to supply air / 'IL The heat that passes smoothly and is taken away is shown in the previous section. As described above, 夂 is μ Ω 0, which is dispersed in the Sanskrit by interactive setting. Add 3 pieces of 3 so that the hot spots are evenly distributed to spread the heat; the area can play its role in heat dissipation. "Medium 2I2, 2": the heated part 20, 2 °, and still follow the heat dissipation part 21, 21, up. The rapid conduction of heat generated from the heat source is summed up as described above. It is too sure that it can achieve the intended use. Second, it is a rare new creative product with its novelty and progressiveness. Its purpose is to solve the lack of knowledge. The law filed a claim, respecting the 42 :: type patent application requirements, and converted to the patent rights. Θ Ping checked and granted the patent in this case to protect the creator's M241970 V. Creation Instructions (6) However, the above is only the creation The preferred feasible embodiment restricts the scope of patents for this creation, so the use of this The equivalent structural changes made by the content are all included in the text for the same reason, and they are shared with Chen Ming. The scope of the book and the drawings is therefore M241970 Simple illustration of the drawings [Simplified illustration of the drawings] The first drawing is the text The perspective view of the creation. The second view is the top view of the creation. The third view is the cross-sectional view of the creation. The fourth view is the side cross-sectional view of the creation. The fifth view is the top view of the use state of the creation. The sixth view is the use of the creation. A cross-sectional view of the state. [Component symbol]

< This creation > Heat conducting base 1 Heat conductor 10 Groove 11 Heat radiating fin 12 Heat pipe 2 > 2, Heat receiving part 20 Heat receiving part 20 Heat radiating part 21 Heat radiating part 21 Bending part 22 Bending part 22 Heat radiating fin 3 Central processing Fan 4 cooling fan page 11

Claims (1)

M241970 VI. Patent application scope 1. A heat dissipation device, including a heat conduction base and at least two heat pipes #,, Y Lu Qi 'These heat pipes have a heat receiving portion and a heat dissipating portion, and the heat receiving portion is respectively connected with the heat conducting base It is used for heat transfer connection, and its heat dissipation parts are arranged alternately at two sides of at least one opposite direction of the heat conduction base, and the heat dissipation parts of the heat pipes are penetrated on a plurality of heat dissipation fins. Wherein, among which, among which, among which, among which 2, the heat dissipation device described in item 1 of the scope of patent application, the heat conducting base is a flat body. 3. The heat sink as described in item 1 of the scope of the patent application. At least two spaced-apart grooves are recessed on the top surface of the heat-conducting base. The heat-receiving parts of the heat pipes are buried in these grooves. 4. The heat dissipation device as described in item 1 of the scope of the patent application. A plurality of scattered fins are provided on the top surface of the heat conduction base. Interpretation: Its = the first item of the patent scope; the heat dissipation device described in the above, the heat conduction in the surface of ^^ & is embedded with a thermal conductivity constant greater than the heat conduction base, wherein one of the heat conduction bases and one of the heat conduction bases 2 The heat dissipation system of the heat sink as described in item 5 of Shen's patent scope is made of copper. Thermal insulation I: As described in item 5 of the scope of the patent application, the heat dissipation device 'at least two recessed recesses are recessed at the top surface of the two concave samples, and each of them is buried at the top of the heating body': The heated ends of the heat pipes are respectively placed in 4 grooves, and are in contact with the heat conductor. Etc. *, b. The heat dissipation device as described in item 1 of the scope of patent application, in which the thermal temples of the temple are curved in the shape of L. / 、 Zhongli M241970 VI. Scope of patent application 9. The heat dissipation device according to item 1 of the scope of patent application, wherein the heat pipes are integrally extended between the heat receiving portion and the heat radiation portion to form a curved portion. 10. The heat dissipating device according to item 1 of the scope of patent application, wherein the so-called relative direction refers to the directions on any two opposite sides of the heat conduction base. 1 1. The heat dissipation device according to item 1 of the scope of patent application, wherein the relative directions refer to the left and right directions of the heat conduction base. 1 2. The heat dissipating device according to item 1 of the scope of patent application, wherein the so-called relative direction refers to the front and back sides of the heat conducting base. Page 13