M243706 五、創作說明（1) [新型所屬之技術領域] 本創作係有關於一種顯示卡散熱結構之改 , 導熱管連接與顯示卡晶片接觸的鋁擠型散熱體义二係藉由 設的散熱鰭片’而能增加其散熱面積，以二4，背面所増 果。 Λ、進其散熱之效 [先前技術] 按，習知電腦顯示卡a的構造（如第— 主要具有一顆晶片b，使用時可將該一領7^)，其中 板的顯示卡插槽UGP Pr〇)，即可由該電腦^3插置於主機 示晝面，然而，該顯示卡（AGP Card)a ^動顯示器顯 釋放出熱量，為避免該裝置因過埶損壞，曰曰片b作f作時會 者會在該晶片b上組裝—組散熱器c，'可择二==前有些業 與晶片b直接接觸傳熱，並配人A g这政熱器c本體 去。惟，相這樣的散熱構造與V式内^ 良之必要。 万所以對该習知構造實有再改 [新型内容] 本創作主要目的旨在楹徂 — 良，其能增加其散熱面積與力^散熱結構之改 為達上述目的，本創作本西^…放果 鋁擠型散熱體底部固定有_ 糸在與顯示卡晶片接觸之 熱管另端延伸連接至2卡個以上的導熱管，該導 之導熱管上固定有一，並於位在顯不卡背面處 產生的熱量吸收：傳；；；”’而可將顯示卡晶片上所 4不卡背面的散熱鰭片上，以達M243706 V. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a change in the heat dissipation structure of a graphics card. The aluminum tube extruded heat sink connected to the heat pipe is in contact with the graphics card. The fins can increase its heat dissipation area. Λ, into its heat dissipation effect [previous technology] Press, you are familiar with the structure of computer graphics card a (such as the first-mainly has a chip b, you can use this collar 7 ^), of which the graphics card slot UGP Pr〇), can be inserted by the computer ^ 3 on the host computer's display, however, the display card (AGP Card) a ^ moving the display to release heat, in order to avoid the device due to excessive damage, said film b When doing f, the person will assemble on the chip b-group radiator c, 'optional two == some industries directly contact the chip b to transfer heat, and they are assigned to the main body of the government heater c. However, the heat dissipation structure and the V-type internal structure are necessary. So I have made changes to the structure of this knowledge. [New content] The main purpose of this creation is to improve the heat dissipation area and force. The heat dissipation structure has been changed to achieve the above purpose. The bottom of the fruit extruded aluminum heat sink is fixed with _ 糸 The other end of the heat pipe that is in contact with the graphics card chip is extended to connect to more than 2 cards of heat transfer tubes, one of which is fixed on the heat transfer tube and is located on the back of the display card The heat absorption generated here: transfer ;; "" and can be placed on the graphics card chip 4 on the back of the cooling fins to achieve
M243706 五、創作說明（2) 到增加其散熱面積，使散熱 [實施方式] 為了使 貴審查委員對 能有更深一層的認識與瞭解 配合下列諸附圖，詳加說明 首先’請參閱笫一至弟 熱結構之改良」係組裝於顯 進行散熱者，其至少包括： 組成’其特徵在·遺紹擠型 凹槽21，在該凹槽21内得固 的另一端則順著顯示卡1彎 置，並於延伸至顯示卡1背 組散熱鰭片5 ，該散熱鰭片 上的通孔51，再將其穿設固 管4上者。 如上述構造組合使用時 所產生的熱，可以很快的由 2吸收’並導熱效率較佳之 熱鰭片5上’以能有效的增 該散熱器對顯示卡晶片U的 再請參閱第三及第四圖 示卡1背面之散熱鰭片5上 直接對顯示卡1背面之散孰 增加該組散熱鰭片5的散g 效能上能更加快速者 本創作的構造、裝置及其特徵 ’兹舉一較佳之可行實施例並 如下： 四圖所示，本創作「顯示卡散 示卡1上用來對其中的晶片11 銘擠型散熱體2及一風扇3所 散熱體2底面設有一個以上之 定有導熱管4 ，而該導熱管4 曲延伸至該顯示卡1的背面位 面的導熱管4上連接固定有一 5係在其板面上開設有一個以 定在位於顯示卡1背面的導熱 ’其中由顯示卡1上的晶片j j 與其緊密接觸之鋁擠型散熱體 導熱管4將熱傳輸到背面的散 加其散熱面積，而可直接增力 散熱功效者。 力 所示’本創作實施時亦可在顯 =加設一風扇6，可藉該風屬 鰭片5吹風，而能更進一步 效能。 M243706 五、創作說明（3)M243706 V. Creation instructions (2) To increase its heat dissipation area to enable heat dissipation [Implementation] In order to allow your reviewers to have a deeper understanding and understanding of the following drawings, please explain in detail first 'Please refer to the first one to the younger "Improvement of the thermal structure" is assembled in the display for heat dissipation, and it includes at least: Its features are: · Extruded groove 21, and the other end fixed in the groove 21 is bent along the display card 1 And extend to the heat dissipation fins 5 of the back group of the display card 1, the through holes 51 on the heat dissipation fins, and then pass them through the fixing pipe 4. The heat generated when the above structures are used in combination can be quickly absorbed by 2 'on the thermal fins 5 with better thermal conductivity' to effectively increase the heat sink to the graphics card chip U. Please refer to the third and The fourth graphics card 1 directly disperses the heat dissipation fins 5 on the back of the display card 1 to increase the dispersion of the group of heat dissipation fins 5. The structure, device and features of this creation can be faster. A preferred feasible embodiment is as follows: As shown in the four figures, in this creation, “the chip 11 on the display card 1 is used to align the chip 11 and the heat sink 2 and a fan 3 are provided with more than one underside of the heat sink 2 A heat pipe 4 is fixed, and the heat pipe 4 extends to the rear surface of the display card 1 and is connected to the heat pipe 4 with a 5 series. A plate is provided on the plate surface for positioning on the back of the display card 1. Thermal conductivity 'in which the chip jj on the display card 1 is in close contact with the aluminum extruded heat sink heat transfer tube 4 which transfers heat to the back and spreads its heat dissipation area, which can directly increase the heat dissipation effect. During the implementation, a fan can also be installed in the display = 6 The metal may, by wind blowing fin 5, the performance can be further. M243706 V. Creation described (3)
又，如上述之構造’其中係可在所增設的散熱鰭片5 組兩側各設有一支樓架7固定於顯示卡1的背面，再將上In addition, as in the above-mentioned structure ', one floor frame 7 can be provided on each side of the additional 5 sets of heat-dissipating fins to be fixed on the back of the display card 1, and then the upper
述之風扇6以螺絲鎖固於支撐架7，而可方便組裝及避免 導熱管4的荷重，進而增加該產品之使用壽命。如上述之 支撐架7在其側壁面上可開設有複數個通孔71，以能提供 氣流順暢流通’以增加散熱效果。 ^ 再請參閱第五及第六圖所示，本創作之鋁擠型散熱體 2得製作成二件式之姑構，其包含一散熱鰭片本體22^ 一 底板23 ’並在放熱II片本體22底面設有數道凹槽2ia，飯 在底板23上設有相對應之凹槽21b，組合後在凹槽21a與凹 槽2 lb之間恰形成一管道空間而可用以容納與固定導熱管 4之結構者。又，如該二圖例所示，其中在鋁擠型散熱&體 2上亦得加設風扇6或不加風扇6二種型式者。 綜上所述， 達到有效利用空 符合專利法所規 又，本創作所述 未有相同之構造 新穎性。申請人 新型專利之申請 惟上述者， 已，大凡依據本 之專利申請範園 本創作顯示卡散熱結構之改良」 間以增加效果之功能與目的；是二 定之「實用性」與「進步性」之要 之構造及其組織型態，於本素提出 公開使用或見於刊物，本案因而具 爰依新型專利法之規定，向 #句 ，並懇請早曰賜准本案專利，實感 僅為本創作其中之一的較佳可行實 創作所為之各種修飾與變化，仍廣 所涵蓋。 ~ 確實倉丨 本案辦 件； 申請前 創作之 局提起 德便。 施例而 被本案The fan 6 is locked to the support frame 7 with screws, which can facilitate the assembly and avoid the load of the heat pipe 4, thereby increasing the service life of the product. As described above, the support frame 7 may be provided with a plurality of through holes 71 on its side wall surface, so as to provide smooth airflow 'to increase the heat dissipation effect. ^ Please refer to the fifth and sixth figures again. The aluminum extruded heat sink 2 of this creation can be made into a two-piece structure, which includes a heat sink fin body 22 ^ a base plate 23 'and a heat release II sheet. The bottom surface of the body 22 is provided with a plurality of grooves 2ia, and the rice plate is provided with corresponding grooves 21b on the bottom plate 23. After combination, a pipe space is formed between the groove 21a and the groove 2 lb, which can be used to receive and fix the heat pipe. 4 of the structure. In addition, as shown in the two illustrations, a fan 6 or a fan 6 may be added to the aluminum extruded heat sink & body 2. To sum up, achieving the effective use of air is in compliance with the provisions of the Patent Law. In addition, the structure described in this work does not have the same structural novelty. The applicant's new patent application is only the above. Already, according to this patent application, the improvement of the heat dissipation structure of the graphics card created by the authors has the function and purpose of increasing the effect; it is the "practicalness" and "progressiveness" of the second set. The essential structure and its organizational form were proposed for public use in Bensu or found in publications. Therefore, the case is based on the provisions of the New Patent Law, and the # sentence is urged to be granted as soon as possible. The real sense is only part of the creation. The various modifications and changes for one of the better and practical creations are still widely covered. ~ Exact position 丨 This case is handled; the Bureau of Creation before the application filed a debenture. The case
M243706 圖式簡單說明 第一圖係為習知顯示卡散熱結構實施立體圖。 第二圖係為本創作顯示卡散熱結構之立體分解圖。 第三圖係為本創作顯示卡散熱結構之立體組合實施例圖。 第四圖係為第三圖之實施例的側視平面組合圖 第五圖係為本創作之另一實施例立體局部分解圖。 第六圖係為本創作之再一實施例立體組合圖。 圖號說明： 顯示卡--------- -1 1呂擠型散熱體 - ——2 風扇 -3 > 6 導熱管--------- —4 散熱n片------- - 5 支撐架 - ---7 aa片 - 11 凹槽---21、21a 、21b 散熱縛片本體--- 通孔----------- - 22 -51 、 71 底板 —— 23M243706 Brief description of the diagram The first diagram is a perspective view of a conventional graphics card heat dissipation structure. The second picture is a three-dimensional exploded view of the heat dissipation structure of the creative graphics card. The third figure is a three-dimensional combination embodiment diagram of the heat dissipation structure of the creative display card. The fourth figure is a side-view plane combination view of the embodiment of the third figure. The fifth figure is a partially exploded view of another embodiment of the creation. The sixth picture is a three-dimensional combination diagram of yet another embodiment of the creation. Description of drawing number: Display card --------- -1 1 Lu extruded heat sink----- 2 Fan-3 > 6 heat pipe --------- — 4 heat sink n- -------5 Support frame---- 7 aa sheet-11 groove --- 21, 21a, 21b Radiating binding body --- --- ------------ 22 -51, 71 floor-23