TWM245741U - Heat dissipating device with uniformly distributed heat spots - Google Patents

Heat dissipating device with uniformly distributed heat spots Download PDF

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Publication number
TWM245741U
TWM245741U TW92218958U TW92218958U TWM245741U TW M245741 U TWM245741 U TW M245741U TW 92218958 U TW92218958 U TW 92218958U TW 92218958 U TW92218958 U TW 92218958U TW M245741 U TWM245741 U TW M245741U
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Taiwan
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heat
scope
patent application
item
uniformly distributed
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TW92218958U
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Chinese (zh)
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Guo-Ren Lin
Huei-Min Tsuei
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Cpumate Inc
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Priority to TW92218958U priority Critical patent/TWM245741U/en
Publication of TWM245741U publication Critical patent/TWM245741U/en

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Description

應 新型所屬之技術領域】 本創作係、有關於一種均佈&點之散熱 用於政熱裝置上之複數熱管 ^ 先前技術】 j 裝置,尤指一種 之創作。 特性,故可傳 子產品的散熱 將熱管應用於 端與電子發熱 熱*讀片,俾藉 產生之熱量可 排熱、降溫, 可配合散熱風 ,此外,為使 遞至各散熱鰭 於以往熱管在 設置,故當複 。如此,若各 於熱源中心處 熱量頂部過於 此,本創作人 並配合學理之 述缺失之本創 按,由 及多用途等 非常適合電 而一般 令熱管之一 設有複數散 發熱元件所 上,以逐一 之熱量,亦 的散熱效果 快速地被傳 ’然而,由 上垂直延伸 係相互平行 管底部接觸 又谷易造成 有鑑於 特潛心研究 有效改善上 【新型内容 熱傳導能力 遞大量的熱 需求。 電子產品之 元件作熱傳 由熱管的高 透過熱管而 同時,對於 扇以快速將 電子發熱元 片上,通常 散熱裝置上 數支熱管並 熱管間的間 上;而若各 集中而不利 係為改善並 運用,終於 作。 、重量輕、結構簡單 且不消耗電力,因此 散熱裝置上,主要係 連結,而另一端則穿 熱傳導能力,使電子 被傳遞至各散熱鰭片 各政熱鱗片間所囤積 熱量驅離,達到良好 件所產生之熱量可更 會以複數支熱管為之 的排列,係多由下而 列排置時,各熱管間 距過大,將不利於熱 熱管間的間距過小, 於排熱之窘境。 解決上述之缺失,乃 提出一種設計合理且The technical field to which the new type belongs] The present invention relates to a type of uniform & point heat dissipation for multiple heat pipes on a political heating device ^ Prior art] j device, especially one type of creation. Characteristics, so it can pass the heat dissipation of the sub-products. The heat pipe is applied to the end and the electronic heating heat. * The heat generated can be used to remove heat and reduce the temperature. It can also cooperate with the heat dissipation wind. In the settings, so when it comes back. In this way, if the top of the heat at the center of the heat source is too much, the creator cooperates with the original theory that the academic theory is missing, and it is very suitable for electricity and other purposes. Generally, one of the heat pipes is provided with a plurality of heat dissipation elements. With one-by-one heat, the heat dissipation effect is also quickly transmitted. However, the upper vertical extension system is in parallel with the bottom of the tube, and the bottom of the tube is in contact with each other. This results in a lot of heat research to effectively improve the heat transfer capacity of the new content. The components of electronic products are used for heat transfer by the high-permeation heat pipe of the heat pipe. At the same time, for the fan to quickly heat the electronic heating element, usually a number of heat pipes are placed on the heat sink and between the heat pipes. Use and finally do. , Light weight, simple structure and no power consumption, so the heat dissipation device is mainly connected, while the other end wears heat conduction ability, so that the electrons are transferred to the heat dissipation fins and the heat accumulated between the thermal scales to drive away, achieving a good The heat generated by the pieces can be arranged by a plurality of heat pipes. When the heat pipes are arranged from the bottom to the bottom, the distance between the heat pipes is too large, which is not conducive to the small distance between the heat pipes and the dilemma of heat removal. Solving the above-mentioned shortcomings is to propose a rational design and

M245741 四、創作說明(2) 本創作之主要目的,在於可提供一種均佈熱點之 裝置,其係對於複數支熱管結合在一散教裝置上昧 該等熱管作-有效性之排列整合,以令以^觸:: 源中心處上時,亦能兼具熱點均佈’使之有效利用該今:、 裝置各構件之散熱面積,俾發揮其最佳之散熱效能^政熱 為了達成上述之目的,本創作係提供一 散熱裝置,包括一第一散熱體、一第二今 洛.、、、點之 管;其中,第二散熱體係相對位於 :挪至少二熱 熱管則皆具有受熱部與散熱部,.赦其s 7體上方,而各 係分別與第一、二散熱體作熱僂、查=官之受熱部、散熱部 者之受熱部間所形成之間距,孫、、"’且熱官中任二相鄰 部間所形成之間距;藉此,各埶^於,二相鄰熱管之散熱 為緊鄰,而能密集於第一散埶:二之文熱部即可因彼此較 位置處上,且各熱管之散熱^ 1、電子發熱元件相對應之 熱量分佈於第二散熱體各部^ _、可因彼此較為遠離而能將 ,並進而達成上述之目的。处,以達均勻擴散熱量之效 【實施方式】 為了使貴審查委員能更推_ & a 技術内容,請參閱以下有闕 ^瞭解本創作之特徵及 而所附圖式僅提供參考與、創作之詳細說明與附圖,然 限制者。 用’並非用來對本創作加以 請參閱第一圖、第二圖及 立體分解圖、立體組合圖及第一圖,係分別為本創作之 創作係提供一種均佈熱點 f二圖之3-3斷面剖視圖。本 ”、… 散熱裝置,包括一第一散熱體 M245741 ^、創作說明(3) 1、一第二散熱體2及至少二熱管3、3,;其中: 該第一散熱體1係以導熱性良好之材質所製成,如鋁 等’並可呈一平板狀體;該第一散熱體1係具有一基座1〇 ’於其基座10底面處凹設有一容置槽1〇〇 ,以於該容置槽 10〇内嵌入一導熱係數恆大於該第一散熱體1之導熱體丨J, 導熱體11可為銅所製成,為一片狀體,主要係與如中央處 理器(CPU ) 等電子發熱元件作貼合(圖略);另於該第 一散熱體1之基座1 〇頂面處則至少開設有一槽道丨〇 1,槽道 =1係恰好通過導熱體丨丨上方處而與之相通,以供上述熱 官3、3’局部埋設於該槽道1〇ι内時,可與導熱體丨丨直接接 觸。 該第二散熱體2係相對位於上述第一散熱體1頂面上方 处’亦可呈一平板狀體,並以導熱性良好之材質所製成, ^鋁、銅等;該第二散熱體2亦具有一基座20,該基座20 底面處開設有供上述熱管3、3,分別局部穿設之至少二溝 =2J) 〇 ,且於第一、二散熱體1、2之基座1 〇、· 2 〇間更設有 j熱鱗片組4 ’散熱鰭片組4係具有複數鰭片4 〇、4 〇,以 、’,間隔排列之方式橫向堆疊設置而組成,以使各鰭片4 〇 40卫垂直豎立於第一、二散熱體1、2之基座1〇、2〇間, 且該政熱鰭片組4之各鰭片4〇、40,亦可為銅材質所製成者 〇 且 f該熱官3、3 ’係可呈一「匚」字型之彎曲形狀,-熱s3、3皆具有一受熱部30、30,與一散熱部31、31 ’並於每一熱管3、3,之受熱部30、30,與散熱部31、31M245741 IV. Creation Instructions (2) The main purpose of this creation is to provide a device with evenly distributed hotspots, which is a combination of multiple heat pipes combined with a Sanskrit device in order to arrange and integrate the effectiveness of these heat pipes. Let ^ touch :: When the source center is on, it can also have hot spots evenly distributed so that it can effectively use the current :, the heat dissipation area of each component of the device, and exert its best heat dissipation performance. For this purpose, this creative department provides a heat dissipation device, including a first heat sink and a second heat sink. Among them, the second heat dissipation system is relatively located: at least two heat pipes have heat receiving sections and Radiator, above the s 7 body, and the distance between each department and the first and second radiators, respectively, and the heat-receiving department of the official, the heat-receiving department, the distance between the heat-generating department, Sun ,, " 'And the distance formed between any two adjacent parts in the heat officer; by this, each of the two heat pipes is close to the heat dissipation of the two adjacent heat pipes, and can be denser than the first one: Positioned relatively to each other, and the heat dissipation of each heat pipe ^ 1, electronic hair The element distribution corresponding to the second heat radiating member _ ^ each part, may be due to relatively away from each other can, thus achieving the above purposes. In order to achieve the effect of uniformly diffusing heat [Implementation] In order to enable your review committee to better promote _ & a technical content, please refer to the following 阙 to understand the characteristics of this creation and the drawings are provided for reference only, The detailed description and drawings of the creation are restrictive. Use 'is not used to refer to this creation. Please refer to the first picture, the second picture and the three-dimensional exploded view, the three-dimensional combination diagram and the first picture. It is to provide a uniform hot spot for the creative department of the creation. Sectional view. This ", ... heat sink includes a first heat sink M245741 ^, creative instructions (3) 1, a second heat sink 2 and at least two heat pipes 3, 3; wherein: the first heat sink 1 is thermally conductive The first heat sink 1 has a base 10 ′, and a receiving groove 100 is recessed at the bottom surface of the base 10, A thermal conductor with a thermal conductivity constant greater than that of the first heat sink 1 is embedded in the accommodating slot 100. The thermal conductor 11 may be made of copper and is a piece of body, which is mainly connected to, for example, a central processing unit. (CPU) and other electronic heating components for lamination (not shown); at the top of the base 1 of the first heat sink 1 there is at least a slot 丨 〇1, slot = 1 is just through the thermal conductor丨 丨 It communicates with the upper part, so that when the above-mentioned thermal officials 3, 3 'are partially buried in the channel 10m, they can be in direct contact with the heat conductor. The second heat sink 2 is relatively located in the first section. A heat sink 1 above the top surface can also be a flat plate and made of a material with good thermal conductivity, such as aluminum, copper, etc .; The second heat sink 2 also has a base 20, and the bottom of the base 20 is provided with at least two grooves for the above heat pipes 3 and 3, respectively, and at least two grooves = 2J), and the first and second heat sinks 1, 2 There are j thermal scale groups 4 'between the bases 1 0 and 2 0. The heat dissipation fin group 4 has a plurality of fins 4 0 and 4 0, which are arranged in a horizontally stacked manner with a space of', ' The fins 4040 are vertically erected between the bases 10 and 20 of the first and second heat sinks 1 and 2, and the fins 40 and 40 of the political heat fin group 4 may also be Made of copper material 0 and f, the heat official 3, 3 'can be a curved shape of "匚",-heat s3, 3 have a heat receiving portion 30, 30, and a heat radiating portion 31, 31 'And in each heat pipe 3, 3, the heat receiving part 30, 30, and the heat radiation part 31, 31

M245741 四、創作說明(4) 之間一體延伸而形成一傳熱部、32 ,且傳熱部32、32’ 分別與受熱部3〇、及散熱部31、31’之間又各自一體延 伸而形成一彎曲部3 3、3 3 ’,藉以構成所述之熱管3、3,; 各熱管3、3,之受熱部30、30’與散熱部31、31’係分別與 上述第一、二散熱體1、2以作熱傳連結為必要’在本創作 中,二熱管3、3’之散熱部、31’係分別穿入於第二散熱 體2之各溝槽200中’而受熱部30、30’則共同埋入於第一 散熱體1之槽道101内’且與導熱體Η表面相接觸(如第三 圖所示),以令熱管3、3’可將導熱體11所吸附之熱量藉 由傳熱部3 2、3 2,快速傳導至散熱部3 1、3 1,處。 本 3’係與 圖所示 體2 呈 相鄰熱 該二相 據此, ,而能 處上, 為遠離 均勻擴 熱裝置 此 於該散 創作主要即在於該等熱管3、3’中,至少有一熱管 另一垂直豎立之熱管3呈向外之傾斜設置(如第三 )’或使該等熱管3、3’由第一散熱體1向第二散熱 一放射狀之排列設置(圖略),如是,即可令任^ 官3、3 ’之受熱部3 0、3 〇 ’間所形成之間距&,小於 鄰熱I 3、3 ’之散熱部3 1、3 1,間所形成之間距s2 ; f熱管3、3,之受熱部3〇、3〇,即可因彼此較為緊鄰 密集於第一散熱體1與電子發熱元件相對應之位置 至於各熱管3、3,之散熱部31、31,,也能因彼此較 及更了將熱篁分佈於苐二散熱體2各部位處,以達 散熱量之效,從而使熱點均佈,藉以有效利用該散 ^構=之散熱面積,俾發揮其最佳之散熱效能者。 °月併參閱第一圖及第四圖所示,本創作更可 熱鰭片組4與熱管3、3’彎曲部33、33,(即熱管3、M245741 Fourth, the creation instructions (4) are integrally extended to form a heat transfer section, 32, and the heat transfer sections 32, 32 'and the heat receiving section 30, and the heat dissipation sections 31, 31' are extended integrally respectively. A bent portion 3 3, 3 3 ′ is formed to constitute the heat pipes 3 and 3 described above; the heat receiving portions 30 and 30 ′ and the heat radiating portions 31 and 31 ′ of each of the heat pipes 3 and 3 are respectively the same as the above-mentioned first and second portions The heat sinks 1 and 2 are necessary for heat transfer connection. In this creation, the heat sinks 31 and 31 'of the two heat pipes 3 and 3' are respectively inserted into the grooves 200 of the second heat sink 2 and the heat receiving parts. 30 and 30 'are buried in the channel 101 of the first heat sink 1' and are in contact with the surface of the heat conductor (as shown in the third figure), so that the heat pipes 3 and 3 'can place the heat conductor 11 The absorbed heat is quickly conducted to the heat radiating sections 3 1, 3 1 through the heat transmitting sections 3 2, 3 2. The 3 'system is adjacent to the body 2 shown in the figure. The two phases are based on this, and can be located in order to stay away from the uniform heat expansion device. This is mainly in the heat pipes 3, 3', at least There is a heat pipe and another vertically erected heat pipe 3 is outwardly inclined (such as the third) 'or the heat pipes 3 and 3' are arranged in a radial arrangement from the first heat sink 1 to the second heat sink (not shown) If so, the distance & formed between the heat receiving sections 3 0 and 3 ′ of the officer 3 and 3 ′ may be made smaller than the heat dissipation sections 3 1 and 3 1 between the adjacent heat I 3 and 3 ′. Distance s2; f heat pipes 3, 3, the heat receiving parts 30, 30, that is, because they are closer to each other and are closer to the positions of the first heat sink 1 and the electronic heating element, as for the heat dissipation parts of the heat pipes 3, 3, 31, 31, It is also possible to distribute the thermal energy to each part of the second heat sink 2 due to comparison with each other, so as to achieve the effect of heat dissipation, so that the hot spots are evenly distributed, thereby effectively utilizing the heat dissipation of the heat dissipation structure = Area, to maximize its thermal performance. ° Refer to the first and fourth figures, this creation can be used to heat the fin group 4 and the heat pipes 3, 3 'bends 33, 33 (ie, the heat pipes 3,

第9頁 M245741Page 9 M245741

四、創作說明(5) 3’受彎曲部位)相鄰近之鰭片4〇,上,開 彎曲部33、33’彎曲方向而擴大之槽孔4〇〇,, ‘、、、目3、3 使各熱管3、3’之·彎曲部33、33,適度地局部埋可 400’内,以令各熱管3、3,之傳熱部32、32,可魚== 組4最外侧之鰭片4〇,更加緊鄰(如第四圖所示/、政片 免徒增該散熱裝置之整體體積。 ’進而避 點之=裝Γ上述之構造組成’即可得到本創作均佈熱 ,裝設於 熱鰭片組 風力裝置 帶走,同 側處上, 槽 102 , 風力裝置 (如第七 扇葉5 〇塾 散熱鳍片 散熱風扇 ,並與散 ,以使該 内之熱量 設置之該 酉己合之凹 ,俾使該 之側向處 框5 1將其 法對應至 再者,如第五圖、第六圖及第七圖 包括一風力裝置5,該風力裝置5可為一 上述第一、二散熱體1、2同向之一側處 4之各鰭片4 0、4 0 ’間所形成之流道相對 5所產生之氣流可順勢將蘊藏於各流道 時,亦可於第一散熱體1供該風力裝置5 開設一向内凹入並與該風力裝置底緣相 以令風力裝置5底緣沉入該凹槽1〇2内時 5之扇葉5 0得以完全對應於散熱鰭片組4 圖所示),進而避免因風力裝置5之外 高後,由於風力裝置5所產生之氣流無 組4底部處,是而造成熱量之囤積。 另,於該第一、二散熱體1、2外側處更可組設一風 52,該風罩52係具有四組片520、521並分別連接於第_ 二散熱體1、2間之二側外前、後處所構成,俾可將風力 置5所產生之氣流予以集中,以針對各熱管3、3,及散熱^Fourth, the creation description (5) 3 'bending part' adjacent to the fins 40, on, open the bending part 33, 33 'bending direction to expand the slot 400 ,,' ,,, head 3, 3 The bent portions 33 and 33 of each heat pipe 3 and 3 'can be partially and partially buried within 400', so that the heat transfer portions 32 and 32 of each heat pipe 3 and 3 can be fished == the outermost fins of group 4 The film 40 is even closer (as shown in the fourth picture), and the political film will not increase the overall volume of the heat sink. The wind device installed in the thermal fin group is taken away, and on the same side, the slot 102, the wind device (such as the seventh fan blade 50 °), and the cooling fan is dispersed, so that the heat in the fin is set to the Concave recess, so that the side of the frame 51 1 corresponds its method to the other, such as the fifth figure, sixth figure and seventh figure includes a wind power device 5, the wind power device 5 may be a first When the flow channels formed between the fins 40, 40 'at one side 4 of the first and second heat sinks 1, 2 in the same direction are opposite to the air flow generated by 5, they can be stored in each flow channel. The first heat sink 1 can be provided for the wind power device 5 to be recessed inward and be opposite to the bottom edge of the wind power device so that the bottom edge of the wind power device 5 sinks into the groove 102 when the blades 5 of 5 are completely completed. Corresponding to the fin group 4 shown in the figure), to avoid the accumulation of heat caused by the airflow generated by the wind device 5 without the bottom of the group 4 due to the height of the wind device 5 outside. One wind 52 can be set at the outer side of the two heat sinks 1 and 2. The wind hood 52 has four sets of sheets 520 and 521 and is connected to the outer front and rear spaces of the two sides of the second heat sink 1, 2 respectively. Structure, you can concentrate the airflow generated by the wind force 5 to target the heat pipes 3, 3, and heat dissipation ^

少可具有 排列而通 量快速藉 '21 ’因較 揮散熱裴 產品,甘 又因極具 爰依專利 創作人之 非因此即 書及圖式 作之範圍 M245741 、創作說明(6) 片組4進行散熱。 因此’藉由本創作均佈熱點之散熱裝置,至 下列諸多優點: 1、 由於各熱官3、3,之受熱部3〇、30,密集 過熱源中心處上,故可將主要熱源處所產生之熱 由傳熱部32、32傳導至散熱部31、31,上。 2、 同前點所述,各熱管3、3,之散熱部21 分散於第二散熱體2上,故可使熱點均佈,以發 置之政熱作用’並促使熱罝擴散而達均溫之效果 綜上所述,本創作實為不可多得之新型創作 確可達到預期之使用目的,而解決習知之缺失, 新穎性及進步性,完全符合新型專利申請要件i :j出申% ’敬請詳查並賜准本案專利,以保障 惟以上所述僅為本創作之較佳 拘限本創作之專利範圍,故舉凡運用:广, 内容所為之等效結構變&,均 心:明 内,合予陳明。 白包含於本創 第11頁 M245741 圖式簡單說明 【圖式簡單說明】 第一圖 係本創作之立體分解圖。 第二圖 係本創作之立體組合圖(另一視角)。 第三圖 係第二圖之3-3斷面剖視圖。 第四圖 係第二圖之4-4斷面剖視圖。 第五圖 係本創作增設風力裝置之立體分解圖(與第 二圖相同視角)。 第六圖 係本創作增設風力裝置之立體組合圖(與第 二圖相同視角)。 第七圖 係本創作增設風力裝置之側面剖視圖。 〔元件代表符號〕 <本創作> 第一散熱體 1 基座 10 槽道 101 導熱體 11 第二散熱體 2 基座 20 熱管 3、3’ 受熱部 3 0、3 0 ’ 傳熱部 32、32’ 容置槽 100 凹槽 102 溝槽 200 散熱部 3 1、3 1 ’ 彎曲部 3 3、3 3 ’Less can have permutation and the flux quickly borrows '21'. Because it is more efficient to dissipate Pei products, and because it is highly convertible to patent creators, the range of books and illustrations is M245741, creative instructions (6), group 4 For cooling. Therefore, with this work, the heat dissipation device that distributes hotspots has the following advantages: 1. Because each heat officer 3, 3, the heat receiving section 30, 30, and the center of the dense superheat source, the main heat source can be generated. Heat is conducted from the heat transfer portions 32 and 32 to the heat dissipation portions 31 and 31 ,. 2. As mentioned above, the heat radiating portions 21 of the heat pipes 3 and 3 are dispersed on the second heat radiating body 2, so that the hot spots can be evenly distributed, so as to promote the spread of heat and achieve uniform heat distribution. In summary, the effect of Wen is that this new creation is indeed a rare new creation that can indeed achieve the intended purpose of use, and solves the lack of knowledge, novelty and progress, which fully meets the requirements for new patent application i: j 'Please check and approve the patent in this case carefully to ensure that the above is only a better limitation of the scope of the patent for this creation. Therefore, any use: wide, equivalent structural changes of the content & : Ming Nai, together with Chen Ming. White included in the original page M245741 Simple illustration of the drawings [Simplified illustration of the drawings] The first picture is a three-dimensional exploded view of this creation. The second picture is a three-dimensional combination picture (another perspective) of this creation. The third figure is a 3-3 cross-sectional view of the second figure. The fourth figure is a sectional view taken along the 4-4 section of the second figure. The fifth image is a three-dimensional exploded view of the wind power installation (the same perspective as the second image). The sixth picture is a three-dimensional combination diagram of the wind power installation (the same perspective as the second picture). The seventh figure is a side cross-sectional view of the wind turbine installed in this creation. [Element Representative Symbol] < This Creation > First heat sink 1 Base 10 Channel 101 Heat conductor 11 Second heat sink 2 Base 20 Heat pipe 3, 3 'Heat receiving section 3 0, 3 0' Heat transmitting section 32 , 32 'accommodating groove 100 groove 102 groove 200 heat sink 3 1, 3 1' curved portion 3 3, 3 3 '

第12頁 M245741 圖式簡單說明 散熱鰭片組 4 縛片 40 > 40? 槽孔 400’ 風力裝置 5 扇葉 50 外框 51 風罩 52 組片 520 ^ 521Page 12 M245741 Brief description of the drawing Radiating fin set 4 Binder 40 > 40? Slot 400 ’Wind device 5 Fan blade 50 Frame 51 Wind hood 52 Group 520 ^ 521

(II 第13頁(II p. 13

Claims (1)

M245741 五 、申請專利範圍 種均佈熱點之 第一散熱體; 散熱裝置,包括: 一第二散熱體,相對 至少二熱管,皆具有 熱部、散熱部係分別與該 該等熱管任一相鄰者之受 二相鄰熱管之散熱部間所 2、 如申請專利範圍 置,其中該第一散熱體係 設有一槽道,且各該熱管 3、 如申請專利範圍 置,其中該第一散熱體係 有一容置槽,於該容置槽 一散熱體之導熱體。 4、 如申請專利範圍 置,其中該導熱體係為銅 5、 如申請專利範圍 置,其中該基座頂面至少 導熱體上方而與之相通, 槽道内,並與該導熱體直 6、 如申請專利範圍 置,其中該第二散熱體係 設有二供各該熱管之散熱 7、 如申請專利範圍 位於該第一散 受熱部與散熱 第一、二散熱 熱部間所形成 形成之間距。 第1項所述之 具有一基座, 之受熱部係埋 第1項所述之 具有一基座, 内係嵌入一導 熱體上方 部,各該 體作熱傳 之間距, 均佈熱點 該基座頂 設於該槽 均佈熱點 且該基座 熱係數恆 •’及 熱管之受 連結,且 係小於該 之散熱裝 面至少開 道内。 之散熱裝 底面凹設 大於該第 第3項 所製成 第3項 開設有 且各該 接接觸 第1項 具有一 部分別 第1項 所述之均佈熱點之散熱裝 所述之均佈熱點 一槽道,該槽道 熱管之受熱部係 〇 所述之均佈熱點 基座’該基座底 穿設之溝槽。 所述之均佈熱點 之散熱裝 係通過該 埋設於該 之散熱裝 面至少開 之散熱裝M245741 5. The first heat sink with uniformly distributed hot spots in the scope of patent application; The heat sink includes: a second heat sink, with at least two heat pipes, each having a heat section, and the heat sink is adjacent to any of these heat pipes. If the heat sink is adjacent to two adjacent heat pipes, if the scope of the patent application is set, the first heat dissipation system is provided with a channel, and if each of the heat pipes is located in the scope of the patent application, the first heat dissipation system has a The accommodating groove is a heat conductor of a heat sink in the accommodating groove. 4. If the scope of the patent application is set, the thermal conduction system is copper 5. If the scope of the patent application is set, the top surface of the base is at least above the heat conductor and communicates with it, in the channel, and straight with the heat conductor 6. The scope of the patent is provided, wherein the second heat dissipation system is provided with two heat sinks for each of the heat pipes. If the scope of the patent application is located between the first heat dissipation part and the heat dissipation first and second heat dissipation parts, a gap is formed. The heat-receiving part described in item 1 is buried, and the heat-receiving part described in item 1 is embedded in the upper part of a heat-conducting body. Each body is used as a heat transfer distance, and the base is evenly distributed. The top of the seat is provided with hot spots evenly distributed in the groove and constant heat coefficient of the base and the connection of the heat pipe, and it is smaller than the heat dissipation surface at least in the open channel. The bottom surface of the heat dissipating device is larger than the heat dissipating device described in item 3, which is provided in item 3, and each of the contact items has a uniformly distributed hot spot as described in item 1 The channel, the heated part of the channel heat pipe is a uniformly distributed hotspot base as described above. The heat dissipating device for uniformly distributed hot spots is a heat dissipating device which is at least opened by the heat dissipating surface embedded in the heat dissipating surface. 第14頁 M245741 五、申請專利範圍 置,其中該第一、二散熱體之間,係設有一具有複數鰭片 以連續間隔排列之方式所組成之散熱鰭片組。 8、 如申請專利範圍第7項所述之均佈熱點之散熱裝 置,其中該散熱鰭片組之各該鰭片係豎立於該第一、二散 熱體之間。 9、 如申請專利範圍第7項所述之均佈熱點之散熱裝 置,其中該散熱鰭片組與各該熱管受彎曲部位相鄰近之鰭 片上,係開設有朝各該熱管彎曲部位所彎曲之方向而擴大 之槽孔。 1 0、如申請專利範圍第1項所述之均佈熱點之散熱 裝置,其中各該熱管皆呈「c」字型之彎曲形狀。 1 1、如申請專利範圍第1項所述之均佈熱點之散熱 裝置,其中各該熱管之受熱部與散熱部間係一體延伸而形 成一傳熱部,且各該熱管之傳熱部與其受熱部、散熱部間 又各自一體延伸而形成一彎曲部。 1 2、如申請專利範圍第1項所述之均佈熱點之散熱 裝置,其中該等熱管中,至少有一該熱管係與另一垂直豎 立之該熱管呈向外之傾斜設置。 1 3、如申請專利範圍第1項所述之均佈熱點之散熱 裝置,其中該等熱管由該第一散熱體向該第二散熱體呈一 放射狀之排列設置。 1 4、如申請專利範圍第1項所述之均佈熱點之散熱 裝置,其更包括一裝設於該第一、二散熱體同向一側處之 風力裝置。Page 14 M245741 V. Application scope of patent, among the first and second heat sinks, there is a heat sink fin group with a plurality of fins arranged in a continuous interval. 8. The heat dissipating device with uniformly distributed hot spots as described in item 7 of the scope of patent application, wherein each of the fins of the heat dissipation fin group is erected between the first and second heat sinks. 9. The heat dissipating device with uniformly distributed hot spots as described in item 7 of the scope of the patent application, wherein the fin group adjacent to the bent portion of each of the heat pipes is provided with a bent portion facing the bent portion of each of the heat pipes. Direction enlarged slot. 10. The heat-dissipating device with uniformly distributed hot spots as described in item 1 of the scope of patent application, wherein each of the heat pipes has a curved shape of "c". 1 1. The heat dissipating device with uniformly distributed hot spots as described in item 1 of the scope of patent application, wherein the heat receiving portion and the heat dissipating portion of each heat pipe extend integrally to form a heat transfer portion, and the heat transfer portion of each heat pipe and Each of the heat receiving portion and the heat radiating portion extends integrally to form a curved portion. 1 2. The heat-dissipating device with uniformly distributed hot spots as described in item 1 of the scope of the patent application, wherein at least one of the heat pipes is inclined outward with the heat pipe vertically standing up. 1 3. The heat-dissipating device with uniformly distributed hot spots as described in item 1 of the scope of patent application, wherein the heat pipes are arranged in a radial pattern from the first heat-dissipating body to the second heat-dissipating body. 14. The heat dissipating device with uniformly distributed hot spots as described in item 1 of the scope of the patent application, further comprising a wind device installed on the same side of the first and second heat dissipating bodies. 第15頁 M245741 五、申請專利範圍 1 5、如申請專利範圍第1 4項所述之均佈熱點之散 熱裝置,其中該風力裝置係為一散熱風扇。 1 6、如申請專利範圍第1 4項所述之均佈熱點之散 熱裝置,其中該第一散熱體供該風力裝置設置之該側處上 ,係開設有一向内凹入並與該風力裝置底緣相配合之凹槽 〇 1 7、如申請專利範圍第1 4項所述之均佈熱點之散 熱裝置,其中該第一、二散熱體外側處係組設一風罩,該 風罩具有四組片並分別連接於該第一、二散熱體間之二側 外前、後處所構成。Page 15 M245741 5. Scope of patent application 1 5. The heat dissipation device with uniformly distributed hot spots as described in item 14 of the scope of patent application, wherein the wind power device is a cooling fan. 16. The heat dissipating device with uniformly distributed hot spots as described in item 14 of the scope of the patent application, wherein the first heat dissipating body is provided on the side where the wind power device is disposed, and is provided with an inward recess and connected with the wind power device. A groove matching the bottom edge 〇7. The heat dissipating device with evenly distributed hot spots as described in item 14 of the scope of the patent application, wherein a windshield is arranged outside the first and second heat sinks, and the windshield has Four groups of sheets are respectively connected to the outer front and rear spaces of the two sides between the first and second heat sinks. 第16頁Page 16
TW92218958U 2003-10-24 2003-10-24 Heat dissipating device with uniformly distributed heat spots TWM245741U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115443046A (en) * 2022-09-29 2022-12-06 西安易朴通讯技术有限公司 Temperature equalization plate and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115443046A (en) * 2022-09-29 2022-12-06 西安易朴通讯技术有限公司 Temperature equalization plate and electronic equipment

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