TWI254193B - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

Info

Publication number
TWI254193B
TWI254193B TW092100629A TW92100629A TWI254193B TW I254193 B TWI254193 B TW I254193B TW 092100629 A TW092100629 A TW 092100629A TW 92100629 A TW92100629 A TW 92100629A TW I254193 B TWI254193 B TW I254193B
Authority
TW
Taiwan
Prior art keywords
film
substrate
substrate processing
treatment
processing
Prior art date
Application number
TW092100629A
Other languages
English (en)
Chinese (zh)
Other versions
TW200302404A (en
Inventor
Mitsuru Ushijima
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200302404A publication Critical patent/TW200302404A/zh
Application granted granted Critical
Publication of TWI254193B publication Critical patent/TWI254193B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Coating Apparatus (AREA)
TW092100629A 2002-01-22 2003-01-13 Substrate processing apparatus and substrate processing method TWI254193B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002013236A JP3959612B2 (ja) 2002-01-22 2002-01-22 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW200302404A TW200302404A (en) 2003-08-01
TWI254193B true TWI254193B (en) 2006-05-01

Family

ID=27650242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092100629A TWI254193B (en) 2002-01-22 2003-01-13 Substrate processing apparatus and substrate processing method

Country Status (4)

Country Link
JP (1) JP3959612B2 (ko)
KR (1) KR100917728B1 (ko)
CN (1) CN1279580C (ko)
TW (1) TWI254193B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4481698B2 (ja) 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
JP4994074B2 (ja) * 2006-04-20 2012-08-08 東京エレクトロン株式会社 基板洗浄装置，基板洗浄方法，基板処理装置
JP4983565B2 (ja) * 2006-12-20 2012-07-25 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
CN101230466B (zh) * 2007-01-24 2010-09-01 沈阳工业大学 一种脱胶液
JP6418932B2 (ja) * 2014-12-15 2018-11-07 東京応化工業株式会社 紫外線照射装置、紫外線照射方法、基板処理装置、及び基板処理装置の製造方法
KR102156895B1 (ko) * 2018-11-06 2020-09-17 세메스 주식회사 기판 처리 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100264006B1 (ko) 1993-11-29 2000-08-16 이형도 고온초전도 조셉슨소자의 제조방법
TW394980B (en) * 1998-02-05 2000-06-21 Samsung Electronics Co Ltd Semiconductor device fabrication system and method of forming semiconductor device pattern using the same
JP3752420B2 (ja) 1999-11-11 2006-03-08 東京エレクトロン株式会社 薄膜除去装置
JP2001297962A (ja) 2000-04-12 2001-10-26 Toppan Printing Co Ltd 基板外周部の残渣除去装置

Also Published As

Publication number Publication date
TW200302404A (en) 2003-08-01
KR20030063219A (ko) 2003-07-28
KR100917728B1 (ko) 2009-09-15
CN1434481A (zh) 2003-08-06
JP2003218007A (ja) 2003-07-31
JP3959612B2 (ja) 2007-08-15
CN1279580C (zh) 2006-10-11

Similar Documents

Publication Publication Date Title
TWI267129B (en) Coating and developing apparatus, exposure apparatus and resist pattern forming method
TWI390590B (zh) 基板洗淨裝置
JP5014811B2 (ja) 基板の処理方法
TWI323924B (en) Substrate transportation device, substrate transportation method and coating-developing apparatus
JP5448536B2 (ja) レジスト塗布現像装置およびレジスト塗布現像方法、並びにレジスト膜処理装置およびレジスト膜処理方法
US6062288A (en) Processing apparatus
JP3694641B2 (ja) 基板処理装置、現像処理装置及び現像処理方法
JP4090648B2 (ja) 膜形成方法及び膜形成装置
US10591820B2 (en) Substrate processing apparatus and substrate processing method
WO2006009046A1 (ja) 現像処理装置及び現像処理方法
TW200842940A (en) Substrate processing apparatus
TWI254193B (en) Substrate processing apparatus and substrate processing method
TWI234796B (en) Solution treatment method and solution treatment unit
JP3456919B2 (ja) 基板処理方法および基板処理装置
US20080070167A1 (en) Exposure and developing method
JP2006049757A (ja) 基板処理方法
JP3887549B2 (ja) 基板搬送装置
JP4804332B2 (ja) ベーキング装置及び基板処理装置
JP2004146651A (ja) レジスト塗布方法及びレジスト塗布装置
TWI377452B (en) Substrate processing method and resist surface processing apparatus
JP4748683B2 (ja) 液処理装置
JP3573445B2 (ja) 現像装置及び洗浄装置
JP2008277480A (ja) 基板搬送処理方法及び基板搬送処理装置
TW396490B (en) Wafer processor
JP2004179383A (ja) 基板処理装置及び基板処理方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees