TWI306184B - Thinner composition for removing photosensitive resin - Google Patents

Thinner composition for removing photosensitive resin Download PDF

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Publication number
TWI306184B
TWI306184B TW093119118A TW93119118A TWI306184B TW I306184 B TWI306184 B TW I306184B TW 093119118 A TW093119118 A TW 093119118A TW 93119118 A TW93119118 A TW 93119118A TW I306184 B TWI306184 B TW I306184B
Authority
TW
Taiwan
Prior art keywords
composition
parts
ketone
weight
group
Prior art date
Application number
TW093119118A
Other languages
English (en)
Chinese (zh)
Other versions
TW200506551A (en
Inventor
Suk-Il Yoon
Woo-Sik Jun
Hee-Jin Park
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200506551A publication Critical patent/TW200506551A/zh
Application granted granted Critical
Publication of TWI306184B publication Critical patent/TWI306184B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/044—Hydroxides or bases
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Materials For Photolithography (AREA)
TW093119118A 2003-08-01 2004-06-29 Thinner composition for removing photosensitive resin TWI306184B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030053380A KR101016724B1 (ko) 2003-08-01 2003-08-01 감광성 수지 조성물을 제거하기 위한 씬너 조성물

Publications (2)

Publication Number Publication Date
TW200506551A TW200506551A (en) 2005-02-16
TWI306184B true TWI306184B (en) 2009-02-11

Family

ID=34374110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119118A TWI306184B (en) 2003-08-01 2004-06-29 Thinner composition for removing photosensitive resin

Country Status (4)

Country Link
JP (1) JP4494897B2 (ko)
KR (1) KR101016724B1 (ko)
CN (1) CN100595680C (ko)
TW (1) TWI306184B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4753641B2 (ja) * 2005-07-01 2011-08-24 株式会社Ｓｏｋｕｄｏ 基板処理システム
US7766565B2 (en) 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
KR101328097B1 (ko) * 2006-01-11 2013-11-13 주식회사 동진쎄미켐 티에프티 엘시디용 칼라 레지스트 박리액 조성물
WO2023092278A1 (zh) * 2021-11-23 2023-06-01 才将科技股份有限公司 一种清洗粘结层的组合物及其应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52100235A (en) * 1976-02-19 1977-08-23 Sony Corp Stripping solution of photosolubilizable light sensitive resin
JPS61172147A (ja) * 1985-01-25 1986-08-02 Konishiroku Photo Ind Co Ltd 平版印刷版の修正剤
JPH02981A (ja) * 1988-02-25 1990-01-05 Hoya Corp 感光性樹脂用剥離液及びこれを用いる感光性樹脂の剥離方法
JPH05181289A (ja) * 1992-01-06 1993-07-23 Fuji Xerox Co Ltd 有機感光体の有機被膜除去方法および有機感光体用再生基体
US6326130B1 (en) * 1993-10-07 2001-12-04 Mallinckrodt Baker, Inc. Photoresist strippers containing reducing agents to reduce metal corrosion
JP3386264B2 (ja) * 1994-12-15 2003-03-17 昭和電工株式会社 ポリイミド前駆体洗浄用バックリンス液
JPH08286394A (ja) * 1995-04-11 1996-11-01 Toray Eng Co Ltd 感光塗膜の除去方法
JPH10183191A (ja) * 1996-02-16 1998-07-14 Nitto Chem Ind Co Ltd 工業装置に付着した残存物の洗浄方法
JP3978255B2 (ja) * 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
JPH11218933A (ja) * 1998-01-30 1999-08-10 Fuji Film Olin Kk レジスト洗浄除去用溶剤および電子部品製造用基材の製造方法
KR100335011B1 (ko) * 1999-08-19 2002-05-02 주식회사 동진쎄미켐 레지스트 제거용 조성물
KR100378552B1 (ko) 2000-01-14 2003-03-29 주식회사 동진쎄미켐 레지스트 리무버 조성물
JP2001244258A (ja) * 2000-02-29 2001-09-07 Sumitomo Bakelite Co Ltd 半導体用有機絶縁膜形成方法

Also Published As

Publication number Publication date
TW200506551A (en) 2005-02-16
JP2005055886A (ja) 2005-03-03
KR101016724B1 (ko) 2011-02-25
JP4494897B2 (ja) 2010-06-30
CN100595680C (zh) 2010-03-24
CN1580959A (zh) 2005-02-16
KR20050014955A (ko) 2005-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees