M245738 四、創作說明（1) 【新型所屬之技術領域】 本創作係有關於—種鰭片轨 ίίϊΐ可作為中央處理器散熱之用、：亦可 益週邊其它電子零件散熱之用，且 Ζ作為中央處理 幅增加散熱面積，俾以提高散问專面積下，而大 【先前技術】 一文半者。 按傳統使用在中央處理哭（C ρ υ ). 如第一圖所示，該散熱裝置2〇:括有卞”熱裝置20， 201 ，散熱本體201上設有—體成型 ^散熱本體 ，Γ=.鰭片202…裝有散熱風扇二 ，另’為使整個散熱裝置2〇之散埶效圖中未不） 本體201的底部安裝有一導埶2〇' b更雨，會在散熱 有-容置凹槽204 ’再將該導熱塊203固、定安m 204内，·如此，即可將該散 女凌於谷置凹槽 中央處理㈣上方，且其導熱= 器以上，故經由導熱塊2。…央處 貝=央J理 至外界，而達到散熱效果。 熱風扇將熱能吸或吹 而上述散熱裳置20之導熱塊因僅將中央 所產生之熱能帶至散熱鰭片2〇2上，此认 盎運輅吋 產生殘餘之熱能則無任何快速導熱之效仏；中央處理器所 M245738 四、創作說明（2) 事該行業多年之經驗，並 $良，遂有本創作『鰭片：；η: ’積極研究 【新型内容】 、狀…衣置』之產生。 令散熱裝置：在^以=:提供-種鰭片式散熱裝置’其係 高散熱效；：同4面積下，大幅增加散熱㈣，俾以提 ，> ^ ϋ作之特彳政在於該散熱裝置係包括有一散埶t μ ，於散熱本體底部處設有一導軌·=:丈熱本體 則設有複數片知％ #午…兄°亥放熱本體之頂面處 數片相4^又之弟一散熱鰭片， 寻弟一散熱鰭片之間則号古s ,丨、^体狀”、、不體及忒 管内可皂狀亡 > 門貝κ又有至）一個以上之導熱管，導埶 :内Τ女裝有工作流體，另 熱籍片之間另安裝有複數片之第二散：=及弟-散 由該第一散埶鈇+ A…、”、、9片如此，即可 ^ u 戒”、…、θ片作為中央處理器散熱之用，而第-私相 :片則呈環弧狀的排列組設而成，故在同 $7^ 中田增加散熱面積，俾以提高散熱效率。 、 可大 【實施方式】 配合圖式說明如 並非用來對本創 有關本創作之詳細說明及技術内容 下’然而所附圖式僅提供參考與說明用 作加以限制者。 一本創作係一種「鰭片式散熱裝置」，請參昭 示，该散熱裝置1 〇係應用在中央處理器（CP 、 一圖冷 ，散熱裝置10包括有一散熱本體i，該散熱本，、’其冲 質，而在散熱本體1中間處設有一開口丨i， /為鋁和 11之散熱本體1底部處安裝有一導熱塊2，发目對^該開c 〃 ^熱塊2係栺 M245738 、創作說明（3) 用導熱效率高的銅材質，當將散熱裝置丨〇安裝於中 器上時，其導熱塊2恰整個貼覆在中 樹中，在該該散熱本體丨上央方處處=复數 設之第-散熱鰭片3’帛等第.一散熱鳍片3可一體成 ^疊m而在該散熱本則與該等散熱鑛片3 :衣有至7個以上之導熱官4，本實施例係設有 應排列之導熱管4，該導熱管4呈[狀，其至少包 直管41，及位於橫直管41—端之豎直管42，該 m散熱本體！上，而s直管42則穿設在;;等第 ::麥脍第一圖所不’在本創作之較佳 兩導熱管4在安裝於散熱本體！上時，1橫直 J 觸面積須整個站靠於導熱塊2上，且導熱管4位於兮 散熱鰭片3之豎直管4 2 -端亦須鄰近於散熱風扇6 7 圖所不），故，該導熱管4之橫直管41與導熱塊2 一方向置放，亦即該導熱管4相對於散熱本體丨係 列。 請續參照第二、三圖所示，本創作中，該散埶 在其散熱本體1及第一散熱鰭片3之間另可安裝有Γ 鰭片5，本實施例中，係設有第二散熱鰭片5 ^第1 片5’ ，該第二散熱鰭片5及第三散熱鰭片5，之安^ 位於中央處理器之二側。該第二散熱鰭片5係複妻= 弧狀的排列組設而成，而第三散熱鰭片5，則複數片 狀的排列組設而成。 央處 理 片相叠 型 或 之間係 兩相對 有〜横 f 41係 一散熱 I該 部之接 等第~ 如第九 係呈同 横向排 I置10 二散熱 散熱鳍 位置恰 片？不罢M245738 IV. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation is related to-a kind of fin track can be used as a CPU for heat dissipation, and it can also be used for heat dissipation of other electronic parts around it, and Z is used as The central processing area increases the area of heat dissipation, in order to increase the area of the interspersed area, and the large [prior art] is a half-liter article. Traditionally, the central processing unit (C ρ υ) is used. As shown in the first figure, the heat sink 20: includes a 卞 ”heat apparatus 20, 201, and a heat sink body 201 is provided with a body molding ^ a heat sink body, Γ =. The fin 202 ... is equipped with a cooling fan II, and the other is 'in order to make the entire heat dissipation device 20 effective (not shown in the figure)) The bottom of the main body 201 is provided with a guide 埶 2〇' b. The receiving groove 204 ′ fixes the heat conduction block 203 and sets it in the M 204. In this way, the loose girl can be placed above the central processing groove of the valley groove, and the heat conduction is equal to or higher than the heat conduction block. 2 .... The central part of the shell = the central part of the body to the outside world, to achieve the heat dissipation effect. The heat fan absorbs or blows the heat energy, and the heat conduction block of the heat dissipation rack 20 mentioned above only brings the heat energy generated by the center to the heat dissipation fins 202 In the above, it is recognized that the residual thermal energy generated by the transportation is not effective for rapid heat conduction; the CPU M245738 IV. Creation Instructions (2) Many years of experience in the industry, and good work, this creation "fin Film: η: 'Actively study the [new content], the appearance of ... clothes.' : ^ To =: provide-a kind of fin-type heat dissipation device 'its high heat dissipation efficiency ;: under the same 4 area, the heat dissipation is greatly increased, to mention, > ^ The special feature of the operation is that the heat dissipation device system It includes a diffuser t μ, and a guide rail is provided at the bottom of the heat-dissipating body. == The thermal body is provided with a plurality of pieces.% # 午… 兄 ° The top surface of the heat-dissipating body has several pieces of heat. The fins are located between the fins and the cooling fins. They are called “s,”, ”,”, ”,”, “, and can be saponified in the stern tube” (Member kappa) and more than one heat pipe, guide : Inside T women's clothing has a working fluid, and a plurality of second tablets are installed between the other hot books: = and brother-San from the first fan + A ..., ", 9 tablets, so you can ^ u jie ",…, θ films are used for central processor heat dissipation, and the -private phase: films are arranged in a circular arc arrangement, so the heat dissipation area is increased in the same $ 7 ^ Nakada to improve heat dissipation effectiveness. [Expandable] [Embodiment] If the description with drawings is not used for the detailed description and technical content of this creation, the drawings are provided for reference and explanation only. A book is a kind of "fin-type heat sink", please refer to it. The heat sink 10 is applied to a central processing unit (CP, a picture cold, the heat sink 10 includes a heat sink body i, the heat sink ,, ' It is punched, and an opening is provided in the middle of the heat dissipation body 1 / i, / is a heat conduction block 2 installed at the bottom of the heat dissipation body 1 of aluminum and 11, the head is opposite to the opening c 〃 ^ heat block 2 is 245M245738, Creation instructions (3) Using copper material with high thermal conductivity, when the heat sink 丨 〇 is installed on the middle device, its heat conduction block 2 is covered entirely in the middle tree, and the central body of the heat sink 丨 = A plurality of heat-dissipating fins 3 ′, etc. are provided. A heat-dissipating fin 3 can be integrated into a stack of m, and the heat-dissipating principle is connected with the heat-dissipating ore-pieces 3: there are at least 7 heat-conducting officials 4. The embodiment is provided with a heat pipe 4 which should be arranged. The heat pipe 4 is in the shape of [, which includes at least a straight pipe 41, and a vertical pipe 42 located at the end of the horizontal straight pipe 41. The m heat dissipation body! The tube 42 is installed in the ;; etc. :: The first heat transfer tube 4 in the first picture is not installed in the first picture of the wheat. At the time of the above, 1 horizontal and straight J contact area must stand on the heat conduction block 2 and the heat conduction pipe 4 is located on the vertical pipe 4 2 of the heat dissipation fin 3 and the end must be adjacent to the heat dissipation fan 6 7 (not shown in the figure), so The horizontal straight tube 41 of the heat conducting tube 4 and the heat conducting block 2 are placed in one direction, that is, the heat conducting tube 4 is relative to the heat dissipation body 丨 series. Please continue to refer to the second and third figures. In this creation, the scattered fins 5 can also be installed between the heat dissipation body 1 and the first heat dissipation fins 3. In this embodiment, a first The two cooling fins 5 ^ the first fin 5 ', the second cooling fin 5 and the third cooling fin 5 are located on the two sides of the CPU. The second heat dissipation fins 5 are formed by a plurality of wives = an arc-shaped arrangement, and the third heat dissipation fins 5 are formed by a plurality of fin-like arrangements. The central processing sheets are stacked or they are opposite to each other. There is ~ horizontal f 41 is a heat dissipation I. The connection of the part is equal to the same ~ as the ninth system is in the same horizontal row. Never stop
第7頁 M245738 四、創作說明（4) 請參照第二圖所示，本創作組裝時，先將該導熱塊2 安裝於散熱本體1之底部，並令第二散熱鰭片5及第三散熱 鰭片5’分別安裝在散熱本體]上，且分別位於開口 n之兩 相對側。請參照第四、.五、六圖所示，雨再將兩導熱管4 安裝於散熱本體1之開口〗〗處，且導熱管4之橫直管41底部 係位於開口 1 1處，其底部之整個接觸面積並與導熱塊2相 接觸’而兩導熱管4之豎直管42則從該等1散熱錯片3上 y孔31穿設而過’並在該導熱管4 π安裝工作流體後， 第：散熱鰭片3連同穿設於其中之導熱管4安裝 ，政…本脰1之弟二散熱鰭片5及第三散熱鰭 上 即可大致組裝完成。 請參照弟七、八圖所示，本創作中，在該第一散埶鳍 二3之另，安裝有散熱風扇6，以更迅速的編至 本創作使用時，譜炎昭笛4 _ 裝㈣安裝於中央處』器：=戶二其=熱 處理器上，此時，—曰中丄係貼靠在中央 生之熱能則藉由導敎塊2先央傳處導理至^^ ’其運轉後所產 散熱鰭片3上，；用、二先風傳二導熱管4 ’再傳導至第- 熱.鰭片5及第三散敎；5A;;6'弟-散熱轉片3、第二散 外界處。 一“5所傳導之熱能更迅速的散熱至 經由上述之結構說明可知，本 —散熱^片3作為中央處理器散熱之用，而由；；= m M245738 四、創作說明（5) -- 鳍片5及第三散熱鰭片5 ’可赫日六由+ 士 _ ^ 了補助中央處理器週邊其它電子 与件散執之用’使整個散敎获蓄1 η + ι & ll , ^ 斤欣熱I置1 0之散熱效果達到最佳0 此外，由於該弟二散熱鰭片5係呈環弧狀排列，故在同等 :積下，其第二散熱鰭片5 <數量會較直排狀排列之第三 月熱鰭片5’多，而可大幅增加散熱面積，俾以提高散熱效 率。 综上所述，本創作之「鰭片式散熱裝置」，的確能藉 ^述所揭露之構造，達到所述之功效。且本創作申請前 步等物亦未公開使用，誠已符合新型專利之新穎、進 已，ΐ為上，所揭之圖式及說明，僅為本創作之實施例而 ，其所依$火本創作之實施例；大凡熟悉該項技藝之人士 ，皆應^芸^作之特徵範疇，所作之其它等效變化或修飾 现在以下本案之申請專利範圍内。 M245738 圖式簡單說明 【圖式簡單說明】 第一圖係習知散熱裝置之立體分解圖。 第二圖係本創作散熱裝置之立體分解圖。 第三圖係本創作散熱裝置之部份立體組合圖。· 第四圖係本創作散熱裝置之立體組合圖。 第五圖係本創作散熱裝置之俯視圖。 第六圖係本創作散熱裝置之部份側視剖面圖。 第七圖係本創作散熱裝置應用例之立體分解圖。 第八圖係本創作散熱裝置應用例之立體組合圖。 第九圖係本創作散熱裝置使用情形之俯視圖。 第十圖係本創作散熱裝置使用情形之側視圖。Page 7 M245738 IV. Creation instructions (4) Please refer to the second picture. When this creation is assembled, first install the thermal block 2 on the bottom of the heat dissipation body 1, and let the second heat dissipation fins 5 and the third heat dissipation. The fins 5 'are respectively mounted on the heat sink body, and are respectively located on two opposite sides of the opening n. Please refer to the fourth, fifth, and sixth figures. Rain then installs two heat pipes 4 at the opening of the heat dissipation body 1, and the bottom of the horizontal straight pipe 41 of the heat pipe 4 is located at the opening 11. The entire contact area is in contact with the heat-conducting block 2 'and the vertical tubes 42 of the two heat-conducting tubes 4 pass through the y holes 31 on the heat-dissipating fins 3 and after the working fluid is installed in the heat-conducting tube 4 π First, the heat dissipation fin 3 is installed together with the heat pipe 4 passing through it, and the second heat dissipation fin 5 and the third heat dissipation fin of the first brother of this can be roughly assembled. Please refer to the pictures shown in Figures 7 and 8. In this creation, a cooling fan 6 is installed in the first 3 fins 2 and 3, so that it can be edited more quickly for use in this creation. ㈣Installed at the center of the device: = 户 二 其 = on the thermal processor, at this time, the heat energy of the middle 丄 is abutting on the central part of the heat, then it is guided to ^^ by its leading center. After the operation, the heat dissipation fins 3 are produced; the first and second heat transfer tubes 4 'are used to conduct heat to the first-heat. The fins 5 and the third are scattered; 5A; Scattered outside. A "5 The heat conducted by the heat can be dissipated more quickly. According to the above structural description, it can be seen that this-the heat sink ^ 3 is used for central processor heat dissipation, and ;; m m245738 IV. Creation instructions (5)-fins Tablet 5 and the third cooling fin 5 'can be used in six days + + _ _ to subsidize the use of other electronic peripherals around the central processing unit to disperse the use of the central processing unit' to save the entire dispersal 1 η + ι & ll, ^ jin The heat dissipation effect of Xin heat I is set to 1 0 to achieve the best 0. In addition, since the second heat dissipation fin 5 is arranged in a circular arc shape, so the second heat dissipation fin 5 < There are more than 5 'of the third lunar thermal fins arranged in a row, which can greatly increase the heat dissipation area to improve the heat dissipation efficiency. In summary, the "fin heat sink" of this creation can indeed be disclosed by ^ The structure achieves the stated effect. And the previous steps and other items of this creation application have not been used publicly. It has been in line with the novelty and advancement of the new patent. The above-mentioned drawings and descriptions are only examples of this creation. The embodiment of this creation; anyone who is familiar with the art should make features of the work, other equivalent changes or modifications are within the scope of the patent application in the following case. M245738 Schematic illustration [Schematic description] The first diagram is an exploded perspective view of a conventional heat sink. The second figure is an exploded perspective view of the heat sink of this creation. The third picture is a partial three-dimensional combined drawing of the heat sink of this creation. · The fourth picture is a three-dimensional combination diagram of the original heat sink. The fifth figure is a top view of the heat sink of this creation. The sixth figure is a side cross-sectional view of a part of the heat sink of this creation. The seventh diagram is a three-dimensional exploded view of the application example of the heat sink of this creation. The eighth figure is a three-dimensional combination diagram of the application example of the creative heat sink. The ninth picture is a top view of the use situation of the heat sink of this creation. The tenth figure is a side view of the use situation of the cooling device of this creation.
第10頁 〔元件代表符號〕 <習知> 散熱裝置 20 散熱本體 201 散熱鰭片 202 導熱塊 203 容置凹槽 20 印刷電路板 8 中央處理器 81 <本創作> 散熱裝置 10 散熱本體 1 開口 11 導熱塊 2 第一散熱鰭片 3 穿孔 31 導熱管 4 橫直管 41 M245738Page 10 [Representative Symbols of Components] < Knowledge > Radiator 20 Radiator body 201 Radiator fin 202 Thermal block 203 Receiving recess 20 Printed circuit board 8 Central processing unit 81 < This creation > Radiator 10 Radiator Body 1 Opening 11 Thermal block 2 First heat radiating fin 3 Perforated 31 Heat transfer tube 4 Horizontal straight tube 41 M245738
第11頁Page 11