TWI293320B - - Google Patents

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Publication number
TWI293320B
TWI293320B TW090125263A TW90125263A TWI293320B TW I293320 B TWI293320 B TW I293320B TW 090125263 A TW090125263 A TW 090125263A TW 90125263 A TW90125263 A TW 90125263A TW I293320 B TWI293320 B TW I293320B
Authority
TW
Taiwan
Prior art keywords
oligomer
resin
prepared
ruthenium
weight
Prior art date
Application number
TW090125263A
Other languages
English (en)
Chinese (zh)
Inventor
Nozomu Takano
Tomio Fukuda
Masato Miyatake
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of TWI293320B publication Critical patent/TWI293320B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31862—Melamine-aldehyde

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW090125263A 2000-10-13 2001-10-12 TWI293320B (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000313720 2000-10-13

Publications (1)

Publication Number Publication Date
TWI293320B true TWI293320B (cg-RX-API-DMAC7.html) 2008-02-11

Family

ID=18793092

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093107102A TW200423831A (en) 2000-10-13 2001-10-12 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board
TW090125263A TWI293320B (cg-RX-API-DMAC7.html) 2000-10-13 2001-10-12

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW093107102A TW200423831A (en) 2000-10-13 2001-10-12 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board

Country Status (9)

Country Link
US (1) US6706409B2 (cg-RX-API-DMAC7.html)
EP (1) EP1197514B1 (cg-RX-API-DMAC7.html)
JP (3) JP5186221B2 (cg-RX-API-DMAC7.html)
KR (2) KR100572532B1 (cg-RX-API-DMAC7.html)
CN (1) CN1212354C (cg-RX-API-DMAC7.html)
AT (1) ATE248203T1 (cg-RX-API-DMAC7.html)
DE (1) DE60100652T2 (cg-RX-API-DMAC7.html)
SG (1) SG108282A1 (cg-RX-API-DMAC7.html)
TW (2) TW200423831A (cg-RX-API-DMAC7.html)

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JP2002155127A (ja) * 2000-11-22 2002-05-28 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを硬化してなる有機・無機複合体
JP2003003076A (ja) * 2001-06-22 2003-01-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、それを用いたプリプレグ、金属箔張積層板及びプリント配線板
WO2003087235A1 (en) * 2002-04-15 2003-10-23 Zeon Corporation Varnish, shaped item, electrical insulating film, laminate, flame retardant slurry and process for producing flame retardant particle and varnish
CN101044204A (zh) * 2004-11-26 2007-09-26 株式会社Lg化学 非卤素阻燃剂环氧树脂组合物，和使用其的预浸料坯和包铜的层压制品
US7851536B2 (en) * 2005-09-15 2010-12-14 Rutgers, The State University Flame-retardant coating
EP2067824A1 (en) * 2006-09-29 2009-06-10 Nippon Shokubai Co., Ltd. Curable resin composition, optical material, and method of regulating optical material
CA2670273C (en) * 2006-11-20 2016-04-05 Grassroots Biotechnology, Inc. Plant growth and imaging devices and related methods and computer program products
JP4888719B2 (ja) * 2007-07-13 2012-02-29 東レ・デュポン株式会社 銅張り板
JP5539706B2 (ja) * 2009-12-16 2014-07-02 旭化成ケミカルズ株式会社 プリプレグ、金属箔張積層板、及びプリント配線板
WO2012169591A1 (ja) * 2011-06-09 2012-12-13 住友精化株式会社 不燃フィルム、不燃フィルム用分散液、不燃フィルムの製造方法、太陽電池バックシート、フレキシブル基板、及び、太陽電池
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
CN106364067B (zh) * 2016-08-29 2021-10-12 上海国纪电子材料有限公司 一种p10覆铜板
KR20220038380A (ko) 2019-07-18 2022-03-28 바스프 에스이 트윈 단량체 조성물 및 이의 유전 필름
KR102601266B1 (ko) * 2021-04-19 2023-11-13 주식회사 액시드 난연성 필름 및 난연성 필름을 위한 코팅 조성물
KR102807057B1 (ko) * 2021-06-18 2025-05-15 (주)엠케이켐앤텍 폴리실록산 난연성 코팅제, 난연성 폴리실록산, 이의 제조방법 및 이로부터 제조된 난연물품
JP7594819B2 (ja) 2022-10-25 2024-12-05 共立エレックス株式会社 自己消火性を有する樹脂材料

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JP3664124B2 (ja) * 2000-10-13 2005-06-22 日立化成工業株式会社 難燃性樹脂組成物、それを用いたプリプレグ、積層板、金属張積層板、印刷配線板及び多層印刷配線板

Also Published As

Publication number Publication date
EP1197514B1 (en) 2003-08-27
KR20040111217A (ko) 2004-12-31
JP2012122081A (ja) 2012-06-28
TW200423831A (en) 2004-11-01
CN1212354C (zh) 2005-07-27
US6706409B2 (en) 2004-03-16
DE60100652T2 (de) 2004-06-24
JP5186221B2 (ja) 2013-04-17
US20020068173A1 (en) 2002-06-06
DE60100652D1 (de) 2003-10-02
KR100570924B1 (ko) 2006-04-13
CN1350031A (zh) 2002-05-22
JP2008179819A (ja) 2008-08-07
ATE248203T1 (de) 2003-09-15
JP2011099113A (ja) 2011-05-19
KR20020029639A (ko) 2002-04-19
EP1197514A1 (en) 2002-04-17
TWI293544B (cg-RX-API-DMAC7.html) 2008-02-11
KR100572532B1 (ko) 2006-04-24
SG108282A1 (en) 2005-01-28

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MM4A Annulment or lapse of patent due to non-payment of fees