TW200729372A - Apparatus and method for mounting electronic component - Google Patents
Apparatus and method for mounting electronic componentInfo
- Publication number
- TW200729372A TW200729372A TW095147893A TW95147893A TW200729372A TW 200729372 A TW200729372 A TW 200729372A TW 095147893 A TW095147893 A TW 095147893A TW 95147893 A TW95147893 A TW 95147893A TW 200729372 A TW200729372 A TW 200729372A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor chip
- electronic component
- mounting electronic
- unit
- inverting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01093—Neptunium [Np]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005369515 | 2005-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200729372A true TW200729372A (en) | 2007-08-01 |
| TWI328265B TWI328265B (ko) | 2010-08-01 |
Family
ID=38188495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095147893A TW200729372A (en) | 2005-12-22 | 2006-12-20 | Apparatus and method for mounting electronic component |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4713596B2 (ko) |
| KR (1) | KR101014293B1 (ko) |
| CN (1) | CN101341587B (ko) |
| TW (1) | TW200729372A (ko) |
| WO (1) | WO2007072714A1 (ko) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5030843B2 (ja) * | 2008-04-14 | 2012-09-19 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置及び実装方法 |
| JP5104685B2 (ja) * | 2008-09-19 | 2012-12-19 | パナソニック株式会社 | 部品ピックアップ装置 |
| US9966247B2 (en) * | 2012-09-06 | 2018-05-08 | Fuji Machine Mfg. Co., Ltd. | Control system and control method for component mounting machine |
| KR101460626B1 (ko) * | 2013-06-28 | 2014-11-13 | 한미반도체 주식회사 | 반도체 자재 공급장치 |
| WO2015072593A1 (ko) * | 2013-11-14 | 2015-05-21 | (주)정원기술 | 레이저 칩 본딩기의 칩 공급장치 |
| KR102196105B1 (ko) | 2016-02-01 | 2020-12-30 | 시바우라 메카트로닉스 가부시끼가이샤 | 전자 부품의 실장 장치와 실장 방법, 및 패키지 부품의 제조 방법 |
| JP6942829B2 (ja) * | 2016-03-29 | 2021-09-29 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| JP6717630B2 (ja) * | 2016-03-29 | 2020-07-01 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
| WO2017194286A1 (en) * | 2016-05-13 | 2017-11-16 | Asml Netherlands B.V. | Multiple miniature pick up elements for a component stacking and/or pick-and-place process |
| CN107887295B (zh) * | 2016-09-30 | 2019-07-23 | 上海微电子装备（集团）股份有限公司 | 一种芯片键合装置及键合方法 |
| KR101939343B1 (ko) * | 2017-02-28 | 2019-01-16 | (주) 예스티 | 반도체 제조 장치 |
| KR101939347B1 (ko) * | 2017-02-28 | 2019-01-16 | (주) 예스티 | 반도체 제조 장치 |
| KR101944355B1 (ko) * | 2017-02-28 | 2019-01-31 | (주) 예스티 | 반도체 제조 장치 |
| JP6781677B2 (ja) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置と実装方法、およびパッケージ部品の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02207595A (ja) * | 1989-02-07 | 1990-08-17 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
| JP2808824B2 (ja) * | 1990-05-17 | 1998-10-08 | 松下電器産業株式会社 | 電子部品実装装置 |
| WO1997032460A1 (de) * | 1996-02-29 | 1997-09-04 | Alphasem Ag | Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen |
| JP3747054B2 (ja) * | 2001-12-04 | 2006-02-22 | Ｔｏｗａ株式会社 | ボンディング装置及びボンディング方法 |
| SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
-
2006
- 2006-12-12 CN CN2006800478727A patent/CN101341587B/zh not_active Expired - Fee Related
- 2006-12-12 KR KR1020087012013A patent/KR101014293B1/ko active IP Right Grant
- 2006-12-12 WO PCT/JP2006/324772 patent/WO2007072714A1/ja active Application Filing
- 2006-12-12 JP JP2007551046A patent/JP4713596B2/ja active Active
- 2006-12-20 TW TW095147893A patent/TW200729372A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101014293B1 (ko) | 2011-02-16 |
| TWI328265B (ko) | 2010-08-01 |
| WO2007072714A1 (ja) | 2007-06-28 |
| CN101341587B (zh) | 2010-10-27 |
| CN101341587A (zh) | 2009-01-07 |
| KR20080068876A (ko) | 2008-07-24 |
| JP4713596B2 (ja) | 2011-06-29 |
| JPWO2007072714A1 (ja) | 2009-05-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |