TWI305801B - - Google Patents
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- TWI305801B TWI305801B TW093123986A TW93123986A TWI305801B TW I305801 B TWI305801 B TW I305801B TW 093123986 A TW093123986 A TW 093123986A TW 93123986 A TW93123986 A TW 93123986A TW I305801 B TWI305801 B TW I305801B
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- TW
- Taiwan
- Prior art keywords
- mass
- compound
- components
- resin composition
- component
- Prior art date
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- -1 compound compound Chemical class 0.000 claims description 30
- 239000011342 resin composition Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 23
- 239000000565 sealant Substances 0.000 claims description 21
- 229910052731 fluorine Inorganic materials 0.000 claims description 17
- 239000011737 fluorine Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 11
- 125000001153 fluoro group Chemical group F* 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 150000002894 organic compounds Chemical class 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000003505 polymerization initiator Substances 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 3
- 125000003566 oxetanyl group Chemical group 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 238000005516 engineering process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 235000019000 fluorine Nutrition 0.000 description 12
- 239000013589 supplement Substances 0.000 description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 125000000217 alkyl group Chemical group 0.000 description 7
- 230000035699 permeability Effects 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 125000005577 anthracene group Chemical group 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 125000004434 sulfur atom Chemical group 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- LCIOIBLOWNIOOF-UHFFFAOYSA-N (2,3-difluorophenoxy)boronic acid Chemical compound OB(O)OC1=CC=CC(F)=C1F LCIOIBLOWNIOOF-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- PLDLPVSQYMQDBL-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethoxy)-2,2-bis(oxiran-2-ylmethoxymethyl)propoxy]methyl]oxirane Chemical compound C1OC1COCC(COCC1OC1)(COCC1OC1)COCC1CO1 PLDLPVSQYMQDBL-UHFFFAOYSA-N 0.000 description 1
- IEMNEAVSEGLTHB-UHFFFAOYSA-N 2-[[4-[1,1,1,3,3,3-hexafluoro-2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C(F)(F)F)(C(F)(F)F)C(C=C1)=CC=C1OCC1CO1 IEMNEAVSEGLTHB-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- HKXNZTGUCGYAOY-UHFFFAOYSA-N 3-ethyl-3-(3-ethyloxetan-3-yl)oxyoxetane Chemical compound C1OCC1(CC)OC1(CC)COC1 HKXNZTGUCGYAOY-UHFFFAOYSA-N 0.000 description 1
- QGXMKEGFTNLFQQ-UHFFFAOYSA-N 3-ethyloxetan-3-ol Chemical compound CCC1(O)COC1 QGXMKEGFTNLFQQ-UHFFFAOYSA-N 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical group C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- FRNOBIWVVYBRQV-UHFFFAOYSA-N 5-(oxiran-2-ylmethoxy)naphthalen-2-ol Chemical compound C=1C=CC2=CC(O)=CC=C2C=1OCC1CO1 FRNOBIWVVYBRQV-UHFFFAOYSA-N 0.000 description 1
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- LRAOLCGBRBCBJT-UHFFFAOYSA-N C(C)(C)(C)C1=CC=C(C=C1)IC1=CC=C(C=C1)C(C)(C)C Chemical compound C(C)(C)(C)C1=CC=C(C=C1)IC1=CC=C(C=C1)C(C)(C)C LRAOLCGBRBCBJT-UHFFFAOYSA-N 0.000 description 1
- YJSMVGDOPSWOEM-UHFFFAOYSA-N C(C1CO1)OCCCC(CCCCCC(OC)(OC)OC)CCC Chemical compound C(C1CO1)OCCCC(CCCCCC(OC)(OC)OC)CCC YJSMVGDOPSWOEM-UHFFFAOYSA-N 0.000 description 1
- GJIQOKMWGBIDEL-UHFFFAOYSA-N CCCC(=O)OC1=CC=CC2=C1CC3=CC=CC=C32 Chemical compound CCCC(=O)OC1=CC=CC2=C1CC3=CC=CC=C32 GJIQOKMWGBIDEL-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- YTNZABLXXHNXQZ-UHFFFAOYSA-N cyclobutylmethylhydrazine Chemical compound NNCC1CCC1 YTNZABLXXHNXQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000006200 ethylation reaction Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Substances OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10706—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being photo-polymerized
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
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Description
1305801 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種耐透濕性、接著性優異,且生產性良 好之光硬化型樹脂組成物,以及使用該光硬化型樹脂之平 板顯示器用密封劑。 【先前技術】 近年來,於電子、電器業界中,進行著利用各種顯示元 件之平板顯示器的開發、製造。該等顯示器大多係於玻璃 或塑膠等單元(c e 1 1 )中密封顯示元件而製成者。作為其代 表,可列舉液晶(L C )顯示器、電致發光(E L )顯示器等。其 中,EL顯示器於高亮度、高效率、高速應答性等方面具有 優勢,作為次世代的平板顯示器而受到注目。元件方面有 無機E L元件、有機E L元件,無機E L元件已於時鐘之背光 源等中實用化,但其全彩(f u 1 1 c ο 1 〇 r )化則仍有技術方面的 問題。有機EL元件於高亮度、高效率、高速應答性、多色 化方面均較無機EL元件更為優異,但其耐熱性低,耐熱溫 度約為8 0 ~ 1 2 0 °C左右。因此,於有機E L顯示器之密封中, 具有熱硬化型環氧樹脂無法充分地加熱硬化之問題。 為解決該等問題,提案有可低溫快速硬化之光硬化型密 封劑。將光硬化型密封劑大致區分,有光自由基硬化型密 封劑與光陽離子硬化型密封劑。光自由基硬化型密封劑具 有可使用多樣的丙稀酸酯單體、寡聚物之優點,但於硬化 時之體積收縮率高,且具有接著力低之缺點。為了將體積 收縮率抑制在低數值,必須減少密封劑每單位重量之官能 5
312XP/發明說明書(補件)/93-11/93123986 1305801 基數,因而對各種物性加諸限制。另一方面,光陽離子硬 化型密封劑係利用開環聚合,相較於光自由基硬化型密封 劑,其硬化收縮率較低,且接著力較優異,但若考慮實用 性,則必須進一步予以改良。於製造平板顯示器時,為了 提高生產效率,係於大的玻璃基板内形成數個面板,並在 組裝後設置切開玻璃基板之步驟。於此操作時,係對玻璃 基板施加大的應力,且在密封劑之接著力不充分之情況有 發生剝離之問題。又,對有機EL顯示器之密封劑係要求耐 透濕性,但亦必須防止水分自接著界面滲入面板内,因而 要求對使用於有機EL顯示器之各種構件的界面密著性。 (專利文獻1 )日本專利特開2 0 0 1 - 1 3 9 9 3 3號公報 (專利文獻2 )日本專利特開2 0 0 0 - 7 2 8 5 3號公報 (專利文獻3 )曰本專利特開平0 9 - 2 4 1 6 0 3號公報 【發明内容】 (發明所欲解決之問題) 本發明之目的在於提供一種光硬化型樹脂組成物,其作 為使用於平板顯示器之密封劑的耐透濕性良好,且接著性 優異,本發明並提供使用該光硬化型樹脂組成物之平板顯 示器用密封劑。 (解決問題之手段) 本發明人等為達成上述目的,經過重複深入研究,結果 發現一種光硬化型樹脂組成物,其含有光陽離子聚合引發 劑(A )、陽離子聚合性化合物(B )、環狀聚醚化合物(C )、及 其他有機化合物(D ),相對於(B )、( C )與(D )之總和,(B ) 6
312XP/發明說明書(補件)/93-11/93123986 1305801 為1 . 0〜9 9 · 9質量%,( C )為0 · 0 ~ 1 0 . 0質量%,相對於(B )、 (C )與(D )之總和,含氟之有機化合物之氟原子總和(F )為 0 . 0〜4 0 . 0質量%,且(B )成分之至少1 / 1 0 0 0質量比為含氧 雜環丁炫基(oxetanyl)之化合物,(C)與(F)不同時為0·0 質量%。又,本發明提供一種光硬化型樹脂組成物,將(A )、 (B )、( C )、( D )成分之總和定為1 0 0質量份時,其進一步含 有0 ~ 2 5 0質量份之無機填充材。此外,(B )及/或(D )成分中 亦可含有含氟之偶合劑。又,以相對於(B )、( C )與(D )之總 和,含氟之有機化合物之氟原子總和(F )為0 · 1〜4 0 . 0質量% 之光硬化型樹脂組成物為佳。此外,本發明亦提供一種含 有上述光硬化型樹脂組成物之平板顯示器用密封劑,以及 使用該密封劑所得之平板顯示器。 (發明效果) 根據本發明,可得到作為使用於平板顯示器之密封劑的 耐透濕性良好,且接著性優異之光硬化型樹脂組成物以及 使用其之平板顯示器用密封劑。 【實施方式】 以下,詳細說明本發明。 [光陽離子聚合引發劑(A )] 本發明之光陽離子引發劑(A )為經由光可引發陽離子聚 合之化合物即可,並無特別的限制,不論何種均可使用。 作為光陽離子引發劑的較佳例,可列舉具有下述[化1 ] 所示構造之鏽鹽。該鏽鹽係進行光反應而放出路易士酸之 化合物。 312XP/發明說明書(補件)/93-11 /9312398(5 1305801 [化 1] [R5aR6bR7cR8dW]m+[MXn+m]m- (式中,陽離子為鏽離子,W為S、Se'Te'P、As'Sb、Bi、 0、I、Br、Cl或ΝξΝ,R5、R6、R7及R8為相同或相異之 有機基,a、b、c及d分別為0~3之整數(a + b + c + d)相等 於((W之價數)+ m)。Μ為構成鹵化錯合體[MXn + m]之中心原 子之金屬或類金屬’例如為B、P、As、Sb' Fe、Sn、Bi、 A 1 ' C a ' In' Ti、Zn、Sc、V、Cr、 Mn、Co 等。X 為例如 F、 Cl、Br等之鹵原子,m為鹵化物錯合體離子的正電荷,η 為Μ之電子價。) 作為一般式[化1 ]中鑌離子之具體例,可列舉:二苯基 碘鎬、4 -曱氧基二苯基碘鐳、雙(4 -曱基苯基)碘鑌、雙(4-第三丁基苯基)碘鏽、雙(十二基苯基)碘鑌、甲苯基異丙苯 基碘鏽、三苯基鈒、二苯基-4 -噻吩氧基笨基锍、雙[4 -(二 苯基礙基)-苯基]硫化物、雙[4-(二(4-(2 -經乙基)苯基) 石風基)-苯基]硫化物、D 5-2,4-(環戊二稀基)[1,2,3,4,5,6-?? -(曱基乙基)苯]-鐵(1 + )等。 作為一般式[化1 ]中陰離子之具體例,可舉出四氟硼酸 鹽、六氟J填酸鹽、六氟錄酸鹽、六氟珅酸鹽、六氯録酸鹽 等。又,作為一般式[化1 ]中之陰離子,亦可取代鹵化錯 合體[MXn + m],改為過氯酸離子、三氟曱烷磺酸離子、甲苯 磺酸離子、三硝基甲苯磺酸離子等。此外,作為一般式[化 1]中之陰離子,亦可取代鹵化錯合體[MXn + m],改為芳香族 陰離子。具體例可列舉:四(氟苯基)硼酸鹽、四(二氟苯基) 硼酸鹽、四(三氟苯基)硼酸鹽、四(四氟苯基)硼酸鹽、四(五 8 3 ΠΧΡ/發明說明書(補件)/93-11/93123986 1305801 1 , 6 -己烷二醇二縮水甘油醚、環己烷二醇二縮水甘油 環己烷二曱醇二縮水甘油醚、二環戊二烯二醇二縮水 醚、1 , 6 -萘二醇二縮水甘油醚、雙酚A二縮水甘油醚 驗F二縮水甘油醚 '氫化雙盼A二縮水甘油醚、氫化 F二縮水甘油醚等之2官能性環氧化合物;三羥曱基 三縮水甘油酯、季戊四醇四縮水甘油醚、酚-清漆型環 合物、曱酚清漆型環氧化合物等之多官能環氧化合物 具有氧雜環丁烷基之化合物可列舉:3 -乙基-3羥基 氧雜環丁烷、(3 -乙基-3-氧雜環丁烷基曱氧基)曱基3 [1-(3-乙基-3-氧雜環丁烧基曱氧基)乙基]苯基鍵、2-己基(3 -乙基-3-氧雜環丁烷基曱基)醚、二環戊二烯( 基-3-氧雜環丁烷基甲基)醚、2 -羥基乙基(3 -乙基- 3-環丁烷基曱基)醚等之1官能性氧雜環丁烷化合物;I 乙基-3-曱基氧雜環丁烷)醚、1,4 -雙[(3 -乙基3 -氧雜 烷基曱氧基)曱基]苯、1,3 -雙[(3 -乙基-3 -氧雜環丁烷 氧基)曱基]苯、二環戊烯基雙(3-乙基-3-氧雜環丁烷 基)醚、三乙二醇雙(3 -乙基-3-氧雜環丁烷基曱基)醚 酚A雙(3 -乙基-3-氧雜環丁烷基曱基)醚、雙酚F雙( 基-3 -氧雜環丁烷基曱基)醚等之2官能性氧雜環丁烷 物;酚-清漆樹脂之(3 -乙基-3 -氧雜環丁烷基曱基)醚 物、曱酚-清漆樹脂之(3 -乙基-3 -氧雜環丁烷基曱基) 物等之多官能性氧雜環丁烷化合物。 脂環式環氧化合物亦可舉出下述式[化2 ]、[化3 ]、 4 ]、[化5 ]所示之化合物等。 3 UXP/發明說明書(補件)/93-l 1/W123986 喊 、 甘油 、雙 雙酚 丙烧 氧化 〇 曱基 良、 乙基 3 -乙 氧雜 I (3-環丁 基甲 基曱 、雙 3 -乙 化合 化 驗化 ‘[化 10 1305801 [化2 ]
[化2 ]中,R,為氧原子、硫原子,或亞曱基、伸乙基、伸 丙基、伸丁基等線狀或分支狀之碳原子數1 ~ 2 0之伸烷基, 聚(氧化伸乙)基、聚(氧化伸丙)基等線狀或分支狀之碳原 子數1~120之聚(氧化伸烷)基,伸丙烯基、曱基伸丙烯基、 伸丁烯基等線狀或分支狀之不飽和烴基,羰基,含羰基之 伸烷基,分子鏈中含有胺甲醯基之伸烷基。 [化3 ]
312XP/發明說明書(補件)/93-11/93123986 11 1305801 [化5 ]
[化5]中,1^為氫原子、氟原子,曱基、乙基、丙基、丁 基、戊基、己基等之碳原子數1~6個之烷基,三氟曱基、 全氟曱基、全氟乙基、全氟丙基等之碳原子數1~6個之氟 化燒基,苯基、萘基等碳數6~18之芳基、°夫喃基或°塞吩基。 R!可為相同或互異。R2為氧原子、硫原子,或亞曱基、伸 乙基、伸丙基、伸丁基等線狀或分支狀之碳原子數1〜2 0 之伸烷基,聚(氧化伸乙)基、聚(氧化伸丙)基等線狀或分 支狀之碳原子數1 ~ 1 2 0之聚(氧化伸烷)基,伸丙烯基、曱 基伸丙烯基、伸丁烯基等線狀或分支狀之不飽和烴基,羰 基,含羰基之伸烷基,分子鏈中含有胺曱醯基之伸烷基。 又,亦可使用該等[化2 ]〜[化5 ]化合物之碳-氫鍵結的氫原 子之一部份或全部被氟取代的化合物。更具體而言,可舉 出以6個氟取代雙酚A縮水甘油醚中之曱基的氫之化合物 (雙酚A F二縮水甘油醚)、以6個氟取代雙酚A之曱基的氫 之化合物與環氧化合物之反應物等。 此外,(B )成分亦可為含有縮水甘油基等具有陽離子聚合 性之官能基的後述之偶合劑。例如,可舉出7 -縮水甘油氧 基丙基三曱氧基矽烷等。 12
312XP/發明說明書(補件)/93-11/93 U3986 1305801 酸酯系聚合物粒子、乙烯系聚合物粒子、丙烯系聚合物粒 子等。該等可單獨使用1種,亦可組合多種而使用。 〈改質劑〉 作為改質劑,可列舉如聚合引發助劑、防老化劑、均染 劑、濕潤性改良劑、界面活性劑、可塑劑等。該等可單獨 使用1種,亦可組合多種而使用。 〈安定劑〉 作為安定劑,可列舉如紫外線吸收劑、防腐劑、抗菌劑 等。該等可單獨使用1種,亦可組合多種而使用。亦可使 用該等成分之碳-氫鍵結的氫之一部份或全部被氟取代之 化合物。 本案發明之樹脂組成物中,於成分(B )、( C )及(D )中含有 含氟之有機化合物之情況,在硬化後,可使水份穿透之成 分的疏水性提昇,而可提昇耐透濕性。又,藉由於(B )及/ 或(D )成分中使用含氟之有機化合物成分,可提升接著強 度。該含氟量之總和(F ),自接著強度之觀點而言,以氟原 子於成分(B)、(C)及(D)之質量中佔0~40質量%之含有量為 佳。 本案發明之樹脂組成物之特徵係耐透濕性優異,且具有 高接著強度。為得到該效果,(C )成分之含有率及(F )成分 之含有率不可同時為〇.〇質量%。又,在成分(A)、(B)、(C) 及(D )中含有含氟之有機化合物之情況,該含氟量之總合 (F ),係以氟原子於成分(A )、( B )、( C )及(D )之質量中佔 0 . 1 ~ 4 0質量%之含有量為佳。 16 312XP/發明說明書(補件)/93-11/93123986 1305801 [微粒子無機填充材] 本案發明之樹脂組成物含有微粒子無機填充材為佳。微 粒子無機填充材係指一次粒子之平均粒徑為〇 . 0 0 5〜1 0 μ m 之無機填充材。具體而言,可列舉二氧化矽、滑石、礬土、 雲母、碳酸鈣等。微粒子無機填充材不論表面未處理者或 經表面處理者均可使用。作為經表面處理之微粒子無機填 充材,可列舉如曱氧基化、三甲基矽基化、辛基矽基化、 或經矽酮油表面處理之微粒子無機填充材等。該等成分可 單獨使用1種或組合2種以上使用。 微粒子無機填充材之使用量,相對於上述(A )、( B )、( C )、 (D )成分之總和1 0 0質量份,係含有0 ~ 2 5 0質量份,可藉此 得到耐透濕性、接著力、賦予搖變性等效果。 [樹脂組成物之調整] 本發明之光硬化型樹脂組成物係以將各組成物均勻地混 合之方式調製。黏度根據樹脂之調配比或其他成分之添加 而調整即可。又,黏度較高之情況,以使用3輥等之一般 方法混練即可。 [密封方法] 將密封劑塗佈於顯示器基材之方法,只要為可均勻地塗 佈密封劑之塗佈方法便可,並無特別的限制。例如,可根 據使用網版印刷或分配器(d i s p e n s e r )而塗佈之方法等周 知的方法實施。塗佈密封劑後,貼合顯示器基材,照射光, 使密封劑硬化。作為此處可使用之光源,只要為可使其於 指定的作業時間内硬化者,任何方法均可。一般而言,係 312XP/發明說明書(補件)/93-11/93123986 17 1305801 使用可照射紫外光、可見光之範圍的光之光源。 言,可列舉低壓水銀燈、高壓水銀燈、氣燈、金 等。又,一般而言,在照射光量過少之情況,照 於樹脂組成物之未硬化部分不殘留之範圍或不發 良之範圍内適當選定,一般為500~9000mJ/cm2。 無特別的上限,但過多時會浪費不必要的能量並 降低,故較不佳。 (實施例) 以下說明本發明之實施例,但本發明並不限定 施例。 〈測量法〉 針對所得之樹脂組成物及硬化物,進行以下之 (黏度) 於2 5 °C下,以E型黏度計(東機產業製 R C - 5 0 脂組成物之黏度。 (薄膜透濕量) 以J I S Z 0 2 0 8為基準,於4 0 °C 9 0 % R Η之條件下 硬化之樹脂組成物薄膜(厚度1 0 0 // m )之透濕量。 (接著強度) 接著強度係對於1片玻璃板,組合玻璃板並以 物(厚度2 0 // m )夾住,以光照射使之接著。以拉 2 m m / m i η測量將該等2片基材剝離時之接著強度 (煮沸後之接著強度) 煮沸後之接著強度係將對於1片玻璃板,組合 312ΧΡ/發明說明書(補件)/93-11/93123986 更具體而 屬齒素燈 射光量可 生接著不 照射量並 使生產性 於該等實 評估。 0 )測量樹 測量經光 樹脂組成 伸速度 〇 玻璃板並 18 1305801 [實施例2 ~ 5,比較例1〜3 ] 分之外,其 組成物。針 示於表1。 除了以表1所示之量使用表1所示組成之成 餘均同實施例 1,以表1所示之配方調製樹脂 對表1所示之樹脂組成物進行各種評估。結果 20 312XP/發明說明書(補件)/93-11/93123986 1305801 (產業上可利用性) 由於可得到對於各種被著體之良好接著強度,故可使用 於電子材料領域等各種領域。 22 312ΧΡ/發明說明書(補件)/93-11/93123986
Claims (1)
1305801 -——~~—~~~—.1 彳抑々月θ β終(f)正替技页j JUL 〇 7 2008 十、申請專利範圍:匕~~----------------] 替换本 1. 一種光硬化型樹脂組成物,其特徵為, 含有光陽離子聚合引發劑(A )、陽離子聚合性化合物(Β ) 及以下述式[化6 ]表示之環狀聚醚化合物(C ); 成分(B )至少以其1 / 1 0 0 0質量比含有含氧雜環丁烷基之 化合物; 相對於成分(B )與(C )之總和,(C )為0 · 3 ~ 1 0質量% ; 成分(B)及(C)之至少1成分含有相對於成分(B)與(C)之 總和以氟原子(F )之總和計為0〜4 0質量%之量的含氟之有 ® 機化合物; [化6] (其中,X為2以上之整數)。 2.如申請專利範圍第1項之光硬化型樹脂組成物,其 中,相對於成分(A )、( B )與(C )之總和1 0 0質量份,進一步 含有0~250質量份之無機填充材。 3 . —種光硬化型樹脂組成物,其特徵為, 含有光陽離子聚合引發劑(A )、陽離子聚合性化合物 (B )、以下述式[化6 ]表示之環狀聚醚化合物(C )及其他有 機化合物(D ); 成分(B)至少以其1/1000質量比含有含氧雜環丁烷基之 化合物; 23 93123986 1305801 ”年/^ E3:_正替換頁 ——...............I 相對於成分(B )、( C )及(D )之總和,(B )為1〜9 4質量%, (C )為0 · 3〜1 0質量% ; 成分(B )、( C )及(D )之至少1成分含有相對於成分(B )、 (C )及(D )之總和以氟原子(F )之總和計為0〜4 0質量%之量 的含氟之有機化合物; [化6] —C—C—〇 --~~ V J A (其中,X為2以上之整數)。 4. 如申請專利範圍第3項之光硬化型樹脂組成物,其 中,相對於成分(A )、( B )、( C )與(D )之總和1 0 0質量份, 進一步含有〇~250質量份之無機填充材。 5. 如申請專利範圍第1或2項之光硬化型樹脂組成物’ 其中,成分(B )含有含氟之偶合劑。 6. 如申請專利範圍第3或4項之光硬化型樹脂組成物, 其中,成分(B)及/或(D)含有含氟之偶合劑。 7 . —種平板顯示器用密封劑,其特徵為含有申請專利範 圍第1至4項中任一項之光硬化型樹脂組成物。 8. —種平板顯示器之密封方法,其特徵為使用申請專利 範圍第7項之密封劑進行密封。 9. 一種平板顯示器,其特徵為以申請專利範圍第8項之 密封方法製得。 24 93123986 1305801 Η— ' η7) S時(更)正替換買 - - -------_Ί - ^
93123986 25
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TWI391478B (zh) * | 2010-08-10 | 2013-04-01 | Sekisui Chemical Co Ltd | Liquid crystal dripping method with sealant |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4702784B2 (ja) * | 2005-08-08 | 2011-06-15 | ソニー株式会社 | 液体吐出型記録ヘッドの流路構成材料 |
WO2007040209A1 (ja) * | 2005-10-03 | 2007-04-12 | Mitsui Chemicals, Inc. | フラットパネルディスプレイ用シール材 |
US20080161471A1 (en) * | 2006-02-10 | 2008-07-03 | Mitsui Chemicals, Inc. | Resin Composition for Sealing Material, Sealing Material, Sealing Method, and Electroluminescent Display |
GB2444053A (en) * | 2006-11-23 | 2008-05-28 | Eques Coatings | Hybrid UV-curable resins |
JP2008305580A (ja) * | 2007-06-05 | 2008-12-18 | Sekisui Chem Co Ltd | 光後硬化性組成物、有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置 |
US20100277684A1 (en) * | 2007-10-22 | 2010-11-04 | Hiroshi Fukushima | Display device and method for production thereof |
WO2014042328A1 (ko) * | 2012-09-13 | 2014-03-20 | 제일모직 주식회사 | 광경화 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치 |
CN105026493B (zh) * | 2013-06-10 | 2017-07-07 | 三井化学株式会社 | 热固性组合物、有机el元件用面密封剂及其固化物 |
JP2015044917A (ja) * | 2013-08-27 | 2015-03-12 | 積水化学工業株式会社 | 光後硬化性樹脂組成物 |
TWI519560B (zh) | 2014-11-24 | 2016-02-01 | 財團法人工業技術研究院 | 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物 |
CN107079542B (zh) * | 2014-12-09 | 2019-03-01 | 三井化学株式会社 | 有机el元件用面密封材及其固化物 |
JP6386370B2 (ja) * | 2014-12-25 | 2018-09-05 | 三井化学株式会社 | 積層構造物、光硬化性組成物および積層構造物の製造方法 |
KR102126389B1 (ko) | 2018-09-14 | 2020-06-25 | 셀라이온바이오메드 주식회사 | 벤즈히드릴티오 아세트아미드 화합물을 유효성분으로 포함하는 간 질환의 예방 또는 치료용 조성물 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU497960B2 (en) * | 1974-04-11 | 1979-01-25 | Minnesota Mining And Manufacturing Company | Photopolymerizable compositions |
US4876322A (en) * | 1984-08-10 | 1989-10-24 | Siemens Aktiengesselschaft | Irradiation cross-linkable thermostable polymer system, for microelectronic applications |
US5721020A (en) * | 1995-10-02 | 1998-02-24 | Kansai Paint Co., Ltd. | Ultraviolet-curing coating composition for cans |
JPH09241603A (ja) * | 1996-03-06 | 1997-09-16 | Sumitomo Bakelite Co Ltd | 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子 |
JP3765896B2 (ja) * | 1996-12-13 | 2006-04-12 | Jsr株式会社 | 光学的立体造形用光硬化性樹脂組成物 |
JPH11152441A (ja) * | 1997-11-21 | 1999-06-08 | Kansai Paint Co Ltd | 紫外線硬化型缶用塗料組成物 |
JP2886853B1 (ja) * | 1998-06-08 | 1999-04-26 | 関西ペイント株式会社 | カチオン重合性塗料組成物 |
JP3737285B2 (ja) * | 1998-08-28 | 2006-01-18 | 積水化学工業株式会社 | 光硬化性組成物、光硬化性接着シート、及び接合方法 |
CN1203150C (zh) | 1999-08-12 | 2005-05-25 | 三井化学株式会社 | 密封剂用光固化型树脂组合物及密封方法 |
JP4193343B2 (ja) | 1999-08-12 | 2008-12-10 | 三井化学株式会社 | シール剤用光硬化型樹脂組成物およびシール方法 |
JP2001089743A (ja) * | 1999-09-24 | 2001-04-03 | Mitsui Chemicals Inc | シール材用光硬化型樹脂組成物、シール方法 |
JP2001207150A (ja) | 2000-01-26 | 2001-07-31 | Sony Chem Corp | 接着剤組成物 |
JP2001207120A (ja) | 2000-01-26 | 2001-07-31 | Nippon Paint Co Ltd | 高透光性膜の製造方法およびコーティング組成物 |
JP4382978B2 (ja) * | 2000-12-04 | 2009-12-16 | 学校法人神奈川大学 | 光硬化性・熱硬化性樹脂組成物 |
KR20030007186A (ko) * | 2001-07-17 | 2003-01-23 | 미쯔이카가쿠 가부시기가이샤 | 광 양이온성 경화가능 수지 조성물 및 그 용도 |
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