TWI264853B - Connector for testing a semiconductor package - Google Patents

Connector for testing a semiconductor package

Info

Publication number
TWI264853B
TWI264853B TW094141239A TW94141239A TWI264853B TW I264853 B TWI264853 B TW I264853B TW 094141239 A TW094141239 A TW 094141239A TW 94141239 A TW94141239 A TW 94141239A TW I264853 B TWI264853 B TW I264853B
Authority
TW
Taiwan
Prior art keywords
connector
conductive silicone
powder
conductive
semiconductor package
Prior art date
Application number
TW094141239A
Other languages
English (en)
Other versions
TW200623540A (en
Inventor
Young-Bae Chung
Hyun-Seop Shim
Jeong-Ho Bang
Jae-Il Lee
Hun-Kyo Seo
Original Assignee
Samsung Electronics Co Ltd
Isc Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd, Isc Technology Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200623540A publication Critical patent/TW200623540A/zh
Application granted granted Critical
Publication of TWI264853B publication Critical patent/TWI264853B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
TW094141239A 2004-12-06 2005-11-24 Connector for testing a semiconductor package TWI264853B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040101799A KR20060062824A (ko) 2004-12-06 2004-12-06 반도체 패키지 테스트용 실리콘 커넥터

Publications (2)

Publication Number Publication Date
TW200623540A TW200623540A (en) 2006-07-01
TWI264853B true TWI264853B (en) 2006-10-21

Family

ID=36571333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141239A TWI264853B (en) 2004-12-06 2005-11-24 Connector for testing a semiconductor package

Country Status (6)

Country Link
US (1) US7438563B2 (zh)
JP (1) JP2006162617A (zh)
KR (1) KR20060062824A (zh)
CN (1) CN100582785C (zh)
DE (1) DE102005058757A1 (zh)
TW (1) TWI264853B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381165B (zh) * 2008-03-31 2013-01-01 Leeno Ind Inc 用於測試半導體晶片之插座
TWI778778B (zh) * 2020-09-25 2022-09-21 南韓商Ｔｓｅ有限公司 測試插座及包括其的測試設備

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KR100911892B1 (ko) * 2008-04-08 2009-08-11 리노공업주식회사 반도체 칩 검사용 소켓
KR100926776B1 (ko) * 2008-05-06 2009-11-16 주식회사 아이에스시테크놀러지 테스트용 소켓의 제작방법
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KR101967401B1 (ko) * 2017-12-29 2019-04-10 에스케이하이닉스 주식회사 테스트 소켓
KR101911496B1 (ko) 2018-04-13 2018-12-28 황동원 반도체 디바이스 테스트 소켓장치
KR101930866B1 (ko) 2018-08-08 2018-12-20 황동원 반도체 디바이스 테스트용 콘택트 및 소켓장치
KR102036105B1 (ko) 2018-11-06 2019-10-24 (주)티에스이 신호 전송 커넥터
KR20200017314A (ko) 2018-11-16 2020-02-18 황동원 반도체 디바이스 테스트용 콘택트 및 소켓장치
KR102079213B1 (ko) 2018-11-28 2020-02-19 (주)티에스이 신호 전송 커넥터
KR102244246B1 (ko) * 2019-10-15 2021-04-27 주식회사 이노글로벌 도전 라인 주변에 완충 영역이 형성된 테스트 소켓
KR102222200B1 (ko) 2019-10-22 2021-03-03 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102212872B1 (ko) 2020-01-23 2021-02-05 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102218626B1 (ko) 2020-01-23 2021-02-22 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102220168B1 (ko) 2020-01-23 2021-02-25 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102220172B1 (ko) 2020-03-03 2021-02-25 (주)티에스이 신호 전송 커넥터
KR102211358B1 (ko) 2020-03-19 2021-02-03 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR102179457B1 (ko) 2020-03-25 2020-11-16 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치와, 테스트 소켓의 제조방법
KR102257740B1 (ko) 2020-05-19 2021-05-28 (주)티에스이 테스트 소켓용 절연 필름 및 이를 포함하는 테스트 소켓
KR102271503B1 (ko) 2020-05-25 2021-07-01 (주)티에스이 신호 전송 커넥터
KR102410156B1 (ko) 2020-06-02 2022-06-17 (주)티에스이 반도체 패키지의 테스트 장치
KR102342480B1 (ko) * 2020-08-21 2021-12-23 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치
KR102471471B1 (ko) 2020-11-25 2022-11-28 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102576178B1 (ko) 2021-07-14 2023-09-07 주식회사 티에스이 테스트 소켓, 그 테스트 소켓을 포함하는 테스트 장치, 및 그 테스트 소켓 제조방법
KR102530618B1 (ko) 2021-07-14 2023-05-09 (주)티에스이 테스트 소켓, 그 테스트 소켓을 포함하는 테스트 장치, 및 그 테스트 소켓의 제조방법
KR102661984B1 (ko) 2021-10-12 2024-04-30 주식회사 티에스이 신호 전송 커넥터
KR20240045513A (ko) 2022-09-30 2024-04-08 (주)티에스이 신호 전송 커넥터

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381165B (zh) * 2008-03-31 2013-01-01 Leeno Ind Inc 用於測試半導體晶片之插座
TWI778778B (zh) * 2020-09-25 2022-09-21 南韓商Ｔｓｅ有限公司 測試插座及包括其的測試設備

Also Published As

Publication number Publication date
US20060121757A1 (en) 2006-06-08
JP2006162617A (ja) 2006-06-22
TW200623540A (en) 2006-07-01
CN1808125A (zh) 2006-07-26
US7438563B2 (en) 2008-10-21
KR20060062824A (ko) 2006-06-12
CN100582785C (zh) 2010-01-20
DE102005058757A1 (de) 2006-06-22

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