JP4713596B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP4713596B2
JP4713596B2 JP2007551046A JP2007551046A JP4713596B2 JP 4713596 B2 JP4713596 B2 JP 4713596B2 JP 2007551046 A JP2007551046 A JP 2007551046A JP 2007551046 A JP2007551046 A JP 2007551046A JP 4713596 B2 JP4713596 B2 JP 4713596B2
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Japan
Prior art keywords
mounting
unit
substrate
electronic component
reversing
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JP2007551046A
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English (en)
Japanese (ja)
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JPWO2007072714A1 (ja
Inventor
正規 橋本
裕一 佐藤
之宏 池谷
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2007551046A priority Critical patent/JP4713596B2/ja
Publication of JPWO2007072714A1 publication Critical patent/JPWO2007072714A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01093—Neptunium [Np]
JP2007551046A 2005-12-22 2006-12-12 電子部品の実装装置及び実装方法 Active JP4713596B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007551046A JP4713596B2 (ja) 2005-12-22 2006-12-12 電子部品の実装装置及び実装方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005369515 2005-12-22
JP2005369515 2005-12-22
PCT/JP2006/324772 WO2007072714A1 (ja) 2005-12-22 2006-12-12 電子部品の実装装置及び実装方法
JP2007551046A JP4713596B2 (ja) 2005-12-22 2006-12-12 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
JPWO2007072714A1 JPWO2007072714A1 (ja) 2009-05-28
JP4713596B2 true JP4713596B2 (ja) 2011-06-29

Family

ID=38188495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007551046A Active JP4713596B2 (ja) 2005-12-22 2006-12-12 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP4713596B2 (ko)
KR (1) KR101014293B1 (ko)
CN (1) CN101341587B (ko)
TW (1) TW200729372A (ko)
WO (1) WO2007072714A1 (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030843B2 (ja) * 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5104685B2 (ja) * 2008-09-19 2012-12-19 パナソニック株式会社 部品ピックアップ装置
US9966247B2 (en) * 2012-09-06 2018-05-08 Fuji Machine Mfg. Co., Ltd. Control system and control method for component mounting machine
KR101460626B1 (ko) * 2013-06-28 2014-11-13 한미반도체 주식회사 반도체 자재 공급장치
WO2015072593A1 (ko) * 2013-11-14 2015-05-21 (주)정원기술 레이저 칩 본딩기의 칩 공급장치
KR102196105B1 (ko) 2016-02-01 2020-12-30 시바우라 메카트로닉스 가부시끼가이샤 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법
JP6942829B2 (ja) * 2016-03-29 2021-09-29 芝浦メカトロニクス株式会社 電子部品の実装装置
JP6717630B2 (ja) * 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 電子部品の実装装置
WO2017194286A1 (en) * 2016-05-13 2017-11-16 Asml Netherlands B.V. Multiple miniature pick up elements for a component stacking and/or pick-and-place process
CN107887295B (zh) * 2016-09-30 2019-07-23 上海微电子装备（集团）股份有限公司 一种芯片键合装置及键合方法
KR101939343B1 (ko) * 2017-02-28 2019-01-16 (주) 예스티 반도체 제조 장치
KR101939347B1 (ko) * 2017-02-28 2019-01-16 (주) 예스티 반도체 제조 장치
KR101944355B1 (ko) * 2017-02-28 2019-01-31 (주) 예스티 반도체 제조 장치
JP6781677B2 (ja) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207595A (ja) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH0422194A (ja) * 1990-05-17 1992-01-27 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003174061A (ja) * 2001-12-04 2003-06-20 Towa Corp ボンディング装置及びボンディング方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997032460A1 (de) * 1996-02-29 1997-09-04 Alphasem Ag Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207595A (ja) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH0422194A (ja) * 1990-05-17 1992-01-27 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003174061A (ja) * 2001-12-04 2003-06-20 Towa Corp ボンディング装置及びボンディング方法

Also Published As

Publication number Publication date
KR101014293B1 (ko) 2011-02-16
TWI328265B (ko) 2010-08-01
WO2007072714A1 (ja) 2007-06-28
CN101341587B (zh) 2010-10-27
CN101341587A (zh) 2009-01-07
KR20080068876A (ko) 2008-07-24
JPWO2007072714A1 (ja) 2009-05-28
TW200729372A (en) 2007-08-01

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