TWI328265B - - Google Patents

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Publication number
TWI328265B
TWI328265B TW95147893A TW95147893A TWI328265B TW I328265 B TWI328265 B TW I328265B TW 95147893 A TW95147893 A TW 95147893A TW 95147893 A TW95147893 A TW 95147893A TW I328265 B TWI328265 B TW I328265B
Authority
TW
Taiwan
Prior art keywords
mounting
unit
substrate
semiconductor wafer
electronic component
Prior art date
Application number
TW95147893A
Other languages
English (en)
Chinese (zh)
Other versions
TW200729372A (en
Inventor
Masanori Hashimoto
Yuichi Sato
Yukihiro Ikeya
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200729372A publication Critical patent/TW200729372A/zh
Application granted granted Critical
Publication of TWI328265B publication Critical patent/TWI328265B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01093—Neptunium [Np]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW095147893A 2005-12-22 2006-12-20 Apparatus and method for mounting electronic component TW200729372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005369515 2005-12-22

Publications (2)

Publication Number Publication Date
TW200729372A TW200729372A (en) 2007-08-01
TWI328265B true TWI328265B (ko) 2010-08-01

Family

ID=38188495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147893A TW200729372A (en) 2005-12-22 2006-12-20 Apparatus and method for mounting electronic component

Country Status (5)

Country Link
JP (1) JP4713596B2 (ko)
KR (1) KR101014293B1 (ko)
CN (1) CN101341587B (ko)
TW (1) TW200729372A (ko)
WO (1) WO2007072714A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673803B (zh) * 2016-02-01 2019-10-01 日商芝浦機械電子裝置股份有限公司 電子零件之安裝裝置及安裝方法、以及封裝零件之製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030843B2 (ja) * 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5104685B2 (ja) * 2008-09-19 2012-12-19 パナソニック株式会社 部品ピックアップ装置
US9966247B2 (en) * 2012-09-06 2018-05-08 Fuji Machine Mfg. Co., Ltd. Control system and control method for component mounting machine
KR101460626B1 (ko) * 2013-06-28 2014-11-13 한미반도체 주식회사 반도체 자재 공급장치
WO2015072593A1 (ko) * 2013-11-14 2015-05-21 (주)정원기술 레이저 칩 본딩기의 칩 공급장치
JP6942829B2 (ja) * 2016-03-29 2021-09-29 芝浦メカトロニクス株式会社 電子部品の実装装置
JP6717630B2 (ja) * 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 電子部品の実装装置
WO2017194286A1 (en) * 2016-05-13 2017-11-16 Asml Netherlands B.V. Multiple miniature pick up elements for a component stacking and/or pick-and-place process
CN107887295B (zh) * 2016-09-30 2019-07-23 上海微电子装备（集团）股份有限公司 一种芯片键合装置及键合方法
KR101939343B1 (ko) * 2017-02-28 2019-01-16 (주) 예스티 반도체 제조 장치
KR101939347B1 (ko) * 2017-02-28 2019-01-16 (주) 예스티 반도체 제조 장치
KR101944355B1 (ko) * 2017-02-28 2019-01-31 (주) 예스티 반도체 제조 장치
JP6781677B2 (ja) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207595A (ja) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP2808824B2 (ja) * 1990-05-17 1998-10-08 松下電器産業株式会社 電子部品実装装置
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
JP3747054B2 (ja) * 2001-12-04 2006-02-22 Ｔｏｗａ株式会社 ボンディング装置及びボンディング方法
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673803B (zh) * 2016-02-01 2019-10-01 日商芝浦機械電子裝置股份有限公司 電子零件之安裝裝置及安裝方法、以及封裝零件之製造方法
TWI708295B (zh) * 2016-02-01 2020-10-21 日商芝浦機械電子裝置股份有限公司 電子零件之安裝裝置及安裝方法、以及封裝零件之製造方法

Also Published As

Publication number Publication date
KR101014293B1 (ko) 2011-02-16
WO2007072714A1 (ja) 2007-06-28
CN101341587B (zh) 2010-10-27
CN101341587A (zh) 2009-01-07
KR20080068876A (ko) 2008-07-24
JP4713596B2 (ja) 2011-06-29
JPWO2007072714A1 (ja) 2009-05-28
TW200729372A (en) 2007-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees