JP2002184872A - 認識番号を有する半導体装置、その製造方法及び電子装置 - Google Patents

認識番号を有する半導体装置、その製造方法及び電子装置

Info

Publication number
JP2002184872A
JP2002184872A JP2000381458A JP2000381458A JP2002184872A JP 2002184872 A JP2002184872 A JP 2002184872A JP 2000381458 A JP2000381458 A JP 2000381458A JP 2000381458 A JP2000381458 A JP 2000381458A JP 2002184872 A JP2002184872 A JP 2002184872A
Authority
JP
Japan
Prior art keywords
forming
semiconductor device
identification number
memory
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000381458A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002184872A5 (enExample
Inventor
Mitsuo Usami
光雄 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000381458A priority Critical patent/JP2002184872A/ja
Priority to TW090119900A priority patent/TWI276001B/zh
Priority to KR1020010052807A priority patent/KR100767555B1/ko
Priority to US09/942,612 priority patent/US6617172B2/en
Publication of JP2002184872A publication Critical patent/JP2002184872A/ja
Priority to US10/610,631 priority patent/US7442959B2/en
Publication of JP2002184872A5 publication Critical patent/JP2002184872A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Electron Beam Exposure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2000381458A 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置 Withdrawn JP2002184872A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2000381458A JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置
TW090119900A TWI276001B (en) 2000-12-15 2001-08-14 Semiconductor device having identification number, manufacturing method thereof and electronic device
KR1020010052807A KR100767555B1 (ko) 2000-12-15 2001-08-30 인식 번호를 갖는 반도체 장치
US09/942,612 US6617172B2 (en) 2000-12-15 2001-08-31 Semiconductor device having identification number, manufacturing method thereof and electronic device
US10/610,631 US7442959B2 (en) 2000-12-15 2003-07-02 Semiconductor device having identification number, manufacturing method thereof and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000381458A JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004362654A Division JP3746289B2 (ja) 2004-12-15 2004-12-15 半導体装置

Publications (2)

Publication Number Publication Date
JP2002184872A true JP2002184872A (ja) 2002-06-28
JP2002184872A5 JP2002184872A5 (enExample) 2005-07-28

Family

ID=18849448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000381458A Withdrawn JP2002184872A (ja) 2000-12-15 2000-12-15 認識番号を有する半導体装置、その製造方法及び電子装置

Country Status (4)

Country Link
US (2) US6617172B2 (enExample)
JP (1) JP2002184872A (enExample)
KR (1) KR100767555B1 (enExample)
TW (1) TWI276001B (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268774A (ja) * 2004-02-20 2005-09-29 Semiconductor Energy Lab Co Ltd 半導体装置の製造方法、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
WO2006090459A1 (ja) * 2005-02-24 2006-08-31 Hitachi, Ltd. 無線ｉｃタグおよびその製造方法
WO2006117853A1 (ja) * 2005-04-27 2006-11-09 Spansion Llc 半導体装置、データの読み出し方法及び半導体装置の製造方法
JPWO2005024949A1 (ja) * 2003-08-28 2006-11-16 株式会社日立製作所 半導体装置及びその製造方法
JP2008034819A (ja) * 2006-06-30 2008-02-14 Semiconductor Energy Lab Co Ltd 半導体装置とその作製方法
US7692545B2 (en) 2004-05-18 2010-04-06 Hitachi, Ltd. Wireless IC tag and process for manufacturing the same
US7922081B2 (en) 2004-04-01 2011-04-12 Hitachi, Ltd. Identification information managing method and system
KR101362955B1 (ko) 2006-06-30 2014-02-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조 방법
JP2016180673A (ja) * 2015-03-24 2016-10-13 株式会社デンソー 半導体集積回路及び半導体集積回路のテストシステム
US9685410B2 (en) 2015-02-26 2017-06-20 International Business Machines Corporation Semiconductor device security
JP2018041950A (ja) * 2016-09-08 2018-03-15 マッパー・リソグラフィー・アイピー・ビー．ブイ． 荷電粒子マルチビームレットリソグラフィーシステムを使用し、一意的チップを製作するための方法及びシステム
CN109417041A (zh) * 2016-02-01 2019-03-01 欧克特沃系统有限责任公司 用于制造电子器件的系统和方法
KR20210140732A (ko) * 2019-04-15 2021-11-23 도쿄엘렉트론가부시키가이샤 전기 및 광학 마킹을 사용하는 반도체 디바이스의 다이-레벨 고유 인증 및 직렬화를 위한 방법

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US7316934B2 (en) * 2000-12-18 2008-01-08 Zavitan Semiconductors, Inc. Personalized hardware
JP3809353B2 (ja) * 2001-08-02 2006-08-16 キヤノン株式会社 Ｉｄ付き加工物の製造方法
EP1300872A1 (en) * 2001-10-08 2003-04-09 Infineon Technologies SC300 GmbH & Co. KG Semiconductor device identification apparatus
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
JP4024619B2 (ja) * 2002-08-09 2007-12-19 株式会社日立製作所 半導体装置の情報読み取り装置
DE10241141B4 (de) * 2002-09-05 2015-07-16 Infineon Technologies Ag Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
US6908037B2 (en) * 2002-09-26 2005-06-21 Samsung Electronics, Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
US6962293B2 (en) * 2002-09-26 2005-11-08 Samsung Electronics Co., Ltd. Circuit for generating clock signal and decoding data signal for use in contactless integrated circuit card
JP2004206371A (ja) * 2002-12-25 2004-07-22 Renesas Technology Corp 半導体装置
US7343214B2 (en) * 2004-10-15 2008-03-11 Applied Materials, Inc. Die-level traceability mechanism for semiconductor assembly and test facility
KR100934918B1 (ko) * 2004-12-13 2010-01-06 도쿄엘렉트론가부시키가이샤 식별 코드를 갖는 반도체 칩, 그 칩의 제조 방법, 및반도체 칩 관리 시스템
JP4528239B2 (ja) * 2005-10-03 2010-08-18 株式会社日立製作所 無線ｉｃタグ
US7494846B2 (en) * 2007-03-09 2009-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Design techniques for stacking identical memory dies
WO2009075675A1 (en) * 2007-12-10 2009-06-18 Agere Systems Inc. Chip identification using top metal layer
US9002673B2 (en) 2010-06-16 2015-04-07 Broadcom Corporation Simultaneous testing of semiconductor components on a wafer
US20110313711A1 (en) 2010-06-16 2011-12-22 Broadcom Corporation Identifying Defective Semiconductor Components on a Wafer Using Component Triangulation
KR20120000281A (ko) 2010-06-25 2012-01-02 삼성전자주식회사 마스크 롬
EP2712021B1 (de) * 2012-09-21 2018-04-04 Siemens Aktiengesellschaft Antenne für ein Schreib-/Lesegerät für RFID-Anordnungen und Schreib-/Lesegerät für den Betrieb mit einer externen Antenne
US10909440B2 (en) * 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
US10312091B1 (en) * 2015-10-13 2019-06-04 Multibeam Corporation Secure permanent integrated circuit personalization
GB201609781D0 (en) 2016-06-03 2016-07-20 Irdeto Bv Secured chip
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system

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JP3200475B2 (ja) * 1992-10-05 2001-08-20 三菱電機株式会社 半導体装置の製造方法
JPH07140236A (ja) * 1993-11-17 1995-06-02 Sekisui Chem Co Ltd 無線応答システム
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JPH08139208A (ja) 1994-11-04 1996-05-31 Toyota Motor Corp 不揮発性メモリの製造システム及びその製造方法
JPH0991970A (ja) 1995-09-26 1997-04-04 Olympus Optical Co Ltd 非破壊型強誘電体メモリ及びその駆動方法
JPH09180980A (ja) * 1995-12-21 1997-07-11 Mitsubishi Electric Corp 半導体装置の製造システム
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JP4025372B2 (ja) 1996-12-04 2007-12-19 株式会社ルネサステクノロジ 半導体装置
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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497093B2 (ja) * 2003-08-28 2010-07-07 株式会社日立製作所 半導体装置及びその製造方法
JPWO2005024949A1 (ja) * 2003-08-28 2006-11-16 株式会社日立製作所 半導体装置及びその製造方法
JP2005268774A (ja) * 2004-02-20 2005-09-29 Semiconductor Energy Lab Co Ltd 半導体装置の製造方法、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
US7922081B2 (en) 2004-04-01 2011-04-12 Hitachi, Ltd. Identification information managing method and system
US7692545B2 (en) 2004-05-18 2010-04-06 Hitachi, Ltd. Wireless IC tag and process for manufacturing the same
JPWO2006090459A1 (ja) * 2005-02-24 2008-07-17 株式会社日立製作所 無線ｉｃタグおよびその製造方法
US7800200B2 (en) 2005-02-24 2010-09-21 Hitachi, Ltd. Wireless IC tag and method for manufacturing same
WO2006090459A1 (ja) * 2005-02-24 2006-08-31 Hitachi, Ltd. 無線ｉｃタグおよびその製造方法
JP4724708B2 (ja) * 2005-02-24 2011-07-13 株式会社日立製作所 無線ｉｃタグ
US7679150B2 (en) 2005-04-27 2010-03-16 Spansion Llc Semiconductor device and programming method therefor
WO2006117853A1 (ja) * 2005-04-27 2006-11-09 Spansion Llc 半導体装置、データの読み出し方法及び半導体装置の製造方法
JP2008034819A (ja) * 2006-06-30 2008-02-14 Semiconductor Energy Lab Co Ltd 半導体装置とその作製方法
KR101362955B1 (ko) 2006-06-30 2014-02-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 그 제조 방법
US9685410B2 (en) 2015-02-26 2017-06-20 International Business Machines Corporation Semiconductor device security
US9691709B2 (en) 2015-02-26 2017-06-27 International Business Machines Corporation Semiconductor device security
JP2016180673A (ja) * 2015-03-24 2016-10-13 株式会社デンソー 半導体集積回路及び半導体集積回路のテストシステム
CN109417041A (zh) * 2016-02-01 2019-03-01 欧克特沃系统有限责任公司 用于制造电子器件的系统和方法
JP2018041950A (ja) * 2016-09-08 2018-03-15 マッパー・リソグラフィー・アイピー・ビー．ブイ． 荷電粒子マルチビームレットリソグラフィーシステムを使用し、一意的チップを製作するための方法及びシステム
KR20210140732A (ko) * 2019-04-15 2021-11-23 도쿄엘렉트론가부시키가이샤 전기 및 광학 마킹을 사용하는 반도체 디바이스의 다이-레벨 고유 인증 및 직렬화를 위한 방법
JP2022529123A (ja) * 2019-04-15 2022-06-17 東京エレクトロン株式会社 電気及び光学マーキングを用いた半導体デバイスのダイレベルの一意な認証及びシリアライゼーションのための方法
JP7521864B2 (ja) 2019-04-15 2024-07-24 東京エレクトロン株式会社 電気及び光学マーキングを用いた半導体デバイスのダイレベルの一意な認証及びシリアライゼーションのための方法
KR102752995B1 (ko) 2019-04-15 2025-01-09 도쿄엘렉트론가부시키가이샤 전기 및 광학 마킹을 사용하는 반도체 디바이스의 다이-레벨 고유 인증 및 직렬화를 위한 방법

Also Published As

Publication number Publication date
US20020074666A1 (en) 2002-06-20
TWI276001B (en) 2007-03-11
US20040095172A1 (en) 2004-05-20
US7442959B2 (en) 2008-10-28
KR100767555B1 (ko) 2007-10-16
KR20020046911A (ko) 2002-06-21
US6617172B2 (en) 2003-09-09

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