M254655 四、創作說明α) 【新型所屬之技術領域】 本創作提供一種微型電腦之散熱裝置，尤指一種藉由 散熱器上所設之L型散熱片及橫流式風扇，可將中央處理 器產生之熱源迅速有效的排出電腦外部，而不會累積在電 腦内部，如此可提升中央處理器及電腦内部電子組件之散 熱效能，可滿足電腦的速度愈來愈快，體積愈來愈小之散 熱需求。 【先前技術】 習知電腦中央處理器之散熱裝置，是在中央處理器的 上方裝設一散熱鰭片組，該散熱鰭片組用來吸收中央處理 器所產生之熱源；並在該散熱鰭片組的上方裝設一軸流式 風扇，該軸流式風扇吸取上方之冷空氣，再將冷空氣吹向 該散熱鰭片組，藉此來達到電腦中央處理器散熱的效果， 但如此的散熱方式，電腦中央處理器排出之熱源會直接排 放在電腦的機殼内，如此會造成電腦中央處理器及電腦機 殼中的其他電子組件再次吸收此熱源，而造成整個電腦散 熱效率的下降。 由於目前電腦發展的趨勢是速度愈來愈快，體積愈來 愈小，習知的散熱方式定無法滿足此一需求，故更進一步 提升電腦整體之散熱效率是必要的手段。 緣是，本創作人有感習知技術缺失之可改善，乃特潛丨| 心研究並配合學理之運用，提出一種設計合理且有效改善 習知技術缺失之創作。M254655 IV. Creation Description α) [Technical Field of New Type] This creation provides a heat dissipation device for a microcomputer, especially an L-shaped heat sink and a cross-flow fan provided on the radiator. The heat source is quickly and effectively discharged from the outside of the computer without accumulating in the computer. This can improve the cooling performance of the central processing unit and the internal electronic components of the computer, which can meet the cooling requirements of the computer, which is faster and faster, and smaller and smaller. . [Previous technology] The heat dissipation device of the conventional computer central processor is a heat dissipation fin set installed above the central processor. The heat dissipation fin set is used to absorb the heat source generated by the central processor; An axial flow fan is installed above the chip group, and the axial flow fan sucks the cold air from above, and then blows the cold air to the cooling fin group, so as to achieve the cooling effect of the computer central processor, but this is the case In the heat dissipation method, the heat source discharged from the computer's central processor will be directly discharged into the computer case. This will cause the computer's central processor and other electronic components in the computer case to absorb this heat source again, which will cause the cooling efficiency of the entire computer to decrease. The current trend of computer development is that the speed is getting faster and faster, and the size is getting smaller and smaller. The conventional cooling method cannot meet this demand. Therefore, it is necessary to further improve the overall cooling efficiency of the computer. The reason is that the author feels that the lack of learning technology can be improved. It is a special potential research and cooperation with the use of science to propose a reasonable design and effectively improve the lack of knowledge technology.
第5頁 M254655_ 四、創作說明（2) 【新型内容】 本創作之目的在於提供一種微型電腦之散熱裝置，用 來提升中央處理器及電腦内部電子組件之散熱效率。 本創作提供一種微型電腦之散熱裝置，包括： 一散熱鰭片組設於一散熱器上；及一橫流式風扇固定於該 散熱器上，且設於該散熱鰭片組之具有複數個縫細之一側 技舉 及茲 徵， 特圖： 之附後 作與如 創容明 本内說 解細細 瞭詳詳 步之式 一作圖 進創合 更本配 hb aw A月 a^9 員有例 委下施 查以實 審閱之 貴參行 請可 使，佳 為容較 内個 術一Page 5 M254655_ IV. Creation Instructions (2) [New Content] The purpose of this creation is to provide a heat dissipation device for a microcomputer to enhance the heat dissipation efficiency of the central processing unit and the internal electronic components of the computer. This creation provides a heat dissipation device for a microcomputer, including: a heat dissipation fin set disposed on a heat sink; and a cross-flow fan fixed on the heat sink and provided with a plurality of slits on the heat dissipation fin set One of the side skills and special features, special maps: The attached work and the detailed instructions as described in the creation of the book, a detailed step-by-step method, a drawing into the creation of a combination of hb aw A month a ^ 9 members have The commissions under the commission to conduct investigations for practical review can be used, and it is better to compare the internal skills
括 包 置 裝 熱 散 之 腦 型 I微 式作 方創 施本 實 rL 凸， 更中 2其 器於 熱覆 散包 該1 ，組 上片 2鰭 器熱 熱散 散該 一將 於並 設， IX 組CXI 片片 鰭熱 熱散 散¾. 一 L 二 設 •， }風 示式 所流 圖橫 一該 第且 如， C上 2 2 2器 孔熱 氣散 進該 一於 有定 設固 上可 2 3 器扇 熱風 散式 該流 且橫 出，在 之側意 3 一 用 扇之< 風隙同 式縫相 流個寸 橫數尺 該複及 ，有狀 2具形 3之的 口 I CXI 氣組 出片孔 一鰭氣 及熱進 1散該 3該和 口於1 氣設3 進2 口 一 3氣 有口進 具氣該 如型固 {微可 >於2 1定器 3固熱 口可散 氣置該 進裝， 該熱方 及散上 2 之> 2腦U —u S色 3 孑 W F 氣型C 進微< 該作4 過創器 通本理 利·，處 順}央 能示中 氣所一 空圖的 冷二腦 使第電 第6頁 M254655 四、創作說明（3) 定接觸於該中央處理器4 ，以充分吸收中央處理器4之熱 源，且該進氣孔2 2和中央處理器4之一側邊形成一孔隙 5 〈如第三圖及第四圖所示〉；藉此，該熱源可傳導至該 散熱鰭片組1及該二L型散熱片2 1上，且此時冷空氣被 該橫流式風扇3從該孔隙5吸入後〈此時冷空氣可攜帶中 央處理器4之側邊及底部的部分熱源〉，由該出氣口 3 2 向散熱鰭片組1吹出，如此冷空氣會除帶走中央處理器4 之側邊及底部的部份熱源外，亦一併帶走該散熱鰭片組1 上之部份熱源，所產生之熱空氣會立即通過微型電腦上之 複數個散熱孔6 ，將熱源立即帶至微型電腦外部，而不會 累積熱源在微型電腦内部〈如第五圖及第七圖所示〉；另 一方面傳導至該二L型散熱片2 1之剩餘熱源，亦將藉由 該二L型散熱片2 1接觸頂底於微型之機殼，而由金屬材 質製成的該電腦機殼7將熱源排放至空氣中〈如第六圖所 示〉，以達成全部熱源迅速有效的排出電腦外部。 綜上所述，本創作微型電腦之散熱裝置可將中央處理 器產生之熱源迅速有效的排出微型電腦外部，而不會累積 在微型電腦内部，如此可提升中央處理器及電腦内部電子 組件之散熱效能，可滿足電腦的速度愈來愈快，體積愈來 愈小之散熱需求。 當然，以上所述僅為本創作之一較佳實施例，其不應 用以侷限本創作之實施範圍，任何熟習該項技藝者在不違丨B 背本創作之精神所作之任何修改均應屬於本創作之範圍， 因此本創作之保護範圍當以下列所述之申請專利範圍做為Including the brain type I micro-type recipe for heat dissipation, the original LL convex, and the second one is to cover the heat, and the first one is to be installed. Group of CXI fins and heat dissipation ¾. One L two set •,} The wind diagram type flow diagram crosses one first and for example, the hot air on the 2 2 2 device holes on C can be fixed on a fixed setting. 2 3 Fans of hot air diffuse the stream and cross it out. 3 Use a fan of the air gap with the same type of flow. Inches and a few feet should be covered. There are two shaped and three shaped mouths. The CXI gas group has a hole in the fins and heat into the air, disperse the 3, the mouth and the mouth, and the air in the mouth. The air is in the air, and the air is in the air. The solid heating port can be filled with air, and the heating side and the air 2 can be placed. 2 brain U —u S color 3 孑 WF gas type C micro-infrared < operation 4 through the wound device through the rationale, [Chun Shun] The cold second brain of the Central Air Show of the Central Gas Institute makes the electricity page 6 M254655 Fourth, the creative instructions (3) will be in contact with the central processing unit 4 to fully absorb the heat source of the central processing unit 4, and the Air inlet 2 2 A hole 5 is formed on one side of the central processing unit 4 (as shown in the third and fourth figures); thereby, the heat source can be conducted to the heat dissipation fin group 1 and the two L-shaped heat sinks 21 After the cold air is taken in by the cross-flow fan 3 from the aperture 5 at this time (the cold air can now carry part of the heat source on the sides and bottom of the CPU 4), the air outlet 3 2 is directed to the heat dissipation fin group. 1 blows out, so that the cold air will take away some heat sources on the side and bottom of the CPU 4 as well as some heat sources on the heat sink fin group 1, and the generated hot air will pass immediately The plurality of heat dissipation holes 6 on the microcomputer immediately bring the heat source to the outside of the microcomputer without accumulating heat inside the microcomputer (as shown in the fifth and seventh figures); on the other hand, it is conducted to the two L-types The remaining heat source of the heat sink 21 will also contact the top and bottom of the miniature case through the two L-shaped heat sinks 21, and the computer case 7 made of metal material will discharge the heat source to the air (such as the first The six diagrams are shown> in order to achieve rapid and effective discharge of all heat sources to the outside of the computer. In summary, the heat dissipation device of the creative microcomputer can quickly and effectively discharge the heat source generated by the central processor to the outside of the microcomputer without accumulating in the microcomputer. This can improve the heat dissipation of the central processor and the electronic components inside the computer. Performance, can meet the cooling requirements of computers faster and faster, smaller and smaller. Of course, the above is only one of the preferred embodiments of this creation. It should not be used to limit the scope of implementation of this creation. Any modification made by those skilled in the art without violating the spirit of this creation should belong to The scope of this creation, so the scope of protection of this creation should be the scope of patent application as described below
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第8頁 M254655 圖式簡單說明 第 一 圖 為 本 創 作 微 型 電腦之 散熱裝 置 部 分 立 體 圖 0 第 二 圖 為 本 創 作 微 型 電腦之 散熱裝 置 立 體 分 解 圖 0 第 二 圖 為 本 創 作 微 型 電腦之 散熱裝 置 組 裝 於 微 型 電 腦 上 之 立 體 分 解 圖 〇 第 四 圖 為 本 創 作 微 型 電腦之 散熱裝 置 組 裝 於 微 型 電 腦 上 之 立 體 圖 〈 一 > 〇 第 五 圖 為 本 創 作 微 型 電腦之 散熱裝 置 組 裝 於 微 型 電 腦 上 之 立 體 圖 〈 _丨— > 0 第 六 圖 為 本 創 作 微 型 電腦之 散熱裝 置 組 裝 於 微 型 電 腦 上 之 後 方 剖 視 圖 0 第 七 圖 為 本 創 作 微 型 電腦之 散熱裝 置 組 裝 於 微 型 電 腦 上 之 側 邊 剖 視 圖 0 符 號 說 明 1 散 熱 片 組 3 2 出 氣 α 2 散 熱 器 4 中 央 處 理 器 2 1 L 型 散 熱 片 5 孔 隙 2 2 進 氣 孔 6 散 熱 孔 3 橫 流 式 風 扇 7 電 腦 機 殼 3 1 進 氣 σPage 8 M254655 Brief description of the diagram The first picture is a perspective view of the heat dissipation device of the creative microcomputer 0 The second picture is a three-dimensional exploded view of the heat dissipation device of the creative microcomputer 0 The second picture is the heat dissipation device of the creative microcomputer assembled in Three-dimensional exploded view of the microcomputer. The fourth image is a perspective view of the microcomputer's heat dissipation device assembled on the microcomputer <1> The fifth image is a perspective view of the microcomputer's heat dissipation device assembled on the microcomputer < _ 丨 — > 0 The sixth picture is a cross-sectional view of the heat sink of the creative microcomputer assembled on the microcomputer 0 The seventh picture is the side cross-sectional view of the heat sink of the creative microcomputer assembled on the microcomputer 0 Symbol description 1 Heat sink group 3 2 Outlet α 2 Radiator 4 Central processor 2 1 L-type heat sink 5 hole gap 2 2 air inlet hole 6 heat radiation hole 3 cross-flow fan 7 computer case 3 1 air inlet σ
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