TWI275625B - Connection material - Google Patents

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Publication number
TWI275625B
TWI275625B TW090128306A TW90128306A TWI275625B TW I275625 B TWI275625 B TW I275625B TW 090128306 A TW090128306 A TW 090128306A TW 90128306 A TW90128306 A TW 90128306A TW I275625 B TWI275625 B TW I275625B
Authority
TW
Taiwan
Prior art keywords
bare
wafer
insulating
flexible circuit
insulating material
Prior art date
Application number
TW090128306A
Other languages
English (en)
Inventor
Motohide Takeichi
Jyunji Shinozaki
Original Assignee
Sony Chemicals & Information D
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals & Information D filed Critical Sony Chemicals & Information D
Application granted granted Critical
Publication of TWI275625B publication Critical patent/TWI275625B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Description

1275625 a7 ___B7____ 五、發明說明（/ ) 發明之詳細說明 發明所屬之枝術領域 本發明係關於一種用以連接軟性回路基板與裸1C晶 片之連接材料，其係實質上不會發生肩部接觸（shoulder touch)現象。 習知技術 於製造液晶顯示元件模組之場合，向來係使用將驅動 工C搭載在帶狀基板上之載帶封裝（TCP:Tape Carrier Package)，爲能因應配線的窄距化並可使得組裝到液晶 顯示元件模組之際的加工操作容易化’將裸IC晶片以面 朝下方式直接組裝到較TCP用的帶狀基板更薄的薄膜狀之 軟性回路基板的導體圖案上之做法（薄膜上載晶片（C0F)) 日益普遍。 於這般COF連接中，如圖3所示般’係對於由絕緣性 薄膜1與形成於其上之導體圖案2所構成之薄膜狀的軟性 回路基板3之該導體圖案2，將裸1C晶片4之突塊5加 以對位，在兩者之間，夾入使異向性導電連接用導電粒子 分散於熱固性接著薄膜中所構成之異向性導電薄膜6，施 行熱壓接。 發明所欲解決之謀顆 然而，若使用異向性導電膜6來連接裸1C晶片4， 則薄膜狀之軟性回路基板3之絕緣性薄膜1於連接後會熱 收縮，如圖4所示般，在裸1C晶片4的外側之軟性回路 基板3會發生朝向裸1C晶片4側彎曲之現象。向來，由 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —“—^--------訂--------- (請先閱讀背面之注意事項再填寫本頁) 1275625 A7 ___B7 _ 五、發明說明（i ) 於裸工C晶片4的突塊高度爲2 0//m程度，故裸1C晶片4 與軟性回路基板3之導體圖案2不會接觸。 然則，隨著1C晶片的配線方式更加微細化，端子數 增加，端子的窄距化不斷地進展，於裸1C晶片的突塊徑 變小之同時，突塊的高度亦漸次成爲向來的一半之程度之 甚低情況，因此，如圖5所示般，會發生裸1C晶片4與 軟性回路基板3的導體圖案2會發生接觸之情況。於裸 工C晶片4的下面，由於形成有鈍態膜7，故即使接觸亦不 會短路，惟在用以自晶圓切割出裸1C晶片4而設置之畫 線部分8處，由於未形成有鈍態膜7之故，尤其是在裸 工C晶片4的肩緣部9會有發生短路之情形（肩部接觸現象 )，而有導致鄰接之導體圖案2的絕緣電阻値大幅降低之 問題。 本發明以提供一種於軟性回路基板與裸1C晶片連接 之際，不發生肩部接觸現象之連接材料爲目的。 用以解決課穎之手段 本發明者等，發現於用以連接薄膜狀的軟性回路基板 與裸1C晶片之連接材料中，藉由配合鱗片狀或纖維狀的 絕緣性塡料可達成本發明之目的，本發明於焉得以完成。 亦即，本發明在於提供一種連接材料，其係用以連接 軟性回路基板與裸1C晶片者；其特徵在於，係含有絕緣 性接著劑與分散於絕緣性接著劑中之鱗片狀或纖維狀之絕 緣性塡料。 發明之實施形態 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —^^ --------^--------- (請先閱讀背面之注咅？事項再填寫本頁) 1275625 A7 --_____B7__ 五、發明說明（；） 以下，就本發明詳細地加以說明。 本發明之連接材料，係用以連接軟性回路基板與裸工C 晶片者；其係於絕緣性接著劑中分散著鱗片狀或纖維狀之 絕緣性塡料者。鱗片狀或纖維狀的絕緣性塡料10，如圖1 所不般，於被包夾在裸1C晶片4的肩緣部9與軟性回路 基板3的導體圖案2之間時，由於不會被推擠出去而易固 定於該處，故可防止兩者的直接的接觸（肩部接觸現象）。 又，於球狀的絕緣性塡料的場合，由於在被包夾於其間之 時非常容易移動，故無法防止肩部接觸現象。 作爲本發明所使用之鱗片狀或纖維狀的絕緣性塡料， 爲使在裸1C晶片4的肩緣部9與軟性回路基板3的導體 圖案2之間不被推擠出去而易於包夾住，以使用寬厚比至 少20以上者爲佳，尤以30以上者更佳。此處之寬厚比， 於鱗片狀絕緣性塡料的場合，如圖2所示般，將厚度作爲 t，平面的大小（相當於將平面作爲近似於圓時之直徑）作 爲Φ時，係定義爲Φ/t，另一方面，於纖維狀絕緣性塡料 的場合5則如圖2 (b)所75般，將直徑作爲h，長度作爲L 時，係定義爲L/h之比。 又，以將寬厚比作爲20以上爲前提，於連接材料中 配合異向性連接用導電粒子之場合，爲不使發生因該導電 粒子導致電連接之阻礙之不良情形，鱗片狀絕緣性塡料的 厚度（t)以3//m以下爲佳，平面的大小（Φ )以60//m以 下爲佳。又，纖維狀絕緣性塡料的直徑（h)以l//m以下爲 佳，長度（L)以2〇/zm以下爲佳。 5 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 1275625 A7 ____________ 五、發明說明（> ) 作爲如上述般的鱗片狀絕緣性塡料的具體例，可列舉 如’雲母、滑石、膨潤土等，其中，就塡充性、電絕緣性 的方面考量，以雲母爲佳。又，作爲纖維狀絕緣性塡料的 具體例，可列舉如，鈦酸鉀晶鬚（whisker)、玻璃纖維、 硼酸鋁晶鬚、芳族聚醯胺纖維、碳化矽晶鬚等，其中，就 取得容易性、配合物的物性方面考量，以鈦酸鉀晶鬚爲佳 〇 本發明之連接材料中的絕緣性塡料之配合量，若太少 ，則對肩部接觸之防止效果不充分，若過多，則會妨礙電 氣連接，因此，以對絕緣性接著劑等之絕緣性塡料以外的 成分100重量份配合絕緣性塡料5~95重量份爲佳，而以 20~ 90重量份爲更佳。 作爲本發明之連接材料中所使用之絕緣性接著劑，可 使用向來用以連接軟性回路基板與裸1C晶片所用之絕緣 性接著劑。此般的絕緣性接著劑，可由各種熱固性樹脂所 構成，其爲例如，丙烯酸甲酯聚合物、乙烯-丙烯酸酯共 聚物、乙烯-丙烯酸共聚物、乙烯-醋酸乙烯共聚物、聚乙 烯、乙烯-丙烯共聚物、丙烯腈-丁二烯共聚物、苯乙烯-丁二烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物、 竣基化苯乙嫌乙稀-丁二烯-苯乙烯嵌段共聚物、環氧化 苯乙烯-乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯·異戊二 烯嵌段共聚物、聚丁二烯、乙烯-苯乙烯-丁烯嵌段共聚物 、聚乙烯醇縮丁醛、聚乙烯醇縮甲醛、苯氧樹脂、聚酯、 聚氨酯、聚醯胺、聚乙烯醇縮乙醛、聚乙烯醚、聚碾、 6 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） —“—_-------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 1275625 A7 _____B7___ 五、發明說明（罗） NBR、SBR、氯丁二烯橡膠、異氰酸酯聚合物、環氧樹脂、 矽酮樹脂、酚醛樹脂等。亦可使用光硬化性樹脂。此等可 單獨使用，亦可至少2種倂用，必要時，亦可使用硬化劑 及硬化觸媒。 又，於本發明之連接材料中，必要時，可配合通常的 添加劑’例如黏著賦予劑、老化防止劑、分散劑等。作爲 黏著賦予劑’可列舉如：秘稀樹脂、枯烯酣酸樹脂、松脂 類、二甲苯樹脂、烷基酚醛樹脂、二環戊二烯樹脂、色滿 (chroman)樹脂、芳香族系石油樹脂等。作爲老化防止劑 ，可列舉如：烷基酚類、硫醇類、磷酸酯類、胺類等。又 ，作爲分散劑，可列舉如：非離子系、陽離子系、陰離子 系、兩性之界面活性劑。 欲將本發明之連接材料發揮作爲異向性連接材料之機 能之場合，須使其含有異向性導電粒子。作爲此等異向性 連接用導電粒子，可利用向來用以作爲異向性導電連接之 際所使用者，例如可使用金、鎳、焊料等之金屬粒子、對 樹脂聚合物核被覆以金屬鍍層之粒子及進一步在金屬鍍層 的表面施以絕緣被覆之粒子。此等導電性粒子的粒徑可適 當地選擇。 又’此等異向性連接用導電粒子的配合量，若太少， 則難以確保確實的導通，若過多，則粒子彼此間互相接觸 致異向性連接會變得困難是可想像的，故對於配合入異向 性導電連接用導電粒子之前的連接材料100重量份，宜將 異向性導電連接用導電粒子設爲1~20重量份，而以3~12 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注音？事項再填寫本頁) f -------tTi — 争. 1275625 A7 — B7 五、發明說明（（） 重量份爲佳。 本發明之連接材料，可藉由將鱗片狀或纖維狀絕緣性 塡料以通常的方法使其分散於絕緣性接著劑中來製造。又 ，藉由亦使異向性連接用導電粒子分散於其中，而可製造 異向性導電連接材料。作爲此等連接材料之使用形態，必 要時，可作爲薄膜、作爲糊狀、或作爲高黏性液體使用。 使用本發明之連接材料或異向性導電連接材料，將軟 性回路基板與裸1C晶片連接所得之連接構造體，係爲可 防止肩p卩接觸現象之連接可靠性尚者。此處，作爲軟性回 路基板及裸1C晶片，固可使用與習知之軟性回路基板及 裸IC晶片相同者，惟，特別是突塊高度較低之裸1C晶片 及配線線距狹窄之軟性回路基板亦可使用。 實施例 以下，就本發明以實施例具體地加以說明。 實Mfi 1^7及比較例1~4 將表1中所示之配合成分，於甲苯3〇重量份中，依 通常的方法均一地混合，將得到之混合物以使乾燥膜厚成 爲3〇/zm之方式塗佈於經施以矽酮處理之聚對苯二甲酸乙 二醇酯薄膜上，經由乾燥製作成異向性導電連接薄膜。 將製作成之異向性導電連接薄膜，於突塊間距爲85// m之1C晶片（晶片尺寸爲6.3mm四方；經析鍍之突塊的尺 寸爲45 χ45//τη、突塊間隔爲40//m、突塊高度爲10// m)及設置有12//111厚的銅圖案端子（有Ni/Au鍍層）之25 //m厚之聚醯胺絕緣薄膜之間進行對位而被包夾於其間， 8 本ϋΓ尺度適用中國g標準（CNS)A4規格（210 X 297公釐1 一"" " (請先閱讀背面之注意事項再填寫本頁) -------IT--------- A7 1275625 _B7 五、發明說明（7 ) 在190°C的溫度、160N的壓力下施以10秒鐘壓接，得到 連接構造體。對所得之連接構造體，藉由4端子法測定銅 圖案端子的初期接觸電阻値及1C晶片與銅圖案端子之間 的絕緣電阻値。所得之結果示於表2。
又，初期電阻値以較低爲佳，實用上期望爲lOOmQ
以下。又，絕緣電阻値以較高爲佳，實用上期望爲1 X 1〇6Ω以上。 表1 (重量份) 成分 實施例 7 比較例 4 1 2 3 4 5 6 1 2 3 環氧樹脂W1 43 43 43 43 43 43 43 43 43 43 43 環氧樹脂A% 20 20 20 20 20 20 20 20 20 20 20 胺系硬化劑” 25 25 25 25 25 25 25 25 25 25 25 導電性粒子*4 12 12 12 12 12 12 - 12 12 12 12 鱗片狀絕緣塡料*5 10 30 80 - - - 80 - - - - 纖維狀絕緣塡料*6 - - - 10 30 80 球狀絕緣塡料*7 10 30 80 - *1 :艾皮蔻特1009，油化殼牌環氧公司製 *2 :艾皮蔻特828，油化殼牌環氧公司製 *3 : 3941Ρ，旭化成公司製 *4 :布萊特200GNR，日本合成化學公司製 *5 :微粉雲母ΜΚ-100，蔻普化學公司製 (t = l//m、Φ=3 5//τη、寬厚比（t/0>)=3 5) *6 :狄斯摩D，大塚化學公司製 (h=0.5//m、L=15//m、寬厚比(h/L)=30) *7 : SO-E5，龍森公司製 9 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 !——f -------訂---------拳 (請先閱讀背面之注意事項再填寫本頁) 1275625 A7 五、發明說明（f ) 初期接觸雷阳ίιηΩ) 絕緣電阻（Ω) 實施例1 Ί 1 Χ108< 2 7 1 χιο10< 3 8 1 χιο10< 4 7 1 Χ108< 5 8 1 χιο10< 6 8 1 Χ101〇< 7 Ί 1 χιο10< 比較例1 7 1 Χ106< 2 7 1 Χ106< 3 7 1 Χ106< 4 7 1 Χ106< 由表2可得知：含有鱗片狀或纖維狀絕緣性塡料之實 施例1〜7之連接材料，其初期接觸電阻及絕緣電阻雙方的 値均爲實用上所喜用者。 然而，不含鱗片狀或纖維狀絕緣性塡料，而含有球狀 絕緣性塡料之比較例1~4之連接材料，雖有關其初期接觸 電阻並無問題，惟，絕緣電阻降低至1 Χ106Ω，可知無 法充分防止肩部接觸現象。 發明之效果 藉由本發明之連接材料，於連接軟性回路基板與裸IC 晶片之際，可於不發生肩部接觸現象之狀況下進行連接。 圖式之簡單說明 圖1 :爲用本發明之連接材料連接之裸1C晶片與軟性 回路基板之間的肩緣部的部分放大圖。 圖2:爲本發明中所使用之鱗片狀絕緣性塡料之立體 圖（a)與纖維狀絕緣性塡料之立體圖（b)。 10 ----1 —------------訂---------^9— (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1275625 A7 _B7 五、發明說明（？） 圖3 : 習知的COF連接之說明圖。 圖4 : 習知的COF連接的缺點之說明圖 圖5 : 習知的COF連接的缺點之說明圖 符號說明 1 絕緣性薄膜 2 導體圖案 3 軟性回路基板 4 裸1C晶片 5 突塊 6 異向性導電薄膜 7 鈍態膜 8 畫線部分 9 肩緣部 10 絕緣性塡料 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）

Claims (1)

1275625 AH . B8 C8 D8 t、申請專利範圍
1· 一種連接材料，係用以連接軟性回路基板與裸工c 晶片；其特徵在於，係含有絕緣性接著劑與分散於絕緣性 接著劑中之鱗片狀或纖維狀之絕緣性塡料； 於連接材料中，相對於絕緣性塡料以外之成分1GQ胃 量份含會2Q~9Q重量份的絕緣性塡料； 鱗片狀絕緣性塡料係雲母，纖維狀絕緣性塡料係鈦酸 绅晶鬚。 2·如申請專利範圍第1項之連接材料，其中，鱗片 狀或纖維狀之絕緣性塡料之寬厚比爲至少2〇。 3 · —種異向性導電連接材料，係相對申請專利範園 第1或2項之連接材料1Q0重裊份含有1〜2〇重量份的異 向性導電連接用導電粒子。 4· 一種連接構造體，係以申請專利範圍第i或2項 之連接材料將軟性回路基板與裸1(：晶片做連接者。 5· —種連接構造體，係以申請專利範圍第3項之異 向性導電連接材料將軟性回路基扳與裸晶片做連接者 ! .Ψ — C請先間讀背面之注意事項存瑱寫本頁) 訂 用中國國家標準(CNS)A4規格(2i0 X 297公^
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US6611065B2 (en) 2003-08-26
CN1356368A (zh) 2002-07-03
CN1234794C (zh) 2006-01-04
JP2002170910A (ja) 2002-06-14

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