TWI276001B - Semiconductor device having identification number, manufacturing method thereof and electronic device - Google Patents

Semiconductor device having identification number, manufacturing method thereof and electronic device Download PDF

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Publication number
TWI276001B
TWI276001B TW090119900A TW90119900A TWI276001B TW I276001 B TWI276001 B TW I276001B TW 090119900 A TW090119900 A TW 090119900A TW 90119900 A TW90119900 A TW 90119900A TW I276001 B TWI276001 B TW I276001B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
identification number
memory
semiconductor
transistor
Prior art date
Application number
TW090119900A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuo Usami
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TWI276001B publication Critical patent/TWI276001B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Electron Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW090119900A 2000-12-15 2001-08-14 Semiconductor device having identification number, manufacturing method thereof and electronic device TWI276001B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000381458A JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置

Publications (1)

Publication Number Publication Date
TWI276001B true TWI276001B (en) 2007-03-11

Family

ID=18849448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090119900A TWI276001B (en) 2000-12-15 2001-08-14 Semiconductor device having identification number, manufacturing method thereof and electronic device

Country Status (4)

Country Link
US (2) US6617172B2 (enExample)
JP (1) JP2002184872A (enExample)
KR (1) KR100767555B1 (enExample)
TW (1) TWI276001B (enExample)

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US7343214B2 (en) * 2004-10-15 2008-03-11 Applied Materials, Inc. Die-level traceability mechanism for semiconductor assembly and test facility
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JP4528239B2 (ja) * 2005-10-03 2010-08-18 株式会社日立製作所 無線ｉｃタグ
JP5148932B2 (ja) * 2006-06-30 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
KR101362955B1 (ko) 2006-06-30 2014-02-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조 방법
US7494846B2 (en) * 2007-03-09 2009-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Design techniques for stacking identical memory dies
WO2009075675A1 (en) * 2007-12-10 2009-06-18 Agere Systems Inc. Chip identification using top metal layer
US9002673B2 (en) 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
US20110313711A1 (en) 2010-06-16 2011-12-22 Broadcom Corporation Identifying Defective Semiconductor Components on a Wafer Using Component Triangulation
KR20120000281A (ko) 2010-06-25 2012-01-02 삼성전자주식회사 마스크 롬
EP2712021B1 (de) * 2012-09-21 2018-04-04 Siemens Aktiengesellschaft Antenne für ein Schreib-/Lesegerät für RFID-Anordnungen und Schreib-/Lesegerät für den Betrieb mit einer externen Antenne
US10909440B2 (en) * 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
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US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US11133206B2 (en) * 2019-04-15 2021-09-28 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking

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Also Published As

Publication number Publication date
US20020074666A1 (en) 2002-06-20
US20040095172A1 (en) 2004-05-20
JP2002184872A (ja) 2002-06-28
US7442959B2 (en) 2008-10-28
KR100767555B1 (ko) 2007-10-16
KR20020046911A (ko) 2002-06-21
US6617172B2 (en) 2003-09-09

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