TWM252990U - Heat sink and module thereof - Google Patents

Description

M252990 3. Creation instructions (l) [Technical field of the new type: The creation department is about a kind of heat sink and its module, which can be used for 7C parts and other heating elements in U: electronic heat.逯 散 散 4 [The previous contact and the combination of the excellent product is equal to the product can not flow between the sheet metal, the better the effect of flow is large, the structural aspects are also hot and diffuse. Technology] General heat dissipation to achieve heat dissipation sheet mode. Heat dissipation effect. Heat dissipation expansion. Plates and large compartments are limited. ’Conversely, its heat dissipation shows that it has very good thermal effects. However, the bulk of the sheet is aluminum flow guide. According to the 'scatter, the smaller the sheet and the guide effect, the flatter the shape is, and the structure uses thin metal and uses most of the interfacial area of the sub-device (the thermal area is an alloy material) However, it is not possible to produce heat dissipation; similarly, the better the thermal substrate group, the more the heat sink and the strength and resistance of the heat sink, the heat dissipation elements of the multi-element heat sink are all multiplied by the length; The larger the heating area that can provide convection, the heat sink is molded, and vice versa. Not only the area has a thermally conductive material that is pressure-oriented, and it is in contact with the space (plane, width) times. Diffuse air is in use, so In the aluminum alloy, there is a sexual arrangement with the air, and the group can carry out its heat dissipation surface. 'Since the surface heat sink is thin, each heat sink has multiple heat sinks for air cooling effect. The convection of the fins with a larger heat area increases the radiating area of the fins in the space that must be improved, that is, to improve the industry, such as the domestic announcement No. 314189 "High Those who pass the needle

The description of drama tF (2) The characteristics of the low-voltage thermal film junction are set as shown on the side of more than 1 to 3 sides. The heat dissipation structure of the electric loss of the solid tube is patented. That is, the front side (that is, the back 4 is in three ways and cannot be matched by roads and so on) and the characteristics of the case of the No. 320381 factory case are the first, round holes 1 ~ 1 3 through which the heat transfer pipe passes, of which, A plurality of ladders are arranged in a part of the area, and the other part is prominent. Moreover, the features of the latter case, such as the structure of the same case as the previous case, are limited to the center of the heat sink and the area of the heating element.

The heat transfer is shown in Figure 4 and the tabs on the surface are directed toward the tab: The tab is toward J [New content] [Technical problem to be solved] Press' to form a protrusion on the surface of the metal sheet: publicly disclosed in the previous case [It uses bumps to make gold; =, the product increases, but the bumps are bumps that are unevenly distributed on the front side of the plate surface at the same time, so they cannot be in close contact with the odd surface due to the walk. Second, the trapezoidal gap of the projecting piece is a trapezoidal gap produced by the heating TG component. The trapezoidal gap of the piece is symmetrically arranged with each other. Therefore, the trapezoidal gap of the piece is the contacting machine t 'resulting in a straight and rapid flow. , So that the heat conduction effect = In addition, the tabs are distributed on the front and back of the board, and the stamping technology has passed M252990. 4. Creation instructions (3) The process needs to be secondary processing and two molds, that is, after the front stamping is completed, turn it over. If the front and back tabs can be processed by one mold at a time, the process and processing costs can be reduced, but this is not achieved in practice. In addition, there is a space between the tabs and the tabs. This channel has no tabs on the front and back of the channel. This will reduce the opportunity to expand the heat dissipation area. Because the tabs are long, if they are arranged adjacent to each other, 'No more spaced channels' will weaken the structural strength of the long tabs, lose the compression and tensile effect, and lose the beauty of increasing the heat dissipation area. In addition, the heating elements in today's electronic devices are becoming smaller, so the more precise and smaller the volume, the relatively smaller the area and space of the heat sink and the heat sink module, so that the entire electronic device can be made smaller. Space is reduced; because traditional heat sinks must have a certain area and spaced channels to play an excellent heat dissipation function, the area and channels of traditional flat-type heat sinks have been reduced, which has led to reduced heat dissipation efficiency, so it is no longer suitable for use with Today, small electronic heating elements with limited space are implemented in cooperation. In view of this, how to design a heat sink and its module that can adapt to miniaturized heating elements: large heat dissipation area, good heat conduction and convenient production, and both compression and tensile functions is the main purpose of this creation. [Solutions The technical means of the problem] 1. The structure of this creation: The structure of the fin of this creation is as described in item 1 of the patent scope at intervals by a plurality of protrusions on the base surface formed by the application of multiple adjacent wave plates adjacent to each other. Made of copper negative metal flakes' each wave plate is distributed and the tabs are facing the same

Page 7 M252990 Horse, creation instructions (4) The protruding surface causes the contact surface of the adjacent flow. This creation includes: one and a plurality of heat-dissipating metal foils are wave plates that are distributed in the same direction, causing the 2 to flow through the airflow. The creation of a multi-area enlargement on the metal surface, the flow of the heat source generated by the staggered heat fins and the heat conduction are transmitted through the heat sink, and they are intersected with each other, and the heat sink heat conduction substrate is adjacent to the protrusions on the plurality of base planes. The function of the contact surface of the thin sheet is to make a tab on the undulating sub-substrate group to lead to generate a cross flow between the adjacent wave plates. The air module structure passing through the plate is arranged on a plurality of vertical wave plates. There are two tabs, and a product is formed between adjacent wave tabs, and a plurality of tabs adjacent to the cloth that passes through the heat sink at intervals are formed into a module substrate to form a thermal substrate. The flow is applied to the sheet where the electronic heat conduction is adjacent to the wave plate. The flow channel is a sudden flow channel which is formed by expanding and intersecting the substrate in the patented device. Flow from the fins. The 7th heat-generating metal is formed by a thin metal sheet, and the sheet is presented to expand the cross-contrast distribution 'and through the gas item, as described on the element; a thin sheet, this sheet, each of which is a staggered undulating heat sink connected to the current 0 The wave plate, and the base cloth of the wave plate, will increase the contact area of the radiating airflow of the heat sink; in addition, the air will pass through in convection. When dispersed, the heat-conducting substrate produced by the heating element in the electronic device is then conducted to the heat sink, which results. [Contrast with the effect of the prior art] The following advantages can be achieved by the implementation of this creation: 1 · The tabs on the heat sink are only distributed on the same side of the base surface, so the base surface can be in close contact with the heating element in the electronic device to Produce great nations

Page 8 M252990 4. The heat transfer effect of the creative description (5), because the small size of the tab and the small heat dissipation space, can be suitable for small heating elements. 2 · Adjacent wave plates are arranged adjacent to each other without any spaced planes, and each wave plate has multiple tabs, so the heat transfer area of the heat sink can be enlarged and the heat transfer efficiency can be improved. 3 · The tabs between the adjacent wave plates are staggered and distributed, which can enlarge the contact area between the heat sink and the passing airflow, and make the passing airflow cross convection. 4 · The projection on the heat sink only protrudes to one side. Because it is located on the same side of the heat sink, it only needs to be processed once when stamping. Even the secondary process does not require the heat sink to turn over, so the process is shortened and the processing cost is reduced. . 5 · The heat sink can directly contact the heating element in the electronic device, or be combined with the thermally conductive substrate, and then set the thermally conductive substrate on the heating element in the electronic device to allow the airflow to flow freely between the heat sinks. Can be implemented directly or as a modular implementer. 6 · The protruding fins of the heat sink have regular unevenness, which can not only enhance the strength and strengthen the structure, but also prevent deformation caused by external pressure, so it can produce excellent compression and tensile functions. [Embodiment] The following detailed description is based on the embodiment shown in the figure: [First embodiment] As shown in the sixth figure, it is a perspective view of the original heat sink i, which is composed of a plurality of adjacent wave plates 2, 2. Adjacent metal sheets, each wave plate

Page 9 is the horizontal slice 3, 3 '3 3, the heat dissipation of the space 0 Figure 1-3' the adjacent protrusion of the space between the convex direction on the heat dissipation surface) 3, is facing towards' both are for the adjacent slice 1 can The cross section A ~ A is a staggered distance with half of the sheet 3 being out, so the sheet 1 and the electric B—B section 'are two openings staggered by 3, so the vertical hot sheet passes through the gas, and the gas (Y The direction is rectangular 3, the creation instructions (6) 2, 2 are spaced apart from each other and the adjacent wave plates are separated from each other by the wave plate 3, so the heat transfer effect is as shown in the seventh picture of the adjacent tab plate 2 and adjacent ones, so that all 3 疋 are directly in contact with the horizontal plane below the base surface 4. As shown in the eighth figure, the protruding piece 3 and the two sides are open on each protruding piece 3 to make the air flow rise. As shown in the ninth figure, the staggered protrusions are in contact with each other, so they are scattered toward the base surface 4 (of the protrusions, and the protrusions are adjacent to the wave plate. The protruding piece 3 of the wave plate 2 is the same as the upward direction, which is shown in this figure, which is the protruding piece 3 adjacent to the side of Fig. 1. Similarly, the protruding piece 3 ' The sides are shown as ^ towards the person and the heat sink, as shown in Figure 1 scattered pieces 3, 3, can make the heat area relatively increase the same direction 3, 3, the shape of a number of protruding pieces 3, 3 'in the same direction protruding Due to the undulation distribution, there is no heat transfer surface of any large fins. The layout is disclosed, that is, the width of the wave tab 3 (L / 2) is staggered; The basal plane of 1 and the surface diagram of the heating element in the sub-device are disclosed in the diagram, so the side of the tab 3 is also open. The top view of the upper part can form an excellent empty direction (X direction). Instead of generating more flow, it will be cross-convection,) flow. However, it can also be as shown in the tenth figure

Page 10 M252990 Twisting and creation instructions (7) can be shown as a circular arc. The second figure is trapezoidal [the second embodiment is like the thirteenth figure, because the wave plate will be different, so there are three types, so use The three different widths produce excellent heat transfer and high, low temperature saturation, and low temperature difference. They are removed by the low temperature sudden 20 and the three-dimensional decomposition surface matched with the fourteenth figure has heating elements respectively located in the electronic device. The heat source generated by the direct connection of the thermal element 6 can also be integrated as a whole through the failure to fix it. Through this, it can be stabilized into a C-shaped or rectangular metal sheet. The picture shows the function of the wave plate turning function of the tab 3, which is relatively relatively absorptive heat dissipation. The picture, FIG. 6 is directly connected to the contact energy of the crystal 5 and 8 is used to disperse the work. The eleventh figure shows a triangle, or various shapes like the tenth. The embodiment shown in this figure is different from the first embodiment. In contrast, for example, the width of each tab is different, and the widths of the wave plates 2 a to 2 c a to 3 c are divided into three types. Favorable, even with a small amount of thermal energy temperature change, for example: the smaller the volume of the tab 3 c is high, on the other hand, the larger the volume of the tab 3 a is lower, so the use of The heat transfer effect can be passed through the fan, so that the heat dissipation efficiency can be improved. 'This creation is direct between the heat sink 1 and the circuit board 5: reveals two of the electronic device 5 such as the circuit board:: The body circuit 1 has two heat sinks and is transmitted through the heat sink 7 and the heat sink! Demon: There are fever fever, inflammation films, etc., who will disperse C. In addition, the 'hot sheet 1' has no coating guide = 70 pieces and 6 can. In addition, when it is loose, it can also be implemented in the c-shape, and the ^ itself can also be bent. The circuit board can mislead: the heat sink itself 之 page 11

M252990 IV. Creation Instructions (8) As shown in the sixteenth figure, the heat sink module 3 is not exposed to the heat sink module 3. It is composed of a plurality of heat sinks 1 on a heat-conducting substrate 9 plate. On the heating element, the heat sink is mounted on a thermally conductive substrate 9, the bottom end of which is fixed by a thermally conductive adhesive, the thermally conductive substrate 9 and the bracket of the casing 10, and the upper portion of the casing 10 is internally rivets 扇 〇fan 2 0 ' And it is placed between the upper plate 9 of the plurality of heat sinks 1 and a heating element such as a central processing unit (cp). The heat source generated by the heating element passes through the heat conducting substrate and the heat sink 1 and then is cooled by a fan 2. As shown in the seventeenth figure, this figure and the sixteenth one are shown in the eighteenth figure with a single piece from the center to the outside. This embodiment is The heat sink 丄 is erected on the thermally conductive substrate 9 in diameter (wide distance). [Actual form] As shown in FIG. 19, in the first embodiment, the height of the protrusion 3 of the heat sink 2 is 1. 6mm and the width is 3 〇mm (also the width of the wave plate) The distance between the protrusions 3 and 3, P = 4. 〇mm. As shown in Fig. 10, in the second embodiment, the height of the projection 3 of the heat sink 2 is H = 16inm, the three-dimensional and vertical thermal substrates are inter-segmented or soldered, and the implanted is 3; The module 3 is an exploded view. In the figure, the aforementioned heat-conducting base 9 is fixed in an electrically isolated parallel parallel manner; and the screw 10 2 is fixed to fix the wind through direct contact with the heat-conducting base, and then indirectly conducts heat due to heat dissipation. The difference between the use effect diagram of the sheet 1 〇 lies on the heat-dissipating substrate 9 of the heat sink; for example, there are multiple pieces with different concentric shapes, the original copper gold, the length L = 2.0 mm, and the thickness D = 〇 · 2mm, In another aspect, the length of the copper gold in this creation is L = 2.0mm and the width

Page 12 M252990 IV. Creative Instructions (9) W1 ~ W3 = 1.0, 2.0 and 3.0 mm, thickness D = 0 · 2_, and the distance P between the protruding pieces 3 and 3 ′ P = 4.0 mm. [Explanation of heat sink temperature test report] Test conditions

Heat source simulation: AMD CPU 266MHZ processor temperature (normal temperature) 117 ° C Radiating element component: Wave punched hole type Multi-piece heat sink is simulated as a CPU heat sink component (cpu 266Mhz) Test environment temperature 25 ° C Test observation conditions

Initial cooling with heat sink: 45 ° C 10 minutes with heat sink Temperature: 58 ° C 20 minutes with heat sink · 58 ° C 30 minutes with heat sink Temperature: 54 ° C with heat sink 40 Min. Temperature: 54 ° C 50 minutes with heat sink · 58 ° C 1 hour with heat sink: 54 ° C (variable temperature error ± 4 ° C floating) Temperature distribution test of cooling blade: 38 ° C ~ 39 ° C ± 1 ° C test branch point: (as shown)

Page 13 M252990

Fourth, the creation description (ίο) The above is based on this creative drawing within the scope of the creative purpose within the scope of the implementation of the structure of the creation of various equivalent changes within the scope. The detailed description of the formula is as follows. Only the professional can make various changes. Therefore, as long as it is within the scope of this creative example, it should be included in this creative model.

M252990 Illustration

[Schematic description] The first picture: Diyiyuan · The third picture · · The fourth picture: The fifth picture: The sixth picture: The seventh picture: The eighth picture: The ninth picture · · Tenth to tenth Three figures Fourteenth Figure Fifteenth Figure Fifteenth Figure Sixteenth Figure Seventeenth Figure Eighteenth Figure Nineteenth Figure Nineteenth Figure Top view of a conventional heat sink. It is a side view of the heat sink of the first figure. Top view of a conventional heat sink. This is a side view of the third heat sink. It is a plan view of each protrusion of the heat sink in the third figure. The perspective view of the first embodiment of the radiating fin of this creation is the A-A cross-sectional view of the sixth figure. Section B-B of the sixth figure. It is a partial top view of the heat sink of the sixth figure. Second picture: Other realities of the heat sink for this creation: The second embodiment of the heat sink for this creation: The heat sink for the creation is directly matched with the circuit board: the heat sink and circuit board group for the fourteenth picture: the heat sink module for this creation Three-dimensional decomposition of this: The three-dimensional of another heat sink module of this creation: The three-dimensional of this other heat sink module of this creation: The heat sink of the first embodiment of this creation: A sectional view of the embodiment of the second embodiment of the heat sink of this creation. Body diagram. Exploded view. Cross-section view after closing. Illustration. Exploded view. Exploded view. Partially enlarged view. Partially enlarged view.

[Description of component symbols] 1 ...... heat sink 2, 2 · · · wave plate 2 a ~ 2 c · · wave plate

Page 15 M252990 Brief description of the diagram 3 3, • reference • fist projection 3 a 3 c • • reference projection 4 • • base surface 5 • circuit board 6 heating element 7 • thermal adhesive 8 clamping device 9 thermal conductive substrate 1 0 Housing 1 0 1 Bracket 1 0 2 Screw 1 0 3 Rivet 2 0 • • Fan 3 0 • • Heatsink module

Page 16

Claims (1)

M252990 5. Scope of patent application1. A heat sink is a metal binding piece formed by a plurality of adjacent wave plates adjacent to each other, and each wave plate is formed by a plurality of protrusions on the base surface at an interval of f 'and protrusions. The fins are protruding in the same direction, and the fins between adjacent wave plates are staggered and distributed, so that cross flow channels are formed between adjacent fins to expand the contact area between the heat sink and the passing airflow, and make the passing The air flow is cross-convection. 2 · The heat sink according to item 1 of the scope of patent application, wherein the heat sink is formed by a plurality of wave plates of different widths adjoining each other. 3. The heat sink according to item 1 of the patent application, wherein the heat sink is a copper sheet. 4. The heat sink as described in item 1 of the scope of patent application, wherein the protrusion is rectangular. 5. The heat sink as described in item 1 of the patent application scope, wherein the protrusions are arc-shaped. 6. The heat sink as described in item 1 of the patent application scope, wherein the projection 疋 is triangular. 7. A heat sink module, comprising:-a thermally conductive substrate disposed on a heating element in an electronic device; and a gold thin film, which is a thin metal sheet erected on the aforementioned thermally conductive substrate, a wave of thin ^ It is a metal sheet made up of adjacent wave plates. Each direction = plate is formed by a plurality of tabs on the base surface distributed at intervals, and the tabs protrude in one direction, and the adjacent waves The fins between the plates are staggered *: Collapse f causes adjacent fins to form cross-flow channels to expand the contact area of the fins over the airflow and make the passing airflow cross-convection; Page 17 Therefore, when the heating element is full, unconnected, and conductive, it is conductive. # 勒 μ / The original is passed through the thermally conductive substrate and can be guided to each heat-radiating sheet, which is excellent. Ά The heat sinks are arranged in parallel and spaced apart from each other on a 1 = hot fin module, among which 9, such as the 7th substrate of the patent application scope. The heat sink is the single-chip heat sink module 10, as described in the patent application guide, and on the substrate. The medium heat sink is a plurality of 1u n heat sink modules as described in item 7 on the substrate. Evening films with different diameters (wide distance) concentrically stand on the guide ^