KR100767555B1 - 인식 번호를 갖는 반도체 장치 - Google Patents

인식 번호를 갖는 반도체 장치 Download PDF

Info

Publication number
KR100767555B1
KR100767555B1 KR1020010052807A KR20010052807A KR100767555B1 KR 100767555 B1 KR100767555 B1 KR 100767555B1 KR 1020010052807 A KR1020010052807 A KR 1020010052807A KR 20010052807 A KR20010052807 A KR 20010052807A KR 100767555 B1 KR100767555 B1 KR 100767555B1
Authority
KR
South Korea
Prior art keywords
delete delete
semiconductor chip
memory
identification number
counter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020010052807A
Other languages
English (en)
Korean (ko)
Other versions
KR20020046911A (ko
Inventor
우사미미쯔오
Original Assignee
가부시키가이샤 히타치세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 히타치세이사쿠쇼 filed Critical 가부시키가이샤 히타치세이사쿠쇼
Publication of KR20020046911A publication Critical patent/KR20020046911A/ko
Application granted granted Critical
Publication of KR100767555B1 publication Critical patent/KR100767555B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Read Only Memory (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Electron Beam Exposure (AREA)
KR1020010052807A 2000-12-15 2001-08-30 인식 번호를 갖는 반도체 장치 Expired - Fee Related KR100767555B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00381458 2000-12-15
JP2000381458A JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置

Publications (2)

Publication Number Publication Date
KR20020046911A KR20020046911A (ko) 2002-06-21
KR100767555B1 true KR100767555B1 (ko) 2007-10-16

Family

ID=18849448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010052807A Expired - Fee Related KR100767555B1 (ko) 2000-12-15 2001-08-30 인식 번호를 갖는 반도체 장치

Country Status (4)

Country Link
US (2) US6617172B2 (enExample)
JP (1) JP2002184872A (enExample)
KR (1) KR100767555B1 (enExample)
TW (1) TWI276001B (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7316934B2 (en) * 2000-12-18 2008-01-08 Zavitan Semiconductors, Inc. Personalized hardware
JP3809353B2 (ja) * 2001-08-02 2006-08-16 キヤノン株式会社 Ｉｄ付き加工物の製造方法
EP1300872A1 (en) * 2001-10-08 2003-04-09 Infineon Technologies SC300 GmbH & Co. KG Semiconductor device identification apparatus
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
JP4024619B2 (ja) * 2002-08-09 2007-12-19 株式会社日立製作所 半導体装置の情報読み取り装置
DE10241141B4 (de) * 2002-09-05 2015-07-16 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
US6908037B2 (en) * 2002-09-26 2005-06-21 Samsung Electronics, Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
US6962293B2 (en) * 2002-09-26 2005-11-08 Samsung Electronics Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
JP2004206371A (ja) * 2002-12-25 2004-07-22 Renesas Technology Corp 半導体装置
WO2005024949A1 (ja) * 2003-08-28 2005-03-17 Hitachi, Ltd. 半導体装置及びその製造方法
EP1719169A4 (en) * 2004-02-20 2015-01-07 Semiconductor Energy Lab MANUFACTURING METHOD FOR A SEMICONDUCTOR ELEMENT AND IC CARD, IC TAG, RFID, TRANSPONDER, LICENSE, SAFETY, PASS, ELECTRONIC DEVICE, BAG AND CLOTHING PIECE
WO2005101327A1 (ja) 2004-04-01 2005-10-27 Hitachi, Ltd. 識別情報管理方法及びシステム
WO2005112195A1 (ja) 2004-05-18 2005-11-24 Hitachi, Ltd. 無線ｉｃタグ及びその製造方法
JP2008517465A (ja) * 2004-10-15 2008-05-22 アプライド マテリアルズ インコーポレイテッド 半導体組立てと試験設備用のダイ・レベル追跡遂行機構
US20080121709A1 (en) * 2004-12-13 2008-05-29 Tokyo Electron Limited Semiconductor Chip With Identification Codes, Manufacturing Method Of The Chip And Semiconductor Chip Management System
US7800200B2 (en) 2005-02-24 2010-09-21 Hitachi, Ltd. Wireless IC tag and method for manufacturing same
JP4950037B2 (ja) * 2005-04-27 2012-06-13 スパンション エルエルシー 半導体装置、データの読み出し方法及び半導体装置の製造方法
JP4528239B2 (ja) * 2005-10-03 2010-08-18 株式会社日立製作所 無線ｉｃタグ
JP5148932B2 (ja) * 2006-06-30 2013-02-20 株式会社半導体エネルギー研究所 半導体装置
KR101362955B1 (ko) 2006-06-30 2014-02-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조 방법
US7494846B2 (en) * 2007-03-09 2009-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Design techniques for stacking identical memory dies
WO2009075675A1 (en) * 2007-12-10 2009-06-18 Agere Systems Inc. Chip identification using top metal layer
US9002673B2 (en) 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
US8952712B2 (en) * 2010-06-16 2015-02-10 Broadcom Corporation Tagging of functional blocks of a semiconductor component on a wafer
KR20120000281A (ko) 2010-06-25 2012-01-02 삼성전자주식회사 마스크 롬
EP2712021B1 (de) * 2012-09-21 2018-04-04 Siemens Aktiengesellschaft Antenne für ein Schreib-/Lesegerät für RFID-Anordnungen und Schreib-/Lesegerät für den Betrieb mit einer externen Antenne
US10909440B2 (en) 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
US9691709B2 (en) 2015-02-26 2017-06-27 International Business Machines Corporation Semiconductor device security
JP2016180673A (ja) * 2015-03-24 2016-10-13 株式会社デンソー 半導体集積回路及び半導体集積回路のテストシステム
US10312091B1 (en) * 2015-10-13 2019-06-04 Multibeam Corporation Secure permanent integrated circuit personalization
CN109417041A (zh) * 2016-02-01 2019-03-01 欧克特沃系统有限责任公司 用于制造电子器件的系统和方法
GB201609781D0 (en) 2016-06-03 2016-07-20 Irdeto Bv Secured chip
US20180068047A1 (en) * 2016-09-08 2018-03-08 Mapper Lithography Ip B.V. Method and system for fabricating unique chips using a charged particle multi-beamlet lithography system
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
US11133206B2 (en) * 2019-04-15 2021-09-28 Tokyo Electron Limited Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353064A (en) * 1981-01-14 1982-10-05 Honeywell Inc. Battery operated access control card
JPH06120353A (ja) * 1992-10-05 1994-04-28 Mitsubishi Electric Corp 半導体装置の製造方法
JPH07140236A (ja) * 1993-11-17 1995-06-02 Sekisui Chem Co Ltd 無線応答システム
JPH09180980A (ja) * 1995-12-21 1997-07-11 Mitsubishi Electric Corp 半導体装置の製造システム
JPH09251519A (ja) * 1996-03-14 1997-09-22 Toshiba Corp Ｉｃカード
JPH1055939A (ja) * 1996-08-08 1998-02-24 Seiko Epson Corp 半導体装置、半導体装置の製造方法及び電子機器システム
JPH10224278A (ja) * 1997-02-10 1998-08-21 Omron Corp 非接触データ通信システム
KR20000046928A (ko) * 1998-12-31 2000-07-25 조정일 전자 지갑 카드 운영 시스템
JP2000332135A (ja) * 2000-01-01 2000-11-30 Hitachi Ltd 半導体集積回路装置
JP2001337439A (ja) * 2000-05-26 2001-12-07 Hitachi Ltd 半導体集積回路の設計、製造方法および検査方法並びに半導体集積回路

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213192A (en) * 1979-01-15 1980-07-15 Christensen Alton O Sr Electron beam accessed read-write-erase random access memory
JPS6233475A (ja) 1985-08-06 1987-02-13 Nec Corp 半導体装置
JP2840321B2 (ja) 1989-09-20 1998-12-24 株式会社日立製作所 半導体装置
JP2910424B2 (ja) 1992-06-10 1999-06-23 日本電気株式会社 半導体装置の製造方法
KR100380546B1 (ko) * 1994-02-24 2003-06-25 가부시끼가이샤 히다치 세이사꾸쇼 반도체집적회로장치의제조방법
JPH08139208A (ja) * 1994-11-04 1996-05-31 Toyota Motor Corp 不揮発性メモリの製造システム及びその製造方法
JPH0991970A (ja) 1995-09-26 1997-04-04 Olympus Optical Co Ltd 非破壊型強誘電体メモリ及びその駆動方法
US5990507A (en) * 1996-07-09 1999-11-23 Kabushiki Kaisha Toshiba Semiconductor device having ferroelectric capacitor structures
WO1998025305A1 (en) 1996-12-04 1998-06-11 Hitachi, Ltd. Method for manufacturing semiconductor device
JPH118327A (ja) 1997-06-16 1999-01-12 Sony Corp 半導体チップ識別コード付与方法及び半導体チップ管理方法
US6428718B1 (en) * 1999-08-26 2002-08-06 Advanced Micro Devices, Inc. Selective back side wet etch
US7177190B2 (en) * 2004-11-26 2007-02-13 Aplus Flash Technology, Inc. Combination nonvolatile integrated memory system using a universal technology most suitable for high-density, high-flexibility and high-security sim-card, smart-card and e-passport applications

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4353064A (en) * 1981-01-14 1982-10-05 Honeywell Inc. Battery operated access control card
JPH06120353A (ja) * 1992-10-05 1994-04-28 Mitsubishi Electric Corp 半導体装置の製造方法
JPH07140236A (ja) * 1993-11-17 1995-06-02 Sekisui Chem Co Ltd 無線応答システム
JPH09180980A (ja) * 1995-12-21 1997-07-11 Mitsubishi Electric Corp 半導体装置の製造システム
JPH09251519A (ja) * 1996-03-14 1997-09-22 Toshiba Corp Ｉｃカード
JPH1055939A (ja) * 1996-08-08 1998-02-24 Seiko Epson Corp 半導体装置、半導体装置の製造方法及び電子機器システム
JPH10224278A (ja) * 1997-02-10 1998-08-21 Omron Corp 非接触データ通信システム
KR20000046928A (ko) * 1998-12-31 2000-07-25 조정일 전자 지갑 카드 운영 시스템
JP2000332135A (ja) * 2000-01-01 2000-11-30 Hitachi Ltd 半導体集積回路装置
JP2001337439A (ja) * 2000-05-26 2001-12-07 Hitachi Ltd 半導体集積回路の設計、製造方法および検査方法並びに半導体集積回路

Also Published As

Publication number Publication date
US20020074666A1 (en) 2002-06-20
TWI276001B (en) 2007-03-11
US7442959B2 (en) 2008-10-28
US20040095172A1 (en) 2004-05-20
US6617172B2 (en) 2003-09-09
JP2002184872A (ja) 2002-06-28
KR20020046911A (ko) 2002-06-21

Similar Documents

Publication Publication Date Title
KR100767555B1 (ko) 인식 번호를 갖는 반도체 장치
US6837438B1 (en) Non-contact information medium and communication system utilizing the same
US6885202B2 (en) Non-contact tester for electronic circuits
US6268796B1 (en) Radio frequency identification transponder having integrated antenna
CN1655185B (zh) 具有线圈状天线的半导体芯片及使用它的通信系统
US9154188B2 (en) RF identification device with near-field-coupled antenna
JP2003218624A (ja) Ｉｃカード用のブースタアンテナ
KR19980070698A (ko) 비접촉형ｉｃ카드
KR20040098665A (ko) 커플링이 강화된 집적 회로
WO2008065988A1 (fr) Procédé de production de poudre rf
KR20050005427A (ko) 접지된 안테나를 이용하는 정류기
US6525410B1 (en) Integrated circuit wireless tagging
US6368901B2 (en) Integrated circuit wireless tagging
US8440487B2 (en) Methods for manufacturing radio frequency (RF) powder
JP2003331238A (ja) Ｉｃカード
EP1952312B1 (en) Semiconductor device and communication system using the semiconductor device
Usami et al. The µ-chip: An ultra-small 2.45 GHz RFID chip for ubiquitous recognition applications
JP2001034725A (ja) 非接触ｉｃモジュール及びその製造方法、並びに、非接触情報媒体
JP3746289B2 (ja) 半導体装置
JP4370601B2 (ja) Ｉｃカード
JP2003249814A (ja) 非接触ｒｆｉｄタグ用同調コンデンサ付きループアンテナ
JP4685587B2 (ja) 認識番号を有する半導体装置
US7978787B2 (en) Semiconductor device
JP2008134816A (ja) Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダーの励起方法
TWI309386B (enExample)

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20120924

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20130924

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20140923

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20151010

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20151010