TWI285575B - Polishing method - Google Patents

Polishing method Download PDF

Info

Publication number
TWI285575B
TWI285575B TW092108882A TW92108882A TWI285575B TW I285575 B TWI285575 B TW I285575B TW 092108882 A TW092108882 A TW 092108882A TW 92108882 A TW92108882 A TW 92108882A TW I285575 B TWI285575 B TW I285575B
Authority
TW
Taiwan
Prior art keywords
top ring
polishing
polished
semiconductor wafer
pressure
Prior art date
Application number
TW092108882A
Other languages
English (en)
Chinese (zh)
Other versions
TW200306245A (en
Inventor
Tetsuji Togawa
Makoto Fukushima
Kunihiko Sakurai
Hiroshi Yoshida
Osamu Nabeya
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200306245A publication Critical patent/TW200306245A/zh
Application granted granted Critical
Publication of TWI285575B publication Critical patent/TWI285575B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/977—Thinning or removal of substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW092108882A 2002-04-18 2003-04-17 Polishing method TWI285575B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002116721A JP4353673B2 (ja) 2002-04-18 2002-04-18 ポリッシング方法

Publications (2)

Publication Number Publication Date
TW200306245A TW200306245A (en) 2003-11-16
TWI285575B true TWI285575B (en) 2007-08-21

Family

ID=29243464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092108882A TWI285575B (en) 2002-04-18 2003-04-17 Polishing method

Country Status (9)

Country Link
US (2) US7163895B2 (cg-RX-API-DMAC7.html)
EP (1) EP1495837B1 (cg-RX-API-DMAC7.html)
JP (1) JP4353673B2 (cg-RX-API-DMAC7.html)
KR (1) KR100973759B1 (cg-RX-API-DMAC7.html)
CN (2) CN101327573A (cg-RX-API-DMAC7.html)
AU (1) AU2003227414A1 (cg-RX-API-DMAC7.html)
DE (1) DE60314505T2 (cg-RX-API-DMAC7.html)
TW (1) TWI285575B (cg-RX-API-DMAC7.html)
WO (1) WO2003086706A1 (cg-RX-API-DMAC7.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101023429B (zh) * 2004-07-02 2010-09-01 斯特拉斯鲍公司 用于处理晶片的方法和系统
US8083571B2 (en) * 2004-11-01 2011-12-27 Ebara Corporation Polishing apparatus
JP5248127B2 (ja) 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
KR101022277B1 (ko) * 2009-02-25 2011-03-21 그린스펙(주) 실리콘 베어 웨이퍼 연마장치용 캐리어 헤드
US20120264359A1 (en) * 2011-04-13 2012-10-18 Nanya Technology Corporation Membrane
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
CN103645613B (zh) * 2013-12-05 2016-06-08 上海现代先进超精密制造中心有限公司 一种用于光刻机角度镜接边抛光的方法
JP6466785B2 (ja) * 2015-06-09 2019-02-06 株式会社ディスコ 搬送装置
CN106334997A (zh) * 2016-10-20 2017-01-18 天津华海清科机电科技有限公司 抛光头以及具有其的抛光机
JP7022980B2 (ja) * 2018-01-05 2022-02-21 不二越機械工業株式会社 ウェーハ剥離装置およびウェーハ研磨装置
US12691547B2 (en) * 2023-09-27 2026-07-28 Applied Materials, Inc. CMP inner ring in smart head
CN117885033B (zh) * 2023-12-26 2026-04-03 北京晶亦精微科技股份有限公司 一种取放片装置、双面加工的化学机械抛光系统及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JP3550180B2 (ja) 1994-04-28 2004-08-04 同和鉱業株式会社 ウェハの搬送方法および搬送装置
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
US6210255B1 (en) 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
JP2000127026A (ja) 1998-10-26 2000-05-09 Speedfam-Ipec Co Ltd ウエハ研磨装置
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6722963B1 (en) * 1999-08-03 2004-04-20 Micron Technology, Inc. Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
US6506105B1 (en) * 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
WO2001087541A2 (en) * 2000-05-12 2001-11-22 Multi-Planar Technologies, Inc. Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
JP2002187060A (ja) * 2000-10-11 2002-07-02 Ebara Corp 基板保持装置、ポリッシング装置、及び研磨方法
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
CN1260778C (zh) * 2000-12-04 2006-06-21 株式会社荏原制作所 基片加工方法
US6746318B2 (en) * 2001-10-11 2004-06-08 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers

Also Published As

Publication number Publication date
EP1495837B1 (en) 2007-06-20
KR100973759B1 (ko) 2010-08-04
CN100415447C (zh) 2008-09-03
CN101327573A (zh) 2008-12-24
EP1495837A4 (en) 2005-11-02
US20060079092A1 (en) 2006-04-13
US20040198011A1 (en) 2004-10-07
CN1541151A (zh) 2004-10-27
JP4353673B2 (ja) 2009-10-28
TW200306245A (en) 2003-11-16
KR20040110069A (ko) 2004-12-29
JP2003311609A (ja) 2003-11-05
DE60314505T2 (de) 2008-02-28
DE60314505D1 (de) 2007-08-02
US7163895B2 (en) 2007-01-16
AU2003227414A1 (en) 2003-10-27
EP1495837A1 (en) 2005-01-12
WO2003086706A1 (en) 2003-10-23

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