WO2008111348A1 - シート貼付装置及び貼付方法 - Google Patents

シート貼付装置及び貼付方法 Download PDF

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Publication number
WO2008111348A1
WO2008111348A1 PCT/JP2008/052222 JP2008052222W WO2008111348A1 WO 2008111348 A1 WO2008111348 A1 WO 2008111348A1 JP 2008052222 W JP2008052222 W JP 2008052222W WO 2008111348 A1 WO2008111348 A1 WO 2008111348A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
sheet
mounting device
mounting
positioning
Prior art date
Application number
PCT/JP2008/052222
Other languages
English (en)
French (fr)
Inventor
Takahisa Yoshioka
Yoshiaki Sugishita
Original Assignee
Lintec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corporation filed Critical Lintec Corporation
Publication of WO2008111348A1 publication Critical patent/WO2008111348A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　半導体ウエハ（Ｗ）及びリングフレーム（ＲＦ）が載置されるテーブル（１５）を含む載置手段（１１）と、これら半導体ウエハ（Ｗ）及びリングフレーム（ＲＦ）に接着性のシート（Ｓ）を貼付する貼付手段とを備えたシート貼付装置が構成されている。載置手段（１１）は、センサと相互に作用してウエハ（Ｗ）の位置決めを行うアライメントユニット（２１）を備えて構成されている。ウエハ（Ｗ）は、テーブル（１５）に移載された状態で位置決め処理を受けることとなり、前工程における位置決めが不要となる。
PCT/JP2008/052222 2007-03-14 2008-02-12 シート貼付装置及び貼付方法 WO2008111348A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007064664A JP4971841B2 (ja) 2007-03-14 2007-03-14 シート貼付装置及び貼付方法
JP2007-064664 2007-03-14

Publications (1)

Publication Number Publication Date
WO2008111348A1 true WO2008111348A1 (ja) 2008-09-18

Family

ID=39759291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052222 WO2008111348A1 (ja) 2007-03-14 2008-02-12 シート貼付装置及び貼付方法

Country Status (3)

Country Link
JP (1) JP4971841B2 (ja)
TW (1) TW200847319A (ja)
WO (1) WO2008111348A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006300B2 (ja) * 2008-10-23 2012-08-22 リンテック株式会社 マウント装置及びマウント方法
JP5159649B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5159650B2 (ja) * 2009-01-16 2013-03-06 リンテック株式会社 シート貼付装置および貼付方法
JP5586093B2 (ja) * 2010-09-09 2014-09-10 リンテック株式会社 シート貼付装置及び貼付方法
JP5721454B2 (ja) * 2011-01-28 2015-05-20 リンテック株式会社 板状部材の支持装置
JP5763394B2 (ja) * 2011-04-14 2015-08-12 リンテック株式会社 転写装置および転写方法
JP2016009812A (ja) * 2014-06-26 2016-01-18 株式会社ディスコ テープ貼着用保持機構及びテープ貼着方法
JP7396849B2 (ja) * 2019-10-16 2023-12-12 株式会社ディスコ テープ貼着装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP2006352054A (ja) * 2005-05-19 2006-12-28 Lintec Corp 貼付装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP2006352054A (ja) * 2005-05-19 2006-12-28 Lintec Corp 貼付装置

Also Published As

Publication number Publication date
JP4971841B2 (ja) 2012-07-11
JP2008227224A (ja) 2008-09-25
TW200847319A (en) 2008-12-01

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