TW200909760A - Manufacturing method and product of heat-pipe type heat sink - Google Patents
Manufacturing method and product of heat-pipe type heat sink Download PDFInfo
- Publication number
- TW200909760A TW200909760A TW96132201A TW96132201A TW200909760A TW 200909760 A TW200909760 A TW 200909760A TW 96132201 A TW96132201 A TW 96132201A TW 96132201 A TW96132201 A TW 96132201A TW 200909760 A TW200909760 A TW 200909760A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- pipe
- accommodating groove
- sink
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 abstract 4
- 230000001737 promoting effect Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
| JP2008097891A JP4974949B2 (ja) | 2007-08-30 | 2008-04-04 | ヒートパイプを有する熱放散器の製造方法及びその製品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200909760A true TW200909760A (en) | 2009-03-01 |
| TWI331207B TWI331207B (enrdf_load_stackoverflow) | 2010-10-01 |
Family
ID=40554106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96132201A TW200909760A (en) | 2007-08-30 | 2007-08-30 | Manufacturing method and product of heat-pipe type heat sink |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4974949B2 (enrdf_load_stackoverflow) |
| TW (1) | TW200909760A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012141082A (ja) * | 2010-12-28 | 2012-07-26 | Fujitsu Ltd | 冷却装置及び電子機器 |
| JP7217792B1 (ja) | 2021-10-20 | 2023-02-03 | レノボ・シンガポール・プライベート・リミテッド | 電子機器の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001248982A (ja) * | 2000-03-03 | 2001-09-14 | Fujikura Ltd | ヒートパイプ構造体およびその成形工具 |
| JP4324367B2 (ja) * | 2002-11-06 | 2009-09-02 | ナブテスコ株式会社 | 素子放熱器 |
-
2007
- 2007-08-30 TW TW96132201A patent/TW200909760A/zh not_active IP Right Cessation
-
2008
- 2008-04-04 JP JP2008097891A patent/JP4974949B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP4974949B2 (ja) | 2012-07-11 |
| TWI331207B (enrdf_load_stackoverflow) | 2010-10-01 |
| JP2009058213A (ja) | 2009-03-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |