JPH06187834A - 異方導電フィルム - Google Patents

異方導電フィルム

Info

Publication number
JPH06187834A
JPH06187834A JP4338985A JP33898592A JPH06187834A JP H06187834 A JPH06187834 A JP H06187834A JP 4338985 A JP4338985 A JP 4338985A JP 33898592 A JP33898592 A JP 33898592A JP H06187834 A JPH06187834 A JP H06187834A
Authority
JP
Japan
Prior art keywords
particles
metal
conductive film
circuit
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4338985A
Other languages
English (en)
Other versions
JP2948038B2 (ja
Inventor
Masakazu Kawada
政和 川田
Toshirou Komiyatani
壽郎 小宮谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP4338985A priority Critical patent/JP2948038B2/ja
Publication of JPH06187834A publication Critical patent/JPH06187834A/ja
Application granted granted Critical
Publication of JP2948038B2 publication Critical patent/JP2948038B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Abstract

(57)【要約】 【構成】 高分子核材１の表面に金属被覆２を施した金
属被覆粒子３と、これよりも硬度が低くかつ粒径が大き
い金属粒子４を、絶縁性接着剤樹脂５に分散させた異方
導電フィルム。 【効果】 被接続体の相対する端子の間隙にばらつきの
ある場合でも、容易に全端子にわたって高い接続信頼性
が得られる。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、微細な回路同志の電気
的接続、更に詳しくはＬＣＤ（液晶ディスプレイ）とフ
レキシブル回路基板の接続や、半導体ＩＣとＩＣ搭載用
基板のマイクロ接合等に用いることのできる異方導電フ
ィルムに関するものである。
【０００２】
【従来の技術】最近の電子機器の小型化、薄型化に伴
い、微細な回路同志の接続、微小部分と微細な回路の接
続等の必要性が飛躍的に増大してきており、その接続方
法として、半田接合技術の進展と共に新しい材料として
異方性の導電接着剤やフィルムが使用されている（例え
ば、特開昭５９−１２０４３６、６０−１９１２２８、
６０−８４７１８、６１−２７４３９４、６１−５５８
０９、６１−２８７９７４、６２−２４４１４２、６３
−１５３５３４、６３−３０５５９１、６４−４７０８
４、６４−８１８７８、特開平１−４６５４９、１−２
５１７８７各号公報等）。
【０００３】この方法は、接続しようとする回路間に所
定量の導電性粒子を含有する接着剤またはフィルムを挟
み、所定の温度・圧力・時間により熱圧着することによ
って、回路間の電気的接続を行なうと同時に、隣接する
回路間には絶縁性を確保させるものである。
【０００４】この異方導電接着剤やフィルムに含まれて
いる導電粒子には、一般的には金属粒子や高分子核材に
金属被覆を施したものが用いられている。金属粒子の場
合、半田粒子等の柔らかいものが用いられる場合が多
く、相対する回路端子間の間隙ばらつきを吸収して回路
端子間の接触面積を大きくとることができ、安定した導
通性が得られるという長所があった。しかしながら、反
面微細な回路同士の接続をするために導電粒子の粒度分
布を揃え隣接端子間の電気的短絡を防ぐことが困難であ
り、高温高湿度放置試験や高温放置試験等の処理を施し
た場合に、金属粒子の酸化等の変化が生じ接続が不安定
になる等の問題があった。また高分子核材に金属被覆を
施した粒子の場合、作製方法によっては高分子核材粒子
の粒度分布を極めてシャープにできるため、微細な回路
接続にも対応でき、更に金被覆が用いられる場合が多い
こともあり、前述のような長期環境処理による粒子表面
の酸化等の変化は少ないという長所がある。しかしなが
ら、反面相対する回路端子間の間隙ばらつきが５μｍ以
上もある場合には、導電粒子の端子への接触が不安定に
なり安定した接続性が得られないという問題があった。
【０００５】
【発明が解決しようとする課題】本発明は、このような
従来の欠点に鑑み種々の検討の結果なされたものであ
り、その目的とするところは、微細な回路接続にも対応
でき、相対する回路端子間の間隙ばらつきも吸収するこ
とのできる接続信頼性の高い異方導電フィルムを提供す
るものである。
【０００６】
【課題を解決するための手段】すなわち、本発明は絶縁
性接着剤樹脂中に導電性粒子を分散させた異方導電フィ
ルムにおいて、該導電性粒子が高分子核材の表面に金属
被覆を施したものと、これよりも硬度が低くかつ粒径が
大きい金属粒子とからなる異方導電性フィルムである。
【０００７】以下、図面で本発明を詳細に説明する。図
１は、本発明による異方導電フィルムの断面模式図であ
り、図２は本発明による異方導電フィルムを用いた回路
の接続状態を示す断面図である。
【０００８】この異方導電フィルムは、高分子核材１の
表面に金属被覆２を施した金属被覆粒子３と、これより
も硬度が低くかつ粒径が大きい金属粒子４が絶縁性接着
剤５に分散さているのが特徴である。図２に示すように
回路基板７、７′をこの異方導電フィルムを用いて接続
した場合、端子８、８′の間の間隙が各端子でばらつき
があり、金属被覆粒子では接続できない端子には大きな
柔らかい金属粒子がその段差を吸収して接続を保つこと
ができ、また金属粒子の割合を減らすことにより、隣接
端子間の短絡を防ぎ微細な回路接続にも対応が可能とな
る。
【０００９】本発明に用いられる金属粒子４は金属被覆
粒子３よりも硬度が低く粒径が大きいものであれば、特
にその硬度、粒径、含有量を制限するものではないが、
接続する回路端子ピッチ、端子厚さばらつき等により最
適値を選択する方が望ましい。例えば、異方導電フィル
ムの主要な用途である液晶ディスプレイパネルとフレキ
シブル回路基板（以下ＦＰＣという）との接続では、金
属粒子及び金属被覆粒子径は０．５〜５０μｍ程度で、
かつ絶縁性接着剤に対する配合量は、１〜１０体積％が
好ましい。また、このときの金属粒子の割合は、金属粒
子及び金属被覆粒子の総量中に２０〜８０体積％である
ほうが好ましい。これよりも粒子径が小さい場合や配合
量が少ない場合には接続面積が少なくなるため接続信頼
性が低下し、逆に粒子径が大きい場合や配合量が多い場
合には隣接端子間の絶縁性が低下し短絡の発生にもつな
がる。
【００１０】本発明に用いられる金属被覆粒子３は、そ
の組成に特には制限されない。例えば、高分子核材１で
はエポキシ樹脂、ウレタン樹脂、メラミン樹脂、フェノ
ール樹脂、アクリル樹脂、ポリエステル樹脂、スチレン
樹脂、スチレンブタジエン共重合体等のポリマー中から
１種あるいは２種以上組合せて使用すればよい。また、
金属被覆２には金、ニッケル、銀、銅、亜鉛、錫、イン
ジウム、パラジウム、アルミニウム等が挙げられ、これ
らを組合せてもよい。勿論これらの高分子核材の選択に
は、両者の密着力等を考慮して組合せた方がよいことは
いうまでもない。
【００１１】金属被覆厚さには特に制限はないが、薄す
ぎると導電性が不安定になり、厚すぎると粒子変形が困
難になったり凝集等が生じるため、０．０１〜１μｍ程
度が好ましい。無電解メッキ等により均一に被覆されて
いる方がより好ましい。
【００１２】本発明に用いられる金属粒子４は、特にそ
の組成に制限はないが、従来よりこの分野において使用
されている、例えば金、銀、銅、亜鉛、錫、半田、イン
ジウム、パラジウム等が挙げられ、これらを組合せても
よい。
【００１３】本発明に用いられる接着剤５は、絶縁性を
示すものであれば、熱可塑性、熱硬化性、光硬化性等、
特に制限はない。例えばスチレンブタジエン樹脂、スチ
レン樹脂、エチレン酢酸ビニル樹脂、アクリルニトリル
ブタジエンゴム、シリコーン樹脂、アクリル樹脂、エポ
キシ樹脂、ウレタン樹脂、フェノール樹脂、アミド樹
脂、エポキシメタクリレート系をはじめとするアクリレ
ート系樹脂等が挙げられ、必要に応じて２種以上の樹脂
を組合せればよい。また、必要に応じて粘着付与剤、架
橋剤、老化防止剤、カップリング剤等を併用してもよ
い。
【００１４】
【実施例】以下、本発明による実施例及び従来方法によ
る比較例を示す。 実施例１ エポキシ樹脂（エピコート１００４、油化シエルエポキ
シ（株）製）８０重量部、フェノール樹脂（ＰＲ−１２
６８６、住友デュレズ（株）製）４０重量部、アクリル
ニトリルブタジエン共重合体（ＮＳ２２０ＳＨ、日本合
成ゴム（株））１５重量部、１−ベンジル２−メチルイ
ミダゾール（四国化成（株）製）５重量部を混合した熱
硬化性接着剤に、メラミン樹脂を核材とし厚さ０．３μ
ｍのニッケルと０．１μｍの金を無電解メッキした平均
粒径８μｍ、最大粒径１２μｍの分布を有する金属被覆
粒子を２体積％と、平均粒径１５μｍ、最大粒径３０μ
ｍの分布を有する半田粒子を２体積％を分散させ、異方
導電フィルムを作製した。
【００１５】この異方導電フィルムを、回路幅０．１ｍ
ｍ、回路ピッチ０．２ｍｍ、１６０端子を有するＦＰＣ
と、表面にインジウムを蒸着したガラス基板との間に挟
み、１７５℃、３０Ｋｇ／ｃｍ2、２０ｓｅｃの条件で
熱圧着により接続した。ここで用いたＦＰＣは、７５μ
ｍのポリイミド基材と３５μｍの銅箔からできたもので
あり、回路加工後表面を半田メッキしたものである。
【００１６】この接続体を高温高湿度試験（８５℃、８
５％ＲＨ）処理をし、隣接端子間の接続抵抗値を観察し
た結果、１０００時間処理後も初期からの接続抵抗上昇
も全端子で５Ω以下と良好な接続性が得られた。
【００１７】比較例１ 実施例１と同じ接着剤に、同じ金属粒子のみ４体積％分
散させたものを作製し、同様の高温高湿度試験による評
価を行った結果、１０００時間処理後の接続抵抗値が初
期に比較して、全端子で１０Ω以上上昇した。
【００１８】比較例２ 実施例１と同じ接着剤に、同じ金属被覆粒子のみ４体積
％分散させたものを作製し、同様の高温高湿度試験によ
る評価を行った結果、１０００時間処理後の接続抵抗値
が初期に比較して、約２／３の端子は５Ω以下であった
が、約１／３の端子は１０Ω以上上昇し、各端子間で接
続信頼性に差が見られた。
【００１９】
【発明の効果】本発明によると、従来問題であった回路
端子の厚さにばらつきがある場合にも全端子にわたって
高い接続信頼性を得ることが可能である。また、ガラス
基板とＦＰＣの接続だけでなく、プリント回路基板とＦ
ＰＣやＩＣと基板の接続においても容易に高い接続信頼
性を得ることができる。
【図面の簡単な説明】
【図１】図１は、本発明による異方導電フィルムの断面
模式図。
【図２】図２は、本発明による異方導電フィルムを用い
た回路の接続状態を示す断面図。

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 絶縁性接着剤樹脂中に導電性粒子を分散
    させた異方導電フィルムにおいて、該導電性粒子が高分
    子核材の表面に金属被覆を施したものと、これよりも硬
    度が低くかつ粒径が大きい金属粒子とからなることを特
    徴とする異方導電性フィルム。
JP4338985A 1992-12-18 1992-12-18 異方導電フィルム Expired - Fee Related JP2948038B2 (ja)

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JPH10270055A (ja) * 1997-03-25 1998-10-09 Mitsubishi Electric Corp 電気化学触媒並びにそれを用いた電気化学反応装置、電気化学素子、リン酸型燃料電池およびメタノール直接型燃料電池
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP1002844A2 (de) * 1998-11-21 2000-05-24 Beiersdorf Aktiengesellschaft Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie
JP2002237216A (ja) * 2001-02-09 2002-08-23 Bridgestone Corp 異方性導電フィルム
JP2006339613A (ja) * 2005-06-06 2006-12-14 Alps Electric Co Ltd 配線接続構造および液晶表示装置
WO2014046093A1 (ja) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 異方性導電接着剤
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
EP2899244A4 (en) * 2012-09-24 2016-06-01 Dexerials Corp ANISOTROPIC CONDUCTIVE ADHESIVE AND JUNCTION STRUCTURE
KR101678178B1 (ko) * 2016-04-08 2016-11-21 주식회사 일렉켐스 전기 또는 전자 부품 접속용 이방도전성 접착 조성물
CN106233397A (zh) * 2014-04-24 2016-12-14 拓自达电线株式会社 金属覆盖树脂颗粒及使用其的导电性粘接剂
JP2017066367A (ja) * 2015-09-30 2017-04-06 太陽インキ製造株式会社 導電性接着剤、電子部品および電子部品の製造方法
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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270055A (ja) * 1997-03-25 1998-10-09 Mitsubishi Electric Corp 電気化学触媒並びにそれを用いた電気化学反応装置、電気化学素子、リン酸型燃料電池およびメタノール直接型燃料電池
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP0996321A3 (en) * 1998-10-22 2003-02-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP1002844A2 (de) * 1998-11-21 2000-05-24 Beiersdorf Aktiengesellschaft Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie
EP1002844A3 (de) * 1998-11-21 2000-10-11 Beiersdorf Aktiengesellschaft Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie
JP2002237216A (ja) * 2001-02-09 2002-08-23 Bridgestone Corp 異方性導電フィルム
JP2006339613A (ja) * 2005-06-06 2006-12-14 Alps Electric Co Ltd 配線接続構造および液晶表示装置
JP4575845B2 (ja) * 2005-06-06 2010-11-04 アルプス電気株式会社 配線接続構造および液晶表示装置
WO2014046093A1 (ja) * 2012-09-24 2014-03-27 デクセリアルズ株式会社 異方性導電接着剤
JP2014065766A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
CN104662118A (zh) * 2012-09-24 2015-05-27 迪睿合电子材料有限公司 各向异性导电粘接剂
EP2899244A4 (en) * 2012-09-24 2016-06-01 Dexerials Corp ANISOTROPIC CONDUCTIVE ADHESIVE AND JUNCTION STRUCTURE
US9676066B2 (en) 2012-09-24 2017-06-13 Dexerials Corporation Anisotropic conductive adhesive
TWI626293B (zh) * 2012-09-24 2018-06-11 Dexerials Corp Anisotropic conductive adhesive
WO2015056754A1 (ja) * 2013-10-17 2015-04-23 デクセリアルズ株式会社 異方性導電接着剤及び接続構造体
CN106233397A (zh) * 2014-04-24 2016-12-14 拓自达电线株式会社 金属覆盖树脂颗粒及使用其的导电性粘接剂
JP2017066367A (ja) * 2015-09-30 2017-04-06 太陽インキ製造株式会社 導電性接着剤、電子部品および電子部品の製造方法
KR101678178B1 (ko) * 2016-04-08 2016-11-21 주식회사 일렉켐스 전기 또는 전자 부품 접속용 이방도전성 접착 조성물
CN107501852A (zh) * 2017-07-24 2017-12-22 仲恺农业工程学院 一种液晶电路保护用组合物及其制备方法

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