TWI323343B - - Google Patents

Download PDF

Info

Publication number
TWI323343B
TWI323343B TW094117312A TW94117312A TWI323343B TW I323343 B TWI323343 B TW I323343B TW 094117312 A TW094117312 A TW 094117312A TW 94117312 A TW94117312 A TW 94117312A TW I323343 B TWI323343 B TW I323343B
Authority
TW
Taiwan
Prior art keywords
workpiece
strip
shaped workpiece
pattern
tab tape
Prior art date
Application number
TW094117312A
Other languages
English (en)
Chinese (zh)
Other versions
TW200604516A (en
Inventor
Atsushi Mito
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200604516A publication Critical patent/TW200604516A/zh
Application granted granted Critical
Publication of TWI323343B publication Critical patent/TWI323343B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0475—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure
    • B01L2400/0487—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure fluid pressure, pneumatics
    • B01L2400/049—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure fluid pressure, pneumatics vacuum
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G01N21/5907—Densitometers
    • G01N2021/5957—Densitometers using an image detector type detector, e.g. CCD

Landscapes

  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW094117312A 2004-07-05 2005-05-26 Image inspecting device TW200604516A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004197595A JP4479383B2 (ja) 2004-07-05 2004-07-05 パターン検査装置

Publications (2)

Publication Number Publication Date
TW200604516A TW200604516A (en) 2006-02-01
TWI323343B true TWI323343B (ja) 2010-04-11

Family

ID=35792062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117312A TW200604516A (en) 2004-07-05 2005-05-26 Image inspecting device

Country Status (4)

Country Link
JP (1) JP4479383B2 (ja)
KR (1) KR20060048549A (ja)
CN (1) CN100516847C (ja)
TW (1) TW200604516A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5117243B2 (ja) * 2008-03-27 2013-01-16 株式会社オーク製作所 露光装置
JP5553532B2 (ja) * 2009-06-04 2014-07-16 パナソニック株式会社 光学検査装置
JP6061182B2 (ja) * 2012-09-07 2017-01-18 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6142486B2 (ja) * 2012-09-07 2017-06-07 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6146638B2 (ja) * 2012-11-05 2017-06-14 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6217070B2 (ja) * 2012-11-05 2017-10-25 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6007740B2 (ja) * 2012-11-13 2016-10-12 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6016105B2 (ja) * 2012-11-20 2016-10-26 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
JP6101481B2 (ja) * 2012-12-26 2017-03-22 東レエンジニアリング株式会社 積層構造を有するワークの内部検査装置
JP6399119B2 (ja) * 2017-02-14 2018-10-03 大日本印刷株式会社 金属薄板の寸法測定装置及び金属薄板の寸法測定方法
WO2020194595A1 (ja) * 2019-03-27 2020-10-01 シャープ株式会社 フレキシブル表示基板の接続部の検査装置及びフレキシブル表示装置の製造方法
CN115855944B (zh) * 2023-02-03 2023-05-05 郯城永耀电子科技有限公司 一种fpc连接器多个弹片自动检查装置

Also Published As

Publication number Publication date
KR20060048549A (ko) 2006-05-18
CN1721842A (zh) 2006-01-18
CN100516847C (zh) 2009-07-22
JP2006017642A (ja) 2006-01-19
TW200604516A (en) 2006-02-01
JP4479383B2 (ja) 2010-06-09

Similar Documents

Publication Publication Date Title
TWI323343B (ja)
TWI591444B (zh) A photomask, a photomask group, an exposure device, and an exposure method
JP4866782B2 (ja) 基板クランプ機構及び描画システム
KR20140066551A (ko) 릴-투-릴 검사장치 및 릴-투-릴 검사방법
KR20080034518A (ko) 공작물 반송 장치, 그것을 구비한 화상 형성 장치 및공작물 반송 방법
KR200341202Y1 (ko) 산업용 인쇄회로기판 자동검사 시스템
JP2009088375A (ja) テープキャリアの保持装置
TW201213931A (en) Repair apparatus
JP2008098386A (ja) プリント基板上への所定作業方法及び所定作業装置
KR102531997B1 (ko) 노광 장치
JP2010129844A (ja) パターン自動検査装置
JP4942188B2 (ja) 基板クランプ機構及び描画システム
KR100605451B1 (ko) 패턴 검사 장치
WO2020202900A1 (ja) 露光装置および露光方法
JP3716413B2 (ja) 電子部品実装用フィルムキャリアテープの検査装置および検査方法
JP2000227401A (ja) テープキャリア欠陥検査装置及びテープキャリア欠陥検査装置におけるテープキャリアの搬送方法
JP7386754B2 (ja) 部品実装機
KR20140032659A (ko) 기판 검사 장치 및 기판 검사 방법
JP5077655B2 (ja) 近接スキャン露光装置及びエアパッド
JPH10161320A (ja) 露光装置
KR102215123B1 (ko) 기판 검사 장치 및 기판 검사 방법
JP5031675B2 (ja) 基板搬送装置及び電子部品装着装置
JPH06318800A (ja) 部品装着装置
KR100653571B1 (ko) 필름을 인덱스하고 절단하는 장치 및 방법
JP2008304537A (ja) 露光装置及び露光方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees