TWI307917B - Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication - Google Patents

Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication Download PDF

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Publication number
TWI307917B
TWI307917B TW092120947A TW92120947A TWI307917B TW I307917 B TWI307917 B TW I307917B TW 092120947 A TW092120947 A TW 092120947A TW 92120947 A TW92120947 A TW 92120947A TW I307917 B TWI307917 B TW I307917B
Authority
TW
Taiwan
Prior art keywords
layer
amorphous carbon
hard mask
mask
amorphous
Prior art date
Application number
TW092120947A
Other languages
English (en)
Chinese (zh)
Other versions
TW200405414A (en
Inventor
J Bonser Douglas
V Plat Marina
Yuh Yang Chih
A Bell Scott
Darin Chan
A Fisher Philip
F Lyons Christopher
S Chang Mark
Gao Pei-Yuan
I Wright Marilyn
Lu You
Dakshina-Murthy Srikanteswara
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of TW200405414A publication Critical patent/TW200405414A/zh
Application granted granted Critical
Publication of TWI307917B publication Critical patent/TWI307917B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/405—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their composition, e.g. multilayer masks

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
TW092120947A 2002-07-31 2003-07-31 Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication TWI307917B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40045302P 2002-07-31 2002-07-31
US10/334,392 US6764949B2 (en) 2002-07-31 2002-12-30 Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication

Publications (2)

Publication Number Publication Date
TW200405414A TW200405414A (en) 2004-04-01
TWI307917B true TWI307917B (en) 2009-03-21

Family

ID=31190859

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092120947A TWI307917B (en) 2002-07-31 2003-07-31 Method for reducing pattern deformation and photoresist poisoning in semiconductor device fabrication

Country Status (9)

Country Link
US (1) US6764949B2 (https=)
EP (1) EP1576657B1 (https=)
JP (1) JP4599578B2 (https=)
KR (1) KR101001346B1 (https=)
CN (1) CN100341114C (https=)
AU (1) AU2003254254A1 (https=)
DE (1) DE60330998D1 (https=)
TW (1) TWI307917B (https=)
WO (1) WO2004012246A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419201B (zh) * 2009-04-27 2013-12-11 Macronix Int Co Ltd 圖案化的方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419201B (zh) * 2009-04-27 2013-12-11 Macronix Int Co Ltd 圖案化的方法

Also Published As

Publication number Publication date
JP2005535119A (ja) 2005-11-17
WO2004012246A2 (en) 2004-02-05
CN1672243A (zh) 2005-09-21
EP1576657A2 (en) 2005-09-21
TW200405414A (en) 2004-04-01
WO2004012246A3 (en) 2004-05-13
JP4599578B2 (ja) 2010-12-15
DE60330998D1 (de) 2010-03-04
CN100341114C (zh) 2007-10-03
US20040023475A1 (en) 2004-02-05
EP1576657B1 (en) 2010-01-13
AU2003254254A1 (en) 2004-02-16
KR20050019905A (ko) 2005-03-03
KR101001346B1 (ko) 2010-12-14
US6764949B2 (en) 2004-07-20

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