TWI276001B - Semiconductor device having identification number, manufacturing method thereof and electronic device - Google Patents

Semiconductor device having identification number, manufacturing method thereof and electronic device Download PDF

Info

Publication number
TWI276001B
TWI276001B TW090119900A TW90119900A TWI276001B TW I276001 B TWI276001 B TW I276001B TW 090119900 A TW090119900 A TW 090119900A TW 90119900 A TW90119900 A TW 90119900A TW I276001 B TWI276001 B TW I276001B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
identification number
memory
semiconductor
transistor
Prior art date
Application number
TW090119900A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuo Usami
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TWI276001B publication Critical patent/TWI276001B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H10W46/00—
    • H10W46/106—
    • H10W46/401—
    • H10W46/601—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
TW090119900A 2000-12-15 2001-08-14 Semiconductor device having identification number, manufacturing method thereof and electronic device TWI276001B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000381458A JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置

Publications (1)

Publication Number Publication Date
TWI276001B true TWI276001B (en) 2007-03-11

Family

ID=18849448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090119900A TWI276001B (en) 2000-12-15 2001-08-14 Semiconductor device having identification number, manufacturing method thereof and electronic device

Country Status (4)

Country Link
US (2) US6617172B2 (enExample)
JP (1) JP2002184872A (enExample)
KR (1) KR100767555B1 (enExample)
TW (1) TWI276001B (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7316934B2 (en) * 2000-12-18 2008-01-08 Zavitan Semiconductors, Inc. Personalized hardware
JP3809353B2 (ja) * 2001-08-02 2006-08-16 キヤノン株式会社 Ｉｄ付き加工物の製造方法
EP1300872A1 (en) * 2001-10-08 2003-04-09 Infineon Technologies SC300 GmbH & Co. KG Semiconductor device identification apparatus
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
JP4024619B2 (ja) * 2002-08-09 2007-12-19 株式会社日立製作所 半導体装置の情報読み取り装置
DE10241141B4 (de) * 2002-09-05 2015-07-16 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
US6908037B2 (en) * 2002-09-26 2005-06-21 Samsung Electronics, Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
US6962293B2 (en) * 2002-09-26 2005-11-08 Samsung Electronics Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
JP2004206371A (ja) * 2002-12-25 2004-07-22 Renesas Technology Corp 半導体装置
WO2005024949A1 (ja) * 2003-08-28 2005-03-17 Hitachi, Ltd. 半導体装置及びその製造方法
WO2005081307A1 (en) * 2004-02-20 2005-09-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment
EP1734482B1 (en) 2004-04-01 2013-06-05 Hitachi, Ltd. Identification information managing method and system
WO2005112195A1 (ja) 2004-05-18 2005-11-24 Hitachi, Ltd. 無線ｉｃタグ及びその製造方法
WO2006044399A1 (en) 2004-10-15 2006-04-27 Applied Materials, Inc. Die-level traceability mechanism for semiconductor assembly and test facility
WO2006064921A2 (en) * 2004-12-13 2006-06-22 Tokyo Electron Limited Semiconductor chip with identification codes, manufacturing method of the chip and semiconductor chip management system
US7800200B2 (en) 2005-02-24 2010-09-21 Hitachi, Ltd. Wireless IC tag and method for manufacturing same
WO2006117853A1 (ja) * 2005-04-27 2006-11-09 Spansion Llc 半導体装置、データの読み出し方法及び半導体装置の製造方法
JP4528239B2 (ja) * 2005-10-03 2010-08-18 株式会社日立製作所 無線ｉｃタグ
JP5148932B2 (ja) * 2006-06-30 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
US7750403B2 (en) 2006-06-30 2010-07-06 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
US7494846B2 (en) * 2007-03-09 2009-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Design techniques for stacking identical memory dies
WO2009075675A1 (en) * 2007-12-10 2009-06-18 Agere Systems Inc. Chip identification using top metal layer
US8952712B2 (en) * 2010-06-16 2015-02-10 Broadcom Corporation Tagging of functional blocks of a semiconductor component on a wafer
US9002673B2 (en) 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
KR20120000281A (ko) 2010-06-25 2012-01-02 삼성전자주식회사 마스크 롬
EP2712021B1 (de) * 2012-09-21 2018-04-04 Siemens Aktiengesellschaft Antenne für ein Schreib-/Lesegerät für RFID-Anordnungen und Schreib-/Lesegerät für den Betrieb mit einer externen Antenne
US10909440B2 (en) 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
US9691709B2 (en) 2015-02-26 2017-06-27 International Business Machines Corporation Semiconductor device security
JP2016180673A (ja) * 2015-03-24 2016-10-13 株式会社デンソー 半導体集積回路及び半導体集積回路のテストシステム
US10312091B1 (en) * 2015-10-13 2019-06-04 Multibeam Corporation Secure permanent integrated circuit personalization
CN109417041A (zh) * 2016-02-01 2019-03-01 欧克特沃系统有限责任公司 用于制造电子器件的系统和方法
GB201609781D0 (en) 2016-06-03 2016-07-20 Irdeto Bv Secured chip
US10714427B2 (en) 2016-09-08 2020-07-14 Asml Netherlands B.V. Secure chips with serial numbers
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US11133206B2 (en) * 2019-04-15 2021-09-28 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213192A (en) * 1979-01-15 1980-07-15 Christensen Alton O Sr Electron beam accessed read-write-erase random access memory
US4353064A (en) * 1981-01-14 1982-10-05 Honeywell Inc. Battery operated access control card
JPS6233475A (ja) 1985-08-06 1987-02-13 Nec Corp 半導体装置
JP2840321B2 (ja) 1989-09-20 1998-12-24 株式会社日立製作所 半導体装置
JP2910424B2 (ja) 1992-06-10 1999-06-23 日本電気株式会社 半導体装置の製造方法
JP3200475B2 (ja) * 1992-10-05 2001-08-20 三菱電機株式会社 半導体装置の製造方法
JPH07140236A (ja) * 1993-11-17 1995-06-02 Sekisui Chem Co Ltd 無線応答システム
KR100380546B1 (ko) * 1994-02-24 2003-06-25 가부시끼가이샤 히다치 세이사꾸쇼 반도체집적회로장치의제조방법
JPH08139208A (ja) 1994-11-04 1996-05-31 Toyota Motor Corp 不揮発性メモリの製造システム及びその製造方法
JPH0991970A (ja) 1995-09-26 1997-04-04 Olympus Optical Co Ltd 非破壊型強誘電体メモリ及びその駆動方法
JPH09180980A (ja) * 1995-12-21 1997-07-11 Mitsubishi Electric Corp 半導体装置の製造システム
JPH09251519A (ja) * 1996-03-14 1997-09-22 Toshiba Corp Ｉｃカード
US5990507A (en) * 1996-07-09 1999-11-23 Kabushiki Kaisha Toshiba Semiconductor device having ferroelectric capacitor structures
JPH1055939A (ja) * 1996-08-08 1998-02-24 Seiko Epson Corp 半導体装置、半導体装置の製造方法及び電子機器システム
JP4025372B2 (ja) 1996-12-04 2007-12-19 株式会社ルネサステクノロジ 半導体装置
JPH10224278A (ja) * 1997-02-10 1998-08-21 Omron Corp 非接触データ通信システム
JPH118327A (ja) 1997-06-16 1999-01-12 Sony Corp 半導体チップ識別コード付与方法及び半導体チップ管理方法
KR20000046928A (ko) * 1998-12-31 2000-07-25 조정일 전자 지갑 카드 운영 시스템
US6428718B1 (en) * 1999-08-26 2002-08-06 Advanced Micro Devices, Inc. Selective back side wet etch
JP2000332135A (ja) * 2000-01-01 2000-11-30 Hitachi Ltd 半導体集積回路装置
JP2001337439A (ja) * 2000-05-26 2001-12-07 Hitachi Ltd 半導体集積回路の設計、製造方法および検査方法並びに半導体集積回路
US7177190B2 (en) * 2004-11-26 2007-02-13 Aplus Flash Technology, Inc. Combination nonvolatile integrated memory system using a universal technology most suitable for high-density, high-flexibility and high-security sim-card, smart-card and e-passport applications

Also Published As

Publication number Publication date
US20040095172A1 (en) 2004-05-20
JP2002184872A (ja) 2002-06-28
KR20020046911A (ko) 2002-06-21
US7442959B2 (en) 2008-10-28
US6617172B2 (en) 2003-09-09
US20020074666A1 (en) 2002-06-20
KR100767555B1 (ko) 2007-10-16

Similar Documents

Publication Publication Date Title
TWI276001B (en) Semiconductor device having identification number, manufacturing method thereof and electronic device
TWI430180B (zh) 半導體裝置
US8060052B2 (en) Semiconductor device
US7912439B2 (en) Semiconductor device and operating method thereof
TWI431848B (zh) 半導體裝置
US20120081186A1 (en) Semiconductor device and electronic device having the same
US9768210B2 (en) Semiconductor device having antenna and sensor elements
TW200304265A (en) Rectifier utilizing a grounded antenna
CN101174823A (zh) 振荡电路及具有该振荡电路的半导体器件
CN1904914B (zh) 半导体器件
JP2007109216A (ja) 半導体装置
US20120152890A1 (en) Methods for manufacturing radio frequency (rf) powder
US7046146B2 (en) Electromagnetic field generation device for a transponder
US8222735B2 (en) Semiconductor device and communication system using the semiconductor device
KR101219068B1 (ko) 반도체 장치 및 이를 이용한 무선 통신 시스템
JP3746289B2 (ja) 半導体装置
JP4593534B2 (ja) 半導体装置及び無線通信システム
JP4685587B2 (ja) 認識番号を有する半導体装置
US7978787B2 (en) Semiconductor device
JP2007134694A (ja) 半導体装置及び前記半導体装置を用いた通信システム
JP4789696B2 (ja) 半導体装置
JP2007323555A (ja) Ｓａｗ型ｒｆｉｄ
JP2004258559A (ja) 平面表示装置及びその製品情報管理方法
JPH07307439A (ja) 非接触型ｉｃカード
JP2007006464A (ja) 半導体装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees