TWM241718U - Improvement of heat dissipation structure for central processor - Google Patents

Description

M241718

【Technology Field of New Type】

This creation is about a kind of central processing crying U. The heat dissipation segment on the radiator ... The structure Xe is designed by a plurality of appropriate sizes: the surface-type heat-dissipating sheet improves the arrangement of the structure to make it accessible; 11 pieces of heat-sinking heat sink. You retreat [prior art] 3 times-the heat sink structure of the central processor used in general, although "Xi = different structural arrangements, but for the heat sink, as shown in the first figure, its heat dissipation The cross-sectional structure of slice 1 is a straight piece-like shape, so overall, its heat dissipation area is small, so its heat dissipation performance will naturally be poor. The author has developed an alternative solution to this deficiency. With a simple and improved design, it can make the heat dissipation area larger according to the premise of maintaining the space of the original overall combination volume. According to the above, the author of the case has the above Know the structure of computer heat sinks, where the wrong pieces are missing due to the small space of the cooling fins; 爰 carefully researched and accumulated their personal experience in the design and manufacture of this product for many years, and finally designed A brand-new "central processor heat sink structure".

In this creation, the structure of the heat-dissipating surface on the heat sink is improved from the flat-type heat-dissipating fins to a plurality of wave-shaped heat-dissipating fins of the same size.

Page 5 M241718 _ Case No. 92210937_ Qibei IV. Creative Instructions (2),: Every 5: The objects are arranged in parallel with each other. 'With such a structural design, it can be scattered; the film' its height remains the same as- The conventional flat type is said: the same consultation (that is, the original integral combination and volume space meaning under the previous topic), but it can make the surface of the cooling fin "larger" $ and improve the radiator [Performance method] In order to make the equipment of this creation more specific understanding, here are the following drawings: The second picture shows the three-dimensional structure of the creation, and the third picture shows the example of the heat sink of the creation. The source body 2 and the fan 3 and other related components are shown in the above two examples. 'The heat source body 2 series As a central processor, you can see the structure of the scattered wave-type heat dissipation fins 11, which are based on the original plane ^ ..., fins (as shown in the first figure), and the improved design is a wave T of an appropriate size. Type cooling fins 1 1 instead, and each wave type cooling fins 11, 疋Appropriate distances are arranged parallel to each other on the base 丨 3. In order to achieve the original body shape, under the premise of the space of the combined volume, the height of each wave-shaped cooling fin 11 is still the same as that of the general flat type. The heat sinks of the heat sinks, pads, and pads 101 have the same height, because the conventional linear heat sink fins 101 are improved and designed as wave-shaped heat sink fins ij, compared with wave-shaped heat sinks. The heat dissipation area of the fin 11 is much larger than that of the general linear heat sink 101, so its heat dissipation performance will also be better. The improved design of this creation is to achieve this advantage. Of course, when this creation is implemented, It can also be matched with auxiliary wave fins 1 1.

M241718 _Case No.92210937_Private Year + Month f Day Modification_ 4. Creation Instructions (3) Perforated through holes 1 2 (as shown in the fourth and fifth figures) to guide the air without causing the air flow to be blocked by waves In the heat dissipation fins 11 of 1, the heat dissipation performance is further improved. The reason is, 'It can be seen that the main purpose of this creation is to provide a heat sink structure on the central processing unit. The structure of the heat sink on the heat sink is improved and designed into a wave-shaped heat fin, which can increase The heat dissipation area of the heat sink, thereby improving the heat dissipation efficiency of the heat sink. The secondary purpose of this creation is to use a plurality of through-holes through the fins to drain the air, so that the airflow on the fins is more efficient, and the curved fins do not block the air. Flow. In summary, it is known that this case has the excellent characteristics described above, so that it can be used in operation to enhance the efficiency that is not used in practice, and to give practicability. It is a product structure improvement of great practical value. Designer

Page 7 M241718

_Case No.92210937_ Qiaonian Shiyue 'Modified Schematic Brief Description Schematic Illustration • The first picture is the stereoscopic structure of the conventional heat sink. The second picture is the stereoscopic structure of the heat sink. Third The figure is an example of the implementation of the creation set in related components. The fourth figure is an example of the implementation of the creation when there are 5 additional holes in the structure. The fifth figure is a drawing example in related components when a through-hole is added to the creative structure. The figure number illustrates the heat sink--1 heat source body--2 fan--3 wave-shaped cooling fin-11 base-13 plane Type cooling fins —— —— 101 heat sink 100 through hole -12

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Claims (1)

M241718 _ Case No. 92210937_ YYYY_Ifi_ V. Application scope 1. A central processor heat sink structure, which is a heat sink fin assembled on a computer board for heat dissipation of the central processor. The base is composed of a plurality of radiating fins; its characteristics are as follows: The structure of the heat sink fins on the central processing unit is designed to consist of a plurality of wavy radiating fins of the same size arranged in parallel with each other at the same fixed distance A plurality of through holes are formed on the wave-shaped heat dissipation fin surface. Page 9