200907282 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱器，特別關於一種併片式散熱 器。 【先前技術】 隨著電子產品朝向高性能、高頻率、高速度與輕薄化 的迅速發展，造成電子產品的發熱溫度越來越高，因而容 易產生不穩定現象，影響產品可靠度與使用壽命。因此散 熱已成為電子產品的重要課題之一，而散熱鰭片乃是常見 的散熱元件，且研發人員莫不錙銖必較地提升散熱鰭片所 產生的散熱效率。 一種習知的併片式散熱器係由複數個散熱片連結而 成，各散熱片具有一連結部及一散熱鰭部，且散熱鰭部自 連結部之一側延伸。此外，連結部之厚度較散熱鰭部大， 使得各散熱片之散熱鰭部之間具有空間。當併片式散熱器 之連結部接觸於一熱源時，熱量便由連結部傳送至散熱鰭 部，再由空氣對流將熱量帶走進而散熱。 由於併片式散熱器係同時藉由空氣傳導及對流來散 熱，因此若散熱鰭部與空氣接觸的面積越多，則散熱效果 越佳。然而，習知的併片式散熱器由於散熱鰭部與空氣接 觸的面積受限於電子產品的内部空間，以致散熱效果無法 再提高，當其應用於高頻電子元件的散熱，已不敷使用。 因此，如何提供一種併片式散熱器，跳脫習知設計窠 200907282 臼，在有限設置空間内增加散熱鰭部與空氣接觸的面積， 進一步提高散熱效能，實為重要課題之一。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種能夠增加 散熱鰭部與空氣接觸之面積，進一步提高散熱效能之併片 式散熱器。 緣是，為達上述目的，依本發明之一種併片式散熱器 係由複數個散熱片連結而成。各散熱片包含一連結部、至 少一散熱鰭部以及複數個次散熱鰭部。連結部係相互連 結。散熱鰭部係自連結部向外延伸，連結部的厚度大於散 熱鰭部。次散熱鰭部係自散熱鰭部的至少一側向外延伸。 為達上述目的，依本發明之一種併片式散熱器係由複 數個散熱片連結而成。各散熱片包含一連結部、至少一散 熱鰭部以及複數個次散熱鰭部。連結部係相互連結。散熱 鰭部係自連結部向外延伸，連結部的厚度大於散熱鰭部。 次散熱鰭部係自散熱鰭部的至少一側向外延伸，且次散熱 鰭部頂抵相鄰的散熱鰭部或次散熱鰭部，使散熱鰭部彼此 展開。 承上所述，因依本發明之一種併片式散熱器具有複數 個次散熱鰭部，其係自散熱鰭部向外延伸。與習知技術相 較，本發明在原有的散熱鰭部之外，更設置次散熱鰭部， 以致能夠增加散熱鰭部與空氣接觸的面積，進一步提高散 熱效能。此外，本發明之次散熱鰭部可頂抵相鄰的散熱鰭 200907282 部或次散熱鰭部，使散熱鰭部彼此展開，進而可讓更多的 空氣進入並帶走更多的熱量，而再提升散熱效能。 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之一 種併片式散熱器，其中相同的元件將以相同的參照符號加 以說明。 第一實施例：單面不展開，同片，次散熱鰭部交叉 請參照圖1A及圖1B所示，本發明較佳實施例之一種 併片式散熱器2係由複數個散熱片21連結而成。各散熱 片21包含一連結部211、一散熱鰭部212及複數個次散熱 鰭部213。其中，散熱鰭部212係自連結部211向外延伸， 且連結部211的厚度大於散熱鰭部212，連結部211係由 對應散熱鰭部212的左右二側增厚。次散熱鰭部213係自 散熱鰭部212的至少一側向外延伸。於此，次散熱鰭部213 係自散熱鰭部212的相對側向外垂直設置，且不對稱設 置，使得次散熱鰭部213與相鄰的次散熱鰭部213呈交叉 設置；當然，次散熱鰭部213亦可以其他方式設置於散熱 鰭部212，例如自散熱鰭部212的相對側向外不垂直設置 或對稱設置。需注意者，圖1A及圖1B之剖面線僅為區別 相鄰的散熱片21，並非用以限制本發明。 在本實施例中，各散熱片21係一體成型。藉由螺鎖 方式連結各散熱片21的連結部211，以組成併片式散熱器 2。其中，各散熱片21之連結部211係併排連結。另外， 200907282 散熱片21亦可藉由藉由鉚接方式連結。 =㈣中’各散熱心可不完 或疋全相同（同片）。 月） 各散熱鰭部212芬々例不限定各連結部211、 …、 及各次散熱鰭部213的形狀；5 p π» 相鄰散熱片21的形肤㈣狀及尺寸’例如 散熱片㈣w或是相鄰 同。本實施例之技、術'^2於的形狀或尺寸可相同或不相 部犯延伸，以w / 次散熱鰭部213自散熱轉 it M W式散熱11 2與线的接觸面積， 進而提尚散熱效能。 々貝 .^3 、，、°邛、一散熱鰭部312及複數個次散埶 部313,且更命合另_ 狀.、、、瑪 匕3另一散熱鰭部314及複數個次散熱鰭部 外月’’、、’^ 312、314得、分別自連結部311的不同側向 L申，且連結部311的厚度大於散熱H部312、314。另 夕’次散熱韓部313、315分別於散熱鰭部312、314之相 對側不對稱、垂直設置。藉由散熱轉部3ΐ2、Μ及次散 ^Γ、3Γ'315的雙向設置’而能夠進—步提高散熱效 肊。而注思者，圖1C之剖面線僅為區別相鄰的散熱片31， 並非用以限制本發明。 散熱鰭部交叉 去，參照圖2A所示’本發明第三實施例之一種併片式 散熱器4係由複數個散熱片41連結而成。各散熱片^包 200907282 含一連結部411、一散熱鰭部412及複數個次散熱鰭部 413。其中，散熱鰭部412係自連結部411向外延伸，且 各散熱片41的散熱鰭部412係相互展開。連結部411的 厚度大於散熱鰭部212,連結部411係由對應散熱鰭部412 的左右二側之其中一側增厚。次散熱鰭部413係自散熱鰭 部412的至少一側向外延伸。於此，次散熱鰭部413係自 散熱鰭部412的相對側向外垂直設置，且不對稱設置，使 得次散熱鰭部413與相鄰的次散熱鰭部413呈交叉設置。 在本實施例中，散熱片41展開的方式有複數種，例 如可藉由展開設備將散熱片41展開，或是如圖2A所示， 藉由在組裝時，次散熱鰭部413抵觸相鄰的散熱鰭部411， 使得各散熱鰭部412彼此展開。 第四實施例：雙面展開，同片，次散熱鰭部交叉 請參照圖2B所示，本發明第四實施例之一種併片式 散熱器5，其係由複數個散熱月51連結而成。各散熱片 51包含一連結部511、一散熱鰭部512及複數個次散熱鰭 部513，且更包含另一散熱鰭部514及複數個次散熱鰭部 515。散熱鰭部512、514係分別自連結部511的不同側向 外延伸。另外，次散熱鰭部513、515分別於散熱鰭部512、 514之相對側不對稱、垂直設置。藉由散熱鰭部512、514 及次散熱鰭部513、515的雙向設置，而能夠進一步提高 散熱效能。 第五實施例：雙面展開（雙面大小不同），同片，次散熱 鰭部交叉 200907282 請參照圖3所示，本發明第五實施例之一種併片式散 熱器6，其係由複數個散熱片61連結而成。各散熱片61 包含一連結部611、一散熱鰭部612及複數個次散熱鰭部 613，且更包含另一散熱鰭部614及複數個次散熱鰭部 615。其中，散熱鰭部614係小於散熱鰭部612。另外，次 散熱鰭部613、615分別於散熱鰭部612、614之相對側垂 直、不對稱設置。藉由散熱鰭部612、614及次散熱鰭部 613、615的雙向設置，而能夠進一步提高散熱效能。 第六實施例··三面展開，同 >；，次散熱鰭部交叉 請參照圖4所示，本發明第六實施例之一種併片式散 熱器7，其係由複數個散熱片71連結而成。各散熱片71 包含一連結部711、二散熱鰭部712、714及複數個次散熱 鰭部713、715，且更包含一散熱部716。散熱鰭部712、 714及散熱部716係分別自連結部711的不同側向外延 伸，於此係自連結部711之左、右及上側向外延伸。另外， 次散熱鰭部713、715分別於散熱鰭部712、714之相對側 垂直、不對稱設置。藉由散熱鰭部712、714、次散熱鰭部 713、715以及散熱部716的三向設置，而能夠進一步提高 散熱效能。 第七實施例：雙面展開，同片，次散熱鰭部不交叉 請參照圖5所示，本發明第七實施例之一種併片式散 熱器8，其係由複數個散熱片81連結而成。各散熱片81 包含一連結部811、一散熱鰭部812及複數個次散熱鰭部 813，且更包含另一散熱鰭部814及複數個次散熱鰭部 200907282 815。散熱鰭部812、814係分別自連結部811的不同側向 外延伸。另外，次散熱鰭部813、815分別於散熱鰭部812、 814之相對側對稱、垂直設置。藉由在組裝時，次散熱鰭 部813、815抵觸相鄰的次散熱鰭部813、815，使得各散 熱鰭部811彼此展開。藉由散熱鰭部812、814及次散熱 鰭部813、815的雙向設置，而能夠進一步提高散熱效能。 第八實施例：雙面展開，同片，次散熱鰭部交叉，散熱鰭 部外側隆起 請參照圖6所示，本發明第八實施例之一種併片式散 熱器9，其係由複數個散熱片91連結而成。各散熱片91 包含一連結部911、一散熱鰭部912及複數個次散熱鰭部 913，且更包含另一散熱鰭部914及複數個次散熱鰭部 915。散熱鰭部912、914係分別自連結部911的不同側向 外延伸、並隆起，使得散熱鰭部912、914遠離連結部911 之外側的高度比靠近連結部911之内側的高度更高。 综上所述，因依本發明之一種併片式散熱器具有複數 個次散熱鰭部，其係自散熱鰭部向外延伸。與習知技術相 較，本發明在原有的散熱鰭部之外，更設置次散熱鰭部， 以致能夠增加散熱鰭部與空氣接觸的面積，進一步提高散 熱效能。此外，本發明之次散熱鰭部可頂抵相鄰的散熱鰭 部或次散熱鰭部，使散熱鰭部彼此展開，進而可讓更多的 空氣進入並帶走更多的熱量，而再提升散熱效能。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 11 200907282 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1A及圖1B為依據本發明第一實施例之併片式散熱 器的示意圖； 圖1C為依據本發明第二實施例之併片式散熱器的示 意圖； 圖2A為依據本發明第三實施例之併片式散熱器的示 意圖； 圖2B為依據本發明第四實施例之併片式散熱器的示 意圖； 圖3為依據本發明第五實施例之併片式散熱器的示意 圖； 圖4為依據本發明第六實施例之併片式散熱器的示意 圖， 圖5為依據本發明第七實施例之併片式散熱器的示意 圖；以及 圖6為依據本發明第八實施例之併片式散熱器的示意 圖0 【主要元件符號說明】 2〜9 :併片式散熱器 21、31、41、51、61、71、81、91 :散熱片 211、311、411、511、611、711、811、811 :連結部 12 200907282 212、312、314、412、512、514、612、614、712、714 812、 814、912、914 :散熱鰭部 213 、 313 、 315 、 413 、 513 、 515 、 613 、 615 、 713 、 715 813、 815、913、915 ··次散熱鰭部 716 :散熱部 13200907282 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat sink, and more particularly to a parallel chip heat sink. [Prior Art] With the rapid development of electronic products toward high performance, high frequency, high speed and light weight, the heating temperature of electronic products is getting higher and higher, which is easy to cause instability and affect product reliability and service life. Therefore, heat dissipation has become one of the important topics of electronic products, and heat sink fins are common heat dissipation components, and R & D personnel must not improve the heat dissipation efficiency of heat sink fins. A conventional parallel plate heat sink is formed by a plurality of heat sinks, each heat sink having a joint portion and a heat sink fin, and the heat sink fins extending from one side of the joint portion. Further, the thickness of the connecting portion is larger than that of the heat radiating fin portion, so that there is a space between the heat radiating fin portions of the heat radiating fins. When the joint portion of the parallel heat sink is in contact with a heat source, heat is transferred from the joint portion to the heat sink fin, and the air is convected to carry heat into the heat sink. Since the parallel-type heat sink radiates heat by air conduction and convection at the same time, if the area of the heat-dissipating fins in contact with the air is increased, the heat-dissipating effect is better. However, the conventional heat sink fins are limited in contact with the air by the inner space of the electronic product, so that the heat dissipation effect cannot be further improved, and when it is applied to heat dissipation of high frequency electronic components, it is insufficient to use. . Therefore, how to provide a parallel-type heat sink, jump off the conventional design 窠 200907282 臼, increase the area of the heat-dissipating fins in contact with the air in a limited installation space, and further improve the heat dissipation performance, which is one of the important topics. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a parallel-type heat sink capable of increasing the area in which a heat radiating fin is in contact with air and further improving heat dissipation performance. Therefore, in order to achieve the above object, a parallel type heat sink according to the present invention is formed by a plurality of heat sinks. Each of the heat sinks includes a joint portion, at least one heat sink fin, and a plurality of secondary heat sink fins. The links are connected to each other. The heat dissipating fin extends outward from the joint portion, and the joint portion has a thickness larger than the heat radiating fin portion. The secondary heat sink fin extends outward from at least one side of the heat sink fin. To achieve the above object, a parallel chip heat sink according to the present invention is formed by a plurality of heat sinks. Each of the heat sinks includes a joint portion, at least one heat sink fin, and a plurality of secondary heat sink fins. The links are connected to each other. The heat dissipation fin extends outward from the joint portion, and the thickness of the joint portion is larger than that of the heat sink fin. The secondary heat dissipation fins extend outward from at least one side of the heat dissipation fins, and the secondary heat dissipation fins abut against the adjacent heat dissipation fins or secondary heat dissipation fins to expand the heat dissipation fins. As described above, a parallel-type heat sink according to the present invention has a plurality of secondary heat-dissipating fins extending outward from the heat-dissipating fins. Compared with the prior art, the present invention further includes a secondary heat sink fin in addition to the original heat sink fin, so that the area of the heat sink fin in contact with the air can be increased, and the heat dissipation performance is further improved. In addition, the secondary heat-dissipating fin portion of the present invention can abut the adjacent heat-dissipating fins 200907282 or the secondary heat-dissipating fins, so that the heat-dissipating fins are unfolded from each other, thereby allowing more air to enter and carry more heat, and then Improve heat dissipation. [Embodiment] Hereinafter, a parallel-type heat sink according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be denoted by the same reference numerals. The first embodiment is a single-sided non-expansion, the same piece, and the secondary heat-dissipating fins are crossed. Referring to FIG. 1A and FIG. 1B, a parallel-type heat sink 2 is connected by a plurality of heat sinks 21 according to a preferred embodiment of the present invention. Made. Each heat sink 21 includes a connecting portion 211, a heat radiating fin portion 212, and a plurality of secondary heat radiating fin portions 213. The heat dissipation fin portion 212 extends outward from the connection portion 211, and the thickness of the connection portion 211 is larger than the heat dissipation fin portion 212. The connection portion 211 is thickened by the left and right sides of the heat dissipation fin portion 212. The secondary heat dissipation fins 213 extend outward from at least one side of the heat dissipation fins 212. Here, the secondary heat dissipation fins 213 are disposed perpendicularly outward from opposite sides of the heat dissipation fins 212, and are disposed asymmetrically such that the secondary heat dissipation fins 213 are disposed in crossover with the adjacent secondary heat dissipation fins 213; The fins 213 may also be disposed on the heat dissipation fins 212 in other manners, such as not disposed perpendicularly or symmetrically from opposite sides of the heat dissipation fins 212. It should be noted that the hatching of Figs. 1A and 1B is only to distinguish adjacent fins 21, and is not intended to limit the present invention. In the present embodiment, each of the fins 21 is integrally formed. The joint portion 211 of each of the fins 21 is coupled by a screw lock to form a parallel heat sink 2. The connecting portions 211 of the fins 21 are connected in parallel. In addition, the heat sink 21 of 200907282 can also be connected by riveting. = (4) Medium 'The heat sinks can't be finished or the same (same film). The shape of each of the heat-dissipating fins 212 is not limited to the shape of each of the connecting portions 211, ..., and the respective heat-dissipating fins 213; 5 p π» the shape of the adjacent fins 21 (four) and the size 'for example, the heat sink (four) w Or adjacent. In the embodiment, the shape or size of the technique can be the same or not extended, and the contact area of the heat dissipation fin 213 from the heat dissipation to the MW heat dissipation 11 2 and the line is further improved. Cooling performance. Mussels. ^3,,, °邛, a heat-dissipating fin 312 and a plurality of secondary diverging portions 313, and more than another _-shaped,,,,,,,,,,,,,,,,,,,, The outer fins '', '' 312, and 314 of the fins are respectively formed from different lateral directions of the connecting portion 311, and the thickness of the connecting portion 311 is larger than the heat radiating portions H, 312, and 314. On the other hand, the heat dissipation portions 313 and 315 are disposed asymmetrically and vertically on opposite sides of the heat dissipation fins 312 and 314, respectively. The heat dissipation effect can be further improved by the two-way arrangement of the heat-dissipating rotating parts 3ΐ2, Μ and the second-distribution Γ, 3Γ'315. Note that the hatching of FIG. 1C is only to distinguish adjacent heat sinks 31, and is not intended to limit the present invention. The heat sink fins are crossed. Referring to Fig. 2A, a parallel type heat sink 4 according to a third embodiment of the present invention is connected by a plurality of heat sinks 41. Each heat sink package 200907282 includes a connecting portion 411, a heat radiating fin portion 412, and a plurality of secondary heat radiating fin portions 413. The heat dissipation fins 412 extend outward from the connection portion 411, and the heat dissipation fins 412 of the heat dissipation fins 41 are mutually unfolded. The thickness of the connecting portion 411 is larger than that of the heat radiating fin portion 212, and the connecting portion 411 is thickened by one side of the left and right sides of the heat radiating fin portion 412. The secondary heat dissipation fins 413 extend outward from at least one side of the heat dissipation fins 412. Here, the secondary heat dissipation fins 413 are vertically disposed outward from opposite sides of the heat dissipation fins 412, and are disposed asymmetrically such that the secondary heat dissipation fins 413 are disposed to intersect with the adjacent secondary heat dissipation fins 413. In this embodiment, the heat sink 41 is deployed in a plurality of manners, for example, the heat sink 41 can be unfolded by the unfolding device, or as shown in FIG. 2A, by the secondary heat sink fins 413 resisting adjacent when assembled. The heat dissipation fins 411 are such that the heat dissipation fins 412 are unfolded from each other. The fourth embodiment is a double-sided unfolding, a same piece, and a secondary heat-dissipating fin. Referring to FIG. 2B, a parallel-type heat sink 5 according to a fourth embodiment of the present invention is formed by a plurality of heat-dissipating months 51. . Each of the heat dissipating fins 51 includes a connecting portion 511, a heat dissipating fin portion 512 and a plurality of sub heat dissipating fin portions 513, and further includes another heat dissipating fin portion 514 and a plurality of sub heat dissipating fin portions 515. The heat radiating fins 512 and 514 extend outward from different sides of the connecting portion 511, respectively. In addition, the secondary heat dissipation fins 513 and 515 are asymmetrically and vertically disposed on opposite sides of the heat dissipation fins 512 and 514, respectively. The heat dissipation performance can be further improved by the bidirectional arrangement of the heat dissipation fins 512, 514 and the secondary heat dissipation fins 513, 515. The fifth embodiment: double-sided expansion (different double-sided size), same piece, secondary heat-dissipating fin crossing 200907282. Referring to FIG. 3, a parallel-type heat sink 6 according to a fifth embodiment of the present invention is composed of plural The heat sinks 61 are connected together. Each of the heat dissipating fins 61 includes a connecting portion 611, a heat dissipating fin portion 612 and a plurality of sub heat dissipating fin portions 613, and further includes another heat dissipating fin portion 614 and a plurality of sub heat dissipating fin portions 615. The heat dissipation fin portion 614 is smaller than the heat dissipation fin portion 612. In addition, the secondary heat dissipation fins 613 and 615 are vertically and asymmetrically disposed on opposite sides of the heat dissipation fins 612 and 614, respectively. The heat dissipation performance can be further improved by the bidirectional arrangement of the heat dissipation fins 612 and 614 and the secondary heat dissipation fins 613 and 615. Sixth Embodiment··Three-sided development, the same as >;, the secondary heat-dissipating fins. Referring to FIG. 4, a parallel-type heat sink 7 according to a sixth embodiment of the present invention is connected by a plurality of heat sinks 71. Made. Each of the heat sinks 71 includes a connecting portion 711, two heat dissipating fins 712 and 714, and a plurality of sub heat radiating fin portions 713 and 715, and further includes a heat dissipating portion 716. The heat radiating fins 712 and 714 and the heat radiating portion 716 are respectively extended from different sides of the connecting portion 711, and extend outward from the left, right, and upper sides of the connecting portion 711. In addition, the secondary heat dissipation fins 713 and 715 are vertically and asymmetrically disposed on opposite sides of the heat dissipation fins 712 and 714, respectively. The heat dissipation performance can be further improved by the three-way arrangement of the heat dissipation fins 712, 714, the secondary heat dissipation fins 713, 715, and the heat dissipation portion 716. The seventh embodiment: the double-sided unfolding, the same piece, and the secondary heat-dissipating fins do not intersect. Referring to FIG. 5, a parallel-plate heat sink 8 according to a seventh embodiment of the present invention is connected by a plurality of heat-dissipating fins 81. to make. Each of the heat dissipating fins 81 includes a connecting portion 811, a heat dissipating fin portion 812 and a plurality of sub heat radiating fin portions 813, and further includes another heat dissipating fin portion 814 and a plurality of sub heat dissipating fin portions 200907282 815. The heat radiating fins 812 and 814 extend outward from different sides of the connecting portion 811, respectively. In addition, the secondary heat dissipation fins 813 and 815 are symmetrically and vertically disposed on opposite sides of the heat dissipation fins 812 and 814, respectively. By the secondary heat-dissipating fins 813, 815 against the adjacent secondary heat-dissipating fins 813, 815 during assembly, the heat-dissipating fins 811 are unfolded from each other. The heat dissipation performance can be further improved by the bidirectional arrangement of the heat dissipation fins 812 and 814 and the secondary heat dissipation fins 813 and 815. The eighth embodiment: the double-sided unfolding, the same piece, the secondary heat-dissipating fins, and the outer side of the heat-dissipating fins. Referring to FIG. 6, the parallel-type heat sink 9 of the eighth embodiment of the present invention is composed of a plurality of The fins 91 are connected together. Each of the fins 91 includes a connecting portion 911, a heat dissipating fin portion 912, and a plurality of sub heat radiating fin portions 913, and further includes another heat dissipating fin portion 914 and a plurality of sub heat dissipating fin portions 915. The heat radiating fin portions 912 and 914 extend outward from different sides of the connecting portion 911 and are swelled so that the height of the heat radiating fin portions 912 and 914 away from the outer side of the connecting portion 911 is higher than the height of the inner side of the connecting portion 911. In summary, a parallel-plate heat sink according to the present invention has a plurality of secondary heat-dissipating fins extending outward from the heat-dissipating fins. Compared with the prior art, the present invention further includes a secondary heat sink fin in addition to the original heat sink fin, so that the area of the heat sink fin in contact with the air can be increased, and the heat dissipation performance is further improved. In addition, the secondary heat-dissipating fin portion of the present invention can abut against the adjacent heat-dissipating fins or the secondary heat-dissipating fins, so that the heat-dissipating fins are unfolded from each other, thereby allowing more air to enter and taking more heat, and then lifting Cooling performance. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are schematic views of a parallel chip heat sink according to a first embodiment of the present invention; FIG. 1C is a schematic view of a parallel chip heat sink according to a second embodiment of the present invention; 2B is a schematic view of a parallel chip heat sink according to a third embodiment of the present invention; FIG. 2B is a schematic view of a parallel chip heat sink according to a fourth embodiment of the present invention; Figure 4 is a schematic view of a parallel chip heat sink according to a sixth embodiment of the present invention, Figure 5 is a schematic view of a parallel chip heat sink according to a seventh embodiment of the present invention; and Figure 6 is a view of the present invention Schematic diagram of the parallel chip heat sink of the eighth embodiment [Description of main component symbols] 2 to 9: Parallel heat sinks 21, 31, 41, 51, 61, 71, 81, 91: heat sinks 211, 311, 411 511, 611, 711, 811, 811: connection portion 12 200907282 212, 312, 314, 412, 512, 514, 612, 614, 712, 714 812, 814, 912, 914: heat dissipation fins 213, 313, 315 , 413, 513, 515, 613, 615, 713, 715 813, 815 716 ·· secondary radiating fin portion 913, 915: heat dissipating portion 13