TWI338215B - - Google Patents
Download PDFInfo
- Publication number
- TWI338215B TWI338215B TW96136596A TW96136596A TWI338215B TW I338215 B TWI338215 B TW I338215B TW 96136596 A TW96136596 A TW 96136596A TW 96136596 A TW96136596 A TW 96136596A TW I338215 B TWI338215 B TW I338215B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat dissipation
- dissipating
- plate body
- unit
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims description 53
- 238000001816 cooling Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000004049 embossing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200915055A TW200915055A (en) | 2009-04-01 |
| TWI338215B true TWI338215B (enrdf_load_stackoverflow) | 2011-03-01 |
Family
ID=44725633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96136596A TW200915055A (en) | 2007-09-29 | 2007-09-29 | Manufacturing method for a heat-dissipating module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200915055A (enrdf_load_stackoverflow) |
-
2007
- 2007-09-29 TW TW96136596A patent/TW200915055A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW200915055A (en) | 2009-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100499980C (zh) | 散热鳍片组合及应用该散热鳍片组合的散热装置 | |
| TWI619430B (zh) | heat sink | |
| WO2007124652A1 (en) | Micro-slot group integrated heat-pipe radiator | |
| TWI620497B (zh) | 折疊型散熱裝置及其製法 | |
| TWI338215B (enrdf_load_stackoverflow) | ||
| CN101610656B (zh) | 散热装置及其组装方法 | |
| TWI398214B (zh) | 可擴增散熱面積的散熱鰭片與具有該散熱鰭片的散熱器及其製造方法 | |
| CN101409996B (zh) | 一种散热模块的制作方法 | |
| CN102762081A (zh) | 具有内置风扇的散热器 | |
| TWI331207B (enrdf_load_stackoverflow) | ||
| JP3146030U (ja) | 放熱フィンの構造およびその放熱フィンを使用した放熱モジュール | |
| TW201249319A (en) | Heat dissipating device containing heat pipe with bottom adhesion type heat dissipating fin | |
| WO2008037135A1 (en) | Heat sink with heat pipe and manufacturing method thereof | |
| TWI284500B (en) | Heat sink | |
| TWI410601B (zh) | A large area of cooling fins, and a radiator with the fins | |
| TWI309149B (en) | Heat dissipation device | |
| TWI327055B (en) | Heat dissipation module | |
| CN201035486Y (zh) | 内存散热装置 | |
| TWI309761B (en) | Thermal module | |
| TWI379717B (enrdf_load_stackoverflow) | ||
| TWI325105B (en) | Heat dissipation device | |
| CN2773904Y (zh) | 热管散热器 | |
| TW200810673A (en) | Heat dissipation device | |
| TW200907282A (en) | Sheet-combined thermal-dissipating device | |
| TW200841159A (en) | Heat dissipation device |