TWM269699U - Improved structure of heat sink - Google Patents
Improved structure of heat sink Download PDFInfo
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- TWM269699U TWM269699U TW93220906U TW93220906U TWM269699U TW M269699 U TWM269699 U TW M269699U TW 93220906 U TW93220906 U TW 93220906U TW 93220906 U TW93220906 U TW 93220906U TW M269699 U TWM269699 U TW M269699U
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Description
M269699 四、創作說明(1) 【新型所屬之技術領域】 本創作係提供散熱裝置結構改良,散熱裝置於殼體上 分別設有數風扇,於殼體之一側之風扇上設有導風管,又 其殼體内部設有散熱體,又散熱鰭片透過穿孔堆疊於導熱 管組上,組裝為散熱鰭片組,再將導熱鰭片組之沿伸導熱 鰭片組穿入導熱管組之間,使沿伸導熱鰭片組與散熱鰭片 組、導熱管組之間相互緊密貼合,在將上述結構以導熱板 蓋上,又於導熱板上設有數溝槽,於導熱板蓋合時,使導 熱管組容置於溝槽内部,已達到更緊密之貼合。M269699 4. Creation Description (1) [Technical Field to which the New Type belongs] This creation is to provide a structural improvement of the heat dissipation device. The heat dissipation device is provided with several fans on the casing, and a fan is provided on the fan on one side of the casing. A heat sink is arranged inside the casing, and the heat dissipation fins are stacked on the heat conduction tube group through the perforation, assembled into a heat dissipation fin group, and the thermally conductive fin group is extended between the heat conduction fin group and the heat conduction tube group. The heat conduction fin group, the heat dissipation fin group, and the heat pipe group are closely adhered to each other. The above structure is covered with a heat conduction plate, and a plurality of grooves are provided on the heat conduction plate. , So that the heat pipe group is accommodated inside the groove, and a closer fit has been achieved.
【先前技術】 如第一圖所示,習用之散熱裝置A雖於散熱鰭片D設 有風扇B與導風管C ,然其散熱鰭片D僅僅採以垂直排列 之方式,對於散熱鰭片D較高之部位,其熱能散出效果有 限,且氣流通導採垂直方式,風扇產生之風量若不穩定, 則於氣流通過散熱鰭片D時,導致氣流與散熱縫片D間之 接觸面不均勻,降低散熱效果。[Previous technology] As shown in the first figure, although the conventional heat sink A is provided with a fan B and an air duct C on the heat sink fin D, the heat sink fin D is only arranged in a vertical arrangement. The higher D part, the thermal energy dissipation effect is limited, and the airflow is conducted in a vertical manner. If the amount of wind generated by the fan is unstable, the contact surface between the airflow and the heat dissipation fin D will be caused when the airflow passes through the heat dissipation fin D. Uneven, reducing heat dissipation effect.
如我國新型專利,公告號為2 4 5 5 0 6號專利案,散熱 鰭片均垂直排列,在散熱時之效果有限。 故,如何將提供一種提高散熱鰭片之散熱效率之散熱 裝置,即為本案創作人所欲解決之技術困難點之所在。 【新型内容】 茲就本創作配合圖示、圖號及實施例詳細說明如下,For example, China's new-type patent, the publication number of which is No. 2 4 565, is that the heat-dissipating fins are arranged vertically, and the effect of heat-dissipating is limited. Therefore, how to provide a heat dissipation device that improves the heat dissipation efficiency of the heat dissipation fins is the technical difficulty that the creators of this case want to solve. [New content] The following is a detailed description of the illustrations, drawing numbers, and embodiments of this creation.
第5頁 M269699 四、創作說明(2) 本創作係提供散熱裝置結構改良,如第二圖與第三圖所示 ,散熱裝置A於殼體A 1上分別設有數風扇B,於殼體A 1之一側之風扇B上設有導風管C,又其殼體A 1内部設 有散熱體E ,(請配合參閱第三圖所示)其散熱體E係由 導熱片組F、散熱片組G、導熱管組Η與導熱板I所構成Page 5 M269699 4. Creation instructions (2) This creation provides structural improvements of the heat sink. As shown in the second and third figures, the heat sink A is provided with a number of fans B on the housing A 1 and a housing A. The fan B on one side is provided with a wind guide tube C, and the shell A 1 is provided with a heat sink E (see the third figure for cooperation). The heat sink E is composed of a heat conducting sheet group F and a heat sink. Sheet group G, heat pipe group Η and heat plate I
其結構特徵為散熱鰭片G 1透過穿孔G 2堆疊於導熱 管組Η上,組裝為散熱鰭片組G ,再將導熱鰭片組F之沿 伸導熱鰭片組F 1穿入導熱管組Η之間,使沿伸導熱鰭片 組F 1與散熱鰭片組G、導熱管組Η之間相互緊密貼合, 在將上述結構以導熱板I蓋上,又於導熱板I上設有數溝 槽I 1 ,於導熱板I蓋合時,使導熱管組Η容置於溝槽I 1内部,已達到更緊密之貼合。Its structural feature is that the heat dissipation fin G 1 is stacked on the heat pipe group 透过 through the perforation G 2 to assemble the heat sink fin group G, and then the heat conduction fin group F 1 is extended into the heat pipe group. Between the cymbals, the thermally conductive fin group F1, the heat dissipation fin group G, and the heat pipe group Η are closely adhered to each other. The above structure is covered with a heat conductive plate I, and a number of The groove I 1, when the heat conducting plate I is covered, allows the heat pipe group to be accommodated inside the groove I 1 to achieve a closer fit.
於散熱時,導熱板I導出底部連接之電子元件工作時 之熱能,熱能一部份由導熱板I傳導至導熱鰭片組F後, 再傳導至散熱鰭片組G,另一部份經由導熱管組Η傳至散 熱鰭片組G,此時由於散熱鰭片組G與導熱鰭片組F之排 列方向不同,使風扇Β所產生之氣體更均勻接觸於散熱鰭 片組G與導熱鰭片組F上。 且導熱管Η與導熱板I以溝槽I 1相貼合,使熱能快 速傳導至散熱鰭片組G,且散熱鰭片組G與導熱管組Η之 排列方向一不相同,使風扇Β所產生之氣體可同時導出導 熱管Η與散熱鰭片組G之熱能,提高散熱體Ε之散熱效率During heat dissipation, the heat conducting plate I derives the heat energy of the electronic components connected at the bottom during operation. Part of the heat energy is conducted by the heat conducting plate I to the heat conducting fin group F, and then to the heat radiating fin group G, and the other part is conducted through heat conduction. The tube group is transmitted to the heat dissipation fin group G. At this time, because the arrangement directions of the heat dissipation fin group G and the heat conduction fin group F are different, the gas generated by the fan B contacts the heat dissipation fin group G and the heat conduction fin more uniformly. Group F. In addition, the heat conducting tube Η and the heat conducting plate I are attached to each other by the groove I 1, so that the heat energy is quickly conducted to the heat radiating fin group G, and the arrangement direction of the heat radiating fin group G and the heat conducting tube group Η are different, so that the fan B is The generated gas can simultaneously dissipate the heat energy of the heat transfer tube Η and the heat dissipation fin group G, and improve the heat dissipation efficiency of the heat sink E.
第6頁 M269699 四、創作說明(3) 【實施方式】 本創作之實施方式係如第六圖、第七圖與第八圖所示 ,散熱裝置A裝設於電路板L上,導熱板I導出底部連接 之電子元件工作時之熱能,一部份熱能J由導熱板I傳導 至導熱鰭片組F後,再傳導至散熱鰭片組G,另一部份熱 能J經由導熱管組Η傳至散熱鰭片組G,此時由於散熱鰭 片組G與導熱雜片組F之排列方向不同,使風扇Β所產生 之氣流Κ更均勻接觸於散熱鰭片組G與導熱鰭片組F,同 時增加氣流Κ與散熱鰭片組G、導熱鰭片組F之接觸面積 ,提高散熱效率。 同時導熱管Η與且沿伸導熱鰭片組F 1 、導熱板I相 貼合,使熱能J快速傳導至散熱鰭片組G,且散熱鰭片組 G與導熱管組Η之排列方向一不相同,使風扇Β所產生之 氣流Κ可同時導出導熱管Η與散熱鰭片組G之熱能,提高 散熱體Ε之散熱效率。 再經由導風管C將以傳導出熱能J之氣流Κ直接排出 外部,避免氣流Κ於内部循環,避免熱能J於内部累積, 提升散熱效率。 惟以上所述僅為本創作之一較佳可行實施例,非因此 即拘限本創作之專利範圍,故舉凡運用本創作說明書及圖 示内容所為之等效結構,直接或間接運用於其它相關技術 領域者,均同理皆理應包含於本創作之精神範疇的範圍内 ,合予陳明。Page 6 M269699 IV. Creation Instructions (3) [Implementation] The implementation of this creation is shown in the sixth, seventh, and eighth figures. The heat sink A is installed on the circuit board L, and the heat conduction board I The thermal energy during the operation of the electronic components connected at the bottom is derived. A part of the thermal energy J is conducted from the heat conducting plate I to the heat conducting fin group F, and then to the heat radiating fin group G, and the other part of the heat energy J is transmitted through the heat conducting tube group. To the heat dissipation fin group G, at this time, because the arrangement direction of the heat dissipation fin group G and the heat conduction miscellaneous fin group F are different, the airflow κ generated by the fan B is more uniformly contacted with the heat dissipation fin group G and the heat conduction fin group F, At the same time, the contact area of the airflow K with the heat dissipation fin group G and the heat conduction fin group F is increased to improve heat dissipation efficiency. At the same time, the heat conducting tube Η is attached to and extending the heat conducting fin group F 1 and the heat conducting plate I, so that the heat energy J is quickly transmitted to the heat radiating fin group G, and the arrangement directions of the heat radiating fin group G and the heat conducting tube group 一 are different. Similarly, the air current K generated by the fan B can simultaneously extract the heat energy of the heat conducting tube Η and the heat dissipation fin group G, thereby improving the heat dissipation efficiency of the heat sink E. Then, the airflow K that conducts the heat energy J is directly discharged to the outside through the air duct C, so that the airflow K is not circulated in the interior, and the heat energy J is prevented from accumulating in the interior, thereby improving heat dissipation efficiency. However, the above is only one of the best and feasible embodiments of this creation, and therefore does not limit the scope of the patent of this creation. Therefore, the equivalent structure of the description and illustration of this creation is used directly or indirectly for other related Those in the technical field should be included in the scope of the spirit of this creation for the same reason and shared with Chen Ming.
M269699 四、創作說明(4) 為使本創作更加顯現出其進步性與實用性,茲與習用 作一比較分析如下: 《習用缺失》 一、 散熱鰭片散熱效果有限。 二、 純垂直排列之散熱鰭片,對於較高部位熱能散出不易 〇 三、 純垂直排列之散熱鰭片,對於氣體流通時,氣體接觸 面積不均勻。M269699 IV. Creation Instructions (4) In order to make this creation show its progressiveness and practicability, a comparative analysis with conventional practice is as follows: "Lack of Practice" I. The cooling fins have a limited heat dissipation effect. 2. The purely vertically arranged heat sink fins are not easy to dissipate heat from higher parts. 3. The purely vertically arranged heat sink fins have uneven gas contact area for gas circulation.
《本創作優點》 一、 整體散熱導熱效果佳。 二、 提升熱能導出之效率。 三、 排列方向不同之散熱鰭片,提升氣體與散熱片之接觸 面積。 四、 以導熱管加速熱能傳導致熱鰭片。 五、 熱氣流更容易排出散熱鰭片間。 六、 具進步性與實用性。"Advantages of this creation" First, the overall heat dissipation effect is good. 2. Improve the efficiency of thermal energy export. 3. Arrange the fins with different directions to increase the contact area between the gas and the fins. 4. Accelerating the transfer of thermal energy by heat pipes to cause thermal fins. Fifth, the hot air flow is more easily discharged between the fins. 6. Progressive and practical.
八、提升產業競爭力。 綜上所述,本創作在突破先前技術結構下,確實已達 到所欲增進之功效,且也非熟悉該項技藝者所易於思及, 再者,本創作申請前未曾公開,其所具之進步性、實用性 ,顯已符合新型專利之申請要件,爰依法提出新型申請。8. Enhance industrial competitiveness. In summary, this breakthrough has indeed achieved the desired effect under the previous technical structure, and it is not easy for those skilled in the art to think about it. Furthermore, this creative application has not been disclosed before, and its features Progressiveness and practicability have clearly met the requirements for applying for a new type of patent.
第8頁 M269699 圖式簡單說明 【圖式簡單說明】 第一圖係習用散熱裝置立體分解圖。 第二圖係本創作之立體圖。 第三圖係本創作之立體分解圖。 第四圖係本創作之散熱鰭片組立體分解圖之一。 第五圖係本創作之散熱鰭片組立體分解圖之二。 第六圖係本創作之實施例圖。 第七圖係本創作之實施例散熱示意圖之一。 第八圖係本創作之實施例散熱示意圖之二。 【主要元件符號說明】Page 8 M269699 Simple illustration of the diagram [Simplified illustration of the diagram] The first diagram is an exploded perspective view of a conventional heat sink. The second picture is a three-dimensional view of this creation. The third picture is a three-dimensional exploded view of this creation. The fourth picture is one of the three-dimensional exploded view of the heat dissipation fin group in this creation. The fifth picture is the second three-dimensional exploded view of the heat dissipation fin group in this creation. The sixth diagram is an embodiment diagram of this creation. The seventh diagram is one of the heat dissipation diagrams of the embodiment of this creation. The eighth figure is the second heat dissipation diagram of the embodiment of this creation. [Description of main component symbols]
散熱裝置......A 殼體........A1Cooling device ... A case ... A1
風扇........BFan ... B
導風管.......CAir duct ... C
散熱鰭片......DCooling fins ... D
散熱體.......EHeat sink ... E
導熱鰭片組.....F 沿伸導熱鰭片組· · · F 1Thermally conductive fins ... F
散熱鰭片組.....G 散熱鰭片......G 1 穿孔........G 2 導熱管組......ΗRadiating fin group ... G Radiating fin ... G 1 Perforation ... G 2 Thermal tube group ... Η
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TW93220906U TWM269699U (en) | 2004-12-24 | 2004-12-24 | Improved structure of heat sink |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN111669947A (en) * | 2020-06-28 | 2020-09-15 | 广西世纪创新显示电子有限公司 | Heat radiation structure of display device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111669947A (en) * | 2020-06-28 | 2020-09-15 | 广西世纪创新显示电子有限公司 | Heat radiation structure of display device |
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