TWI270956B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
TWI270956B
TWI270956B TW092112464A TW92112464A TWI270956B TW I270956 B TWI270956 B TW I270956B TW 092112464 A TW092112464 A TW 092112464A TW 92112464 A TW92112464 A TW 92112464A TW I270956 B TWI270956 B TW I270956B
Authority
TW
Taiwan
Prior art keywords
processing
substrate
processed
accumulated
processing unit
Prior art date
Application number
TW092112464A
Other languages
English (en)
Chinese (zh)
Other versions
TW200400584A (en
Inventor
Masahiro Numakura
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200400584A publication Critical patent/TW200400584A/zh
Application granted granted Critical
Publication of TWI270956B publication Critical patent/TWI270956B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32315—Machine with least work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW092112464A 2002-05-15 2003-05-07 Substrate processing apparatus and substrate processing method TWI270956B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002139775A JP4334817B2 (ja) 2002-05-15 2002-05-15 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW200400584A TW200400584A (en) 2004-01-01
TWI270956B true TWI270956B (en) 2007-01-11

Family

ID=29544905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092112464A TWI270956B (en) 2002-05-15 2003-05-07 Substrate processing apparatus and substrate processing method

Country Status (5)

Country Link
JP (1) JP4334817B2 (https=)
KR (1) KR100949013B1 (https=)
CN (1) CN1321448C (https=)
TW (1) TWI270956B (https=)
WO (1) WO2003098684A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491662B2 (en) * 2004-05-17 2009-02-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
CN101213640B (zh) * 2006-02-07 2010-08-04 东京毅力科创株式会社 基板处理装置的控制装置及基板处理装置的控制方法
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP5128080B2 (ja) * 2006-03-29 2013-01-23 東京エレクトロン株式会社 基板処理装置の制御装置およびその制御方法
JP2008135517A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP2008311365A (ja) * 2007-06-13 2008-12-25 Hitachi Kokusai Electric Inc 基板処理装置
JP5115727B2 (ja) * 2008-06-11 2013-01-09 Ｎｅｃアクセステクニカ株式会社 検査システム、検査方法および検査結果情報格納装置ならびに制御端末
JP5571122B2 (ja) * 2012-06-06 2014-08-13 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体
US9947566B2 (en) 2014-03-25 2018-04-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
JP6089082B1 (ja) * 2015-09-29 2017-03-01 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
JP6704008B2 (ja) * 2018-03-26 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7170438B2 (ja) * 2018-07-03 2022-11-14 東京エレクトロン株式会社 基板処理装置及び判定方法
JP6719523B2 (ja) 2018-09-18 2020-07-08 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7582289B2 (ja) * 2022-12-23 2024-11-13 株式会社Sumco 半導体製造装置、半導体製造工場及び半導体製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624595A (ja) * 1992-07-08 1994-02-01 Fuji Xerox Co Ltd 記録装置
TW442891B (en) 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
JP2001093791A (ja) 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法

Also Published As

Publication number Publication date
KR20040104734A (ko) 2004-12-10
CN1653606A (zh) 2005-08-10
JP2003332405A (ja) 2003-11-21
JP4334817B2 (ja) 2009-09-30
WO2003098684A1 (en) 2003-11-27
CN1321448C (zh) 2007-06-13
KR100949013B1 (ko) 2010-03-23
TW200400584A (en) 2004-01-01

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