TWM269699U - Improved structure of heat sink - Google Patents

Description

M269699 4. Creation Description (1) [Technical Field to which the New Type belongs] This creation is to provide a structural improvement of the heat dissipation device. The heat dissipation device is provided with several fans on the casing, and a fan is provided on the fan on one side of the casing. A heat sink is arranged inside the casing, and the heat dissipation fins are stacked on the heat conduction tube group through the perforation, assembled into a heat dissipation fin group, and the thermally conductive fin group is extended between the heat conduction fin group and the heat conduction tube group. The heat conduction fin group, the heat dissipation fin group, and the heat pipe group are closely adhered to each other. The above structure is covered with a heat conduction plate, and a plurality of grooves are provided on the heat conduction plate. , So that the heat pipe group is accommodated inside the groove, and a closer fit has been achieved.

[Previous technology] As shown in the first figure, although the conventional heat sink A is provided with a fan B and an air duct C on the heat sink fin D, the heat sink fin D is only arranged in a vertical arrangement. The higher D part, the thermal energy dissipation effect is limited, and the airflow is conducted in a vertical manner. If the amount of wind generated by the fan is unstable, the contact surface between the airflow and the heat dissipation fin D will be caused when the airflow passes through the heat dissipation fin D. Uneven, reducing heat dissipation effect.

For example, China's new-type patent, the publication number of which is No. 2 4 565, is that the heat-dissipating fins are arranged vertically, and the effect of heat-dissipating is limited. Therefore, how to provide a heat dissipation device that improves the heat dissipation efficiency of the heat dissipation fins is the technical difficulty that the creators of this case want to solve. [New content] The following is a detailed description of the illustrations, drawing numbers, and embodiments of this creation.

Page 5 M269699 4. Creation instructions (2) This creation provides structural improvements of the heat sink. As shown in the second and third figures, the heat sink A is provided with a number of fans B on the housing A 1 and a housing A. The fan B on one side is provided with a wind guide tube C, and the shell A 1 is provided with a heat sink E (see the third figure for cooperation). The heat sink E is composed of a heat conducting sheet group F and a heat sink. Sheet group G, heat pipe group Η and heat plate I

Its structural feature is that the heat dissipation fin G 1 is stacked on the heat pipe group 透过 through the perforation G 2 to assemble the heat sink fin group G, and then the heat conduction fin group F 1 is extended into the heat pipe group. Between the cymbals, the thermally conductive fin group F1, the heat dissipation fin group G, and the heat pipe group Η are closely adhered to each other. The above structure is covered with a heat conductive plate I, and a number of The groove I 1, when the heat conducting plate I is covered, allows the heat pipe group to be accommodated inside the groove I 1 to achieve a closer fit.

During heat dissipation, the heat conducting plate I derives the heat energy of the electronic components connected at the bottom during operation. Part of the heat energy is conducted by the heat conducting plate I to the heat conducting fin group F, and then to the heat radiating fin group G, and the other part is conducted through heat conduction. The tube group is transmitted to the heat dissipation fin group G. At this time, because the arrangement directions of the heat dissipation fin group G and the heat conduction fin group F are different, the gas generated by the fan B contacts the heat dissipation fin group G and the heat conduction fin more uniformly. Group F. In addition, the heat conducting tube Η and the heat conducting plate I are attached to each other by the groove I 1, so that the heat energy is quickly conducted to the heat radiating fin group G, and the arrangement direction of the heat radiating fin group G and the heat conducting tube group Η are different, so that the fan B is The generated gas can simultaneously dissipate the heat energy of the heat transfer tube Η and the heat dissipation fin group G, and improve the heat dissipation efficiency of the heat sink E.

Page 6 M269699 IV. Creation Instructions (3) [Implementation] The implementation of this creation is shown in the sixth, seventh, and eighth figures. The heat sink A is installed on the circuit board L, and the heat conduction board I The thermal energy during the operation of the electronic components connected at the bottom is derived. A part of the thermal energy J is conducted from the heat conducting plate I to the heat conducting fin group F, and then to the heat radiating fin group G, and the other part of the heat energy J is transmitted through the heat conducting tube group. To the heat dissipation fin group G, at this time, because the arrangement direction of the heat dissipation fin group G and the heat conduction miscellaneous fin group F are different, the airflow κ generated by the fan B is more uniformly contacted with the heat dissipation fin group G and the heat conduction fin group F, At the same time, the contact area of the airflow K with the heat dissipation fin group G and the heat conduction fin group F is increased to improve heat dissipation efficiency. At the same time, the heat conducting tube Η is attached to and extending the heat conducting fin group F 1 and the heat conducting plate I, so that the heat energy J is quickly transmitted to the heat radiating fin group G, and the arrangement directions of the heat radiating fin group G and the heat conducting tube group 一 are different. Similarly, the air current K generated by the fan B can simultaneously extract the heat energy of the heat conducting tube Η and the heat dissipation fin group G, thereby improving the heat dissipation efficiency of the heat sink E. Then, the airflow K that conducts the heat energy J is directly discharged to the outside through the air duct C, so that the airflow K is not circulated in the interior, and the heat energy J is prevented from accumulating in the interior, thereby improving heat dissipation efficiency. However, the above is only one of the best and feasible embodiments of this creation, and therefore does not limit the scope of the patent of this creation. Therefore, the equivalent structure of the description and illustration of this creation is used directly or indirectly for other related Those in the technical field should be included in the scope of the spirit of this creation for the same reason and shared with Chen Ming.

M269699 IV. Creation Instructions (4) In order to make this creation show its progressiveness and practicability, a comparative analysis with conventional practice is as follows: "Lack of Practice" I. The cooling fins have a limited heat dissipation effect. 2. The purely vertically arranged heat sink fins are not easy to dissipate heat from higher parts. 3. The purely vertically arranged heat sink fins have uneven gas contact area for gas circulation.

"Advantages of this creation" First, the overall heat dissipation effect is good. 2. Improve the efficiency of thermal energy export. 3. Arrange the fins with different directions to increase the contact area between the gas and the fins. 4. Accelerating the transfer of thermal energy by heat pipes to cause thermal fins. Fifth, the hot air flow is more easily discharged between the fins. 6. Progressive and practical.

8. Enhance industrial competitiveness. In summary, this breakthrough has indeed achieved the desired effect under the previous technical structure, and it is not easy for those skilled in the art to think about it. Furthermore, this creative application has not been disclosed before, and its features Progressiveness and practicability have clearly met the requirements for applying for a new type of patent.

Page 8 M269699 Simple illustration of the diagram [Simplified illustration of the diagram] The first diagram is an exploded perspective view of a conventional heat sink. The second picture is a three-dimensional view of this creation. The third picture is a three-dimensional exploded view of this creation. The fourth picture is one of the three-dimensional exploded view of the heat dissipation fin group in this creation. The fifth picture is the second three-dimensional exploded view of the heat dissipation fin group in this creation. The sixth diagram is an embodiment diagram of this creation. The seventh diagram is one of the heat dissipation diagrams of the embodiment of this creation. The eighth figure is the second heat dissipation diagram of the embodiment of this creation. [Description of main component symbols]

Cooling device ... A case ... A1

Fan ... B

Air duct ... C

Cooling fins ... D

Heat sink ... E

Thermally conductive fins ... F

Radiating fin group ... G Radiating fin ... G 1 Perforation ... G 2 Thermal tube group ... Η

M269699

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Claims (1)

M269699 January / Fifth, the scope of patent application 1. The structure of the heat sink is improved. The structure is characterized in that the heat sink is provided with several fans on the casing, the fan is provided with an air duct, and the inside of the casing is provided with The heat-dissipating body consists of a heat-conducting fin group, a heat-dissipating fin group, a heat-conducting tube group, and a heat-conducting plate. The heat-dissipating fins are stacked on the heat-conducting tube group through perforations, assembled into a heat-dissipating fin group, and then the heat-conducting fins are assembled. The extended thermally conductive fin group of the group penetrates between the heat conductive tube groups, so that the thermally conductive fin group, the heat dissipation fin group, and the thermally conductive tube group are closely adhered to each other. Several grooves are provided on the heat conducting plate, and when the heat conducting plate is covered, the heat conducting pipe group is accommodated inside the groove, which has achieved a closer fit. 2. The structure of the heat sink is improved as described in item 1 of the scope of the patent application, wherein the grooves of the heat conducting plate correspond to the number of heat pipes. Page 11