CN1321448C - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN1321448C
CN1321448C CNB038110636A CN03811063A CN1321448C CN 1321448 C CN1321448 C CN 1321448C CN B038110636 A CNB038110636 A CN B038110636A CN 03811063 A CN03811063 A CN 03811063A CN 1321448 C CN1321448 C CN 1321448C
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China
Prior art keywords
processing
substrate
processed
processing section
load lock
Prior art date
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Expired - Lifetime
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CNB038110636A
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English (en)
Chinese (zh)
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CN1653606A (zh
Inventor
沼仓雅博
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1653606A publication Critical patent/CN1653606A/zh
Application granted granted Critical
Publication of CN1321448C publication Critical patent/CN1321448C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32315—Machine with least work
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB038110636A 2002-05-15 2003-05-02 基板处理装置和基板处理方法 Expired - Lifetime CN1321448C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP139775/2002 2002-05-15
JP2002139775A JP4334817B2 (ja) 2002-05-15 2002-05-15 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
CN1653606A CN1653606A (zh) 2005-08-10
CN1321448C true CN1321448C (zh) 2007-06-13

Family

ID=29544905

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038110636A Expired - Lifetime CN1321448C (zh) 2002-05-15 2003-05-02 基板处理装置和基板处理方法

Country Status (5)

Country Link
JP (1) JP4334817B2 (https=)
KR (1) KR100949013B1 (https=)
CN (1) CN1321448C (https=)
TW (1) TWI270956B (https=)
WO (1) WO2003098684A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106558516A (zh) * 2015-09-29 2017-04-05 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491662B2 (en) * 2004-05-17 2009-02-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
CN101213640B (zh) * 2006-02-07 2010-08-04 东京毅力科创株式会社 基板处理装置的控制装置及基板处理装置的控制方法
JP5091413B2 (ja) * 2006-03-08 2012-12-05 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP5128080B2 (ja) * 2006-03-29 2013-01-23 東京エレクトロン株式会社 基板処理装置の制御装置およびその制御方法
JP2008135517A (ja) * 2006-11-28 2008-06-12 Tokyo Electron Ltd 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
JP2008311365A (ja) * 2007-06-13 2008-12-25 Hitachi Kokusai Electric Inc 基板処理装置
JP5115727B2 (ja) * 2008-06-11 2013-01-09 Ｎｅｃアクセステクニカ株式会社 検査システム、検査方法および検査結果情報格納装置ならびに制御端末
JP5571122B2 (ja) * 2012-06-06 2014-08-13 東京エレクトロン株式会社 基板処理装置および基板処理装置の制御方法
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、プログラムおよび記録媒体
US9947566B2 (en) 2014-03-25 2018-04-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
JP6704008B2 (ja) * 2018-03-26 2020-06-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7170438B2 (ja) * 2018-07-03 2022-11-14 東京エレクトロン株式会社 基板処理装置及び判定方法
JP6719523B2 (ja) 2018-09-18 2020-07-08 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、半導体装置の製造方法および記録媒体
JP7582289B2 (ja) * 2022-12-23 2024-11-13 株式会社Sumco 半導体製造装置、半導体製造工場及び半導体製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0624595A (ja) * 1992-07-08 1994-02-01 Fuji Xerox Co Ltd 記録装置
TW442891B (en) 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106558516A (zh) * 2015-09-29 2017-04-05 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
CN106558516B (zh) * 2015-09-29 2019-07-30 株式会社国际电气 衬底处理装置及半导体器件的制造方法

Also Published As

Publication number Publication date
KR20040104734A (ko) 2004-12-10
CN1653606A (zh) 2005-08-10
JP2003332405A (ja) 2003-11-21
JP4334817B2 (ja) 2009-09-30
WO2003098684A1 (en) 2003-11-27
TWI270956B (en) 2007-01-11
KR100949013B1 (ko) 2010-03-23
TW200400584A (en) 2004-01-01

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Granted publication date: 20070613